Blind Vias PCB & HDI PCB

Blind Vias PCB & HDI PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply Blind Vias PCB & HDI PCB to computer server, mobile phone and digital camera products.HUIHE CIRCUITS is China HDI PCB Factory, Our blind buried via PCB has passed ISO9001/ISO13485/IATF16949/UL/RoHS/REACH certification.

HDI Printed Circuit Boards & Blind Buried Via PCB List

10 Layer ENIG Blind Vias PCB

12 Layer ENIG PCB

14 Layer Blind Buried Via PCB

4 Layer ENIG Blind Buried Via PCB

6 Layer ENIG Blind Vias PCB

6 Layer HASL Blind Buried Via PCB

8 Layer ENIG Blind Buried Via printed circuit board manufacturers

8 Layer ENIG Blind Buried Via PCB

Are PCBs With Blind And Buried Vias Called HDI PCB?

HDI circuit boards are high density interconnect PCB. The high density PCB that are plated with blind holes and then laminated are all HDI boards, which are divided into first-order, second-order, third-order, fourth-order, and fifth-order HDI. Simple buried vias are not necessarily HDI. .

Hhcircuits Blind Vias PCB & HDI Custom Circuit Board Maker Capabilities

Hhcircuits is a leading provider of advanced blind vias PCB and HDI PCB manufacturing capabilities, setting the standard for exacting precision and cutting-edge technology. Our state-of-the-art facilities in the U.S. cater to varied requirements, from low-volume/high-mix PCBs with quick-turn production to high-tech solutions for aerospace, defense, medical, and commercial applications.

Our advanced capabilities include:

1. Laser Drilled Microvias: We employ advanced laser drilling techniques for microvias, ensuring precision and reliability.

2. Sequential Lamination: Our expertise extends to sequential lamination processes, enabling the creation of intricate multilayer PCBs with blind and buried vias.

3. Stacked Microvias: With expertise in stacking microvias, we support the production of high-density interconnect (HDI) PCBs for complex applications.

4. Blind & Buried Vias: We specialize in creating blind and buried vias, allowing for the dense packing of components and enhanced design flexibility.

5. Via-in-Pad: Hhcircuits provides solutions for via-in-pad technology, catering to high-end applications with stringent performance requirements.

6. Laser Direct Imaging: Utilizing cutting-edge laser direct imaging technology, we ensure precise, high-resolution patterning for intricate PCB designs.

7. Advanced PCB Materials: We offer a wide range of advanced materials for HDI PCB fabrication, sourced from top manufacturers including Isola, Nelco, Arlon, Rogers, and Taconic. Our laminate options boast advanced properties such as high thermal reliability, ultra-low loss, high-speed digital capabilities, halogen-free composition, RoHS compliance, and lead-free high Tg.

These extensive capabilities position Hhcircuits as a trusted partner for the most challenging PCB manufacturing needs, with a focus on delivering the highest quality, reliability, and performance. Our commitment to utilizing the latest technologies and superior materials ensures that customers receive PCB solutions that meet the rigorous demands of their applications, from medical devices to cutting-edge aerospace systems.

HDI Printed Circuit Boards HDI PCBs Applications

Hhcircuits is a prominent provider of advanced blind vias PCB and HDI PCB manufacturing capabilities, renowned for exacting precision and cutting-edge technology. Our state-of-the-art U.S. facilities accommodate diverse requirements, serving low-volume/high-mix PCBs with quick-turn production and offering high-tech solutions for aerospace, defense, medical, and commercial applications.

We specialize in a range of advanced capabilities, including laser drilled microvias for precise and reliable microvia creation, sequential lamination processes for intricate multilayer PCBs, and stacked microvias to support the production of high-density interconnect (HDI) PCBs. Additionally, we excel in creating blind and buried vias, offering solutions for via-in-pad technology, and employing cutting-edge laser direct imaging for high-resolution patterning in intricate PCB designs.

Moreover, Hhcircuits provides a wide array of advanced materials for HDI PCB fabrication sourced from top manufacturers, delivering properties such as high thermal reliability, ultra-low loss, high-speed digital capabilities, and RoHS compliance.

These extensive capabilities position Hhcircuits as a trusted partner for the most challenging PCB manufacturing needs, ensuring the highest quality, reliability, and performance for diverse applications, from medical devices to high-end aerospace systems. HDI PCBs find applications in various industries, including consumer electronics, automotive, aerospace, and particularly the medical sector, where small packages with high transmission rates are crucial. HDI PCBs are vital for medical devices, emergency room monitors, CT scans, and other medical equipment, facilitating high-speed signal transmission in compact designs.

At Hhcircuits, we are committed to assisting industries in leveraging the full potential of high-density interconnect PCBs to enhance their electronic products, offering tailored solutions to meet the specific requirements of each application.

Through Hole Circuit Board

Plating Through hole, or PTH for short, is the most common one. You only need to pick up the PCB and face the light, and the hole that can see the bright light is the "through hole". This is also the simplest type of hole, because when making it, you only need to use a drill or a laser to directly drill the through hole PCB. The cost is relatively cheap, but sometimes it will use more PCB space.

Blind Vias Hole

Blind via in PCB connects the outermost circuit of the PCB with the adjacent inner layer with electroplated holes. Because the opposite side cannot be seen, it is called "blind through". This manufacturing method requires special attention to the depth of the drilling (Z axis) to be just right; it is also possible to drill holes in the circuit layers that need to be connected in the individual circuit layers in advance, and then glue them together.

Buried Vias PCB

Buried hole, the connection of any circuit layer inside the PCB but not conducting to the outer layer. This process cannot be achieved by drilling after bonding. It must be drilled on the individual circuit layers. After the inner layer is partially bonded, it must be electroplated before it can be fully bonded. Compared with the original "through hole" and "Blind holes" take more time, so the price is the most expensive. This process is usually only used for high density interconnect PCB to increase the usable space of different types of PCB layers.