PROFESSOR

Education

• Ph.D. in Microsystems and Microelectronics, Microelectronic Systems Laboratory (Prof. Yusuf Leblebici), EPFL, Lausanne, Switzerland (2018)

• M.S. in Electrical and Electronics Engineering, Integrated Systems Laboratory (Prof. Giovanni De Micheli), EPFL, Lausanne, Switzerland (2015)

• B.S. in Electrical and Electronics Engineering, EPFL, Lausanne, Switzerland (2013)

Past Experiences

• DGIST, Daegu, South Korea, Associate Professor (Mar. 2025 - Present)

• DGIST, Daegu, South Korea, Assistant Professor (Jan. 2022 - Feb. 2025)

• IBM Research Zurich Laboratory, Visiting Professor (Dec. 2022 - Feb. 2023, Aug. 2023 - Sept. 2023)

• Samsung Research, 6G Research Team, Advanced Communications Research Center, Seoul, South Korea, Staff Engineer (Nov. 2020 - Jan. 2022)

• KAIST, Nanoscale Advanced Integrated Systems Laboratory (Prof. Hyeonmin Bae), Daejeon, South Korea, Postdoctoral Fellow (Sept. 2018 - Oct. 2020)

• IBM Research, High-Speed Interconnect Technology Group (Dr. Thomas Toifl), Zurich, Switzerland, Contractor (Sept. 2016 - Jul. 2018)

Academic Activities

• Organizing Committee (Publicity Chair), ICCE-Asia 2025 

• Organizing Committee (Publication Chair), A-SSCC 2025

• Technical Program Committee (TPC) (Data Converters subcommittee), A-SSCC (2025~)

• Technical Program Committee (TPC) (Wireline subcommittee), CICC (2026~)

• 대한전자공학회 협동이사

• Senior Member, IEEE

• Technical Reviewer

  • IEEE Journal of Solid-State Circuits (JSSC)

  • IEEE Transactions on Circuits and Systems I: Regular Papers (TCAS-I)

  • IEEE Transactions on Circuits and Systems II: Express Briefs (TCAS-II)

  • IEEE Transactions on Microwave Theory and Techniques (TMTT)

  • IEEE Transactions on Very Large Scale Integration Systems (TVLSI)

  • IEEE Open Journal of the Solid-State Circuits Society (OJ-SSCS)

  • IEEE Open Journal of Circuits and Systems (OJCAS)

Talks & Seminars

• "Equalization Basics," [Lecture], Samsung Electronics DS Division: High-Speed Interface Basic Program for employees, 28. Mar. 2025.

• "Recent and future trends in ultra high-speed wireline transceivers," [Lecture], 성균관대학교, 12. Mar. 2025.

• "Digital signal processing for high-speed DAC/ADC-based SerDes," [Lecture], RF/Analog Circuits Workshop (대한전자공학회), 27. Sept. 2024.

• "Digital signal processing for high-speed DAC/ADC-based SerDes," [Lecture], Samsung Electronics Global Technology Conference (GTC), 20. Sept. 2024.

• "Recent advances in ultra-high-speed SerDes: ADC-DSP-based RX," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 9. July. 2024.

• "Equalization Basics," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 1. July. 2024.

• "Equalization Basics," [Lecture], Samsung Electronics DS Division: High-Speed Interface Basic Program for employees, Jan., Feb., Mar. 2024.

• "ADC-DSP/DMT/OFDM Technologies for Next-Generation Data Center Interconnects," [Lecture], Hyper-converged Services and iNfrastructures (HSN), 25. Jan. 2024.

• "ADC/DSP-based Receiver for Ultra-High-Speed SerDes and Its Real-Time Hardware Emulation Platform," [Lecture], Autumn  Annual Conference of IEIE (대한전자공학회), 24. Nov. 2023.

• "Equalization, architecture, and circuit design for high-speed serial link receivers," [Tutorial], 최신 반도체 집적회로 설계 기술 Workshop,  22. Nov. 2023.

• "Recent advances in ultra-high-speed SerDes: ADC-DSP-based RX," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 7. Nov. 2023.

• "Discrete multitone modulation for multi-lane >200Gb/s/lane wireline interfaces," [Seminar], Korea Electronics Technology Institute (KETI, 한국전자기술연구원), 19. October. 2023.

• "Recent trends in high-speed SerDes design and architecture," [Seminar], LX Semicon (Seoul campus), 18. October. 2023.

• "Recent trends in high-speed SerDes design and architecture," [Seminar], Samsung Electronics America, 27. September. 2023.

• "Modeling and design of ultra-wideband baseband OFDM digital front-end and modem," [Seminar], Electronics and Telecommunications Research Institute (ETRI), 25. July. 2023.

• "Recent advances in ultra-high-speed SerDes: ADC-DSP-based RX," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 3. May. 2023.

• "SerDes design trend, challenges and opportunities for high-bandwidth interconnects," [Seminar], Sabanci University, 4. Jan. 2023.

• "Recent advances in ultra high-speed SerDes for wireline communications," [Seminar], The Institute of Semiconductor Engineers (반도체공학회 종합학술대회), 7. Dec. 2022.

• "Bandwidth efficient modulation for high-speed wireline dense interconnects," [Lecture], Autumn  Annual Conference of IEIE (대한전자공학회), 25. Nov. 2022.

• "SerDes design trend, challenges, and opportunities for data center interconnects," [Seminar], Samsung Advanced Institute of Technology (SAIT), 27. Oct. 2022.

• "Recent advances in ultra-high-speed SerDes: ADC-DSP-based RX," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 21. Oct. 2022.

• "Bandwidth efficient modulation for ultra-high-speed wireline dense interconnects," [Tutorial], International SoC Design Conference (ISOCC) 2022, 19. Oct. 2022.

• "High-speed link system-level modeling," [Lecture], Samsung Electronics DS Division: High-Speed Interface Expert Program for employees, 12. Oct. 2022.

• "Bandwidth-efficient modulation for ultra-high-speed wireline dense interconnects," [Seminar], IBM Research, 13. Sept. 2022.

• "Multi-tone modulation for ultra high-speed ADC-based SerDes," [Workshop], The Institute of Semiconductor Engineers (반도체공학회), 29. July 2022.

• "Bandwidth-efficient modulation for >200Gb/s Wireline Transceivers," [Seminar], Korea University, 23. June 2022.

• "Bandwidth-efficient modulation and its SerDes design considerations for 200Gb/s/lane and beyond," [Seminar], Korea Advanced Institute of Science and Technology (KAIST), 17. May 2022.

• "Equalization, architecture, and circuit design for high-speed serial link receivers," [Seminar], Samsung Electronics Device Solutions: Memory Business, 4. May 2022.

• "Equalization, architecture, and circuit design for high-speed serial link receivers," [Tutorial], IEEE Custom Integrated Circuits Conference (CICC) 2022, 24. Apr. 2022.

• "Ultra-high-bandwidth chip-to-chip communications for high-performance computing," [Seminar], Korea Institute of Science and Technology Information (KISTI), 25. Mar. 2022.

• "200 Gb/s: Beyond PAM4," [Forum], IEEE International Solid-State Circuits Conference (ISSCC) 2022, 27. Feb. 2022.

• "Overcoming bandwidth limitation with multi-tone modulation for next-generation high-speed interconnects," [Seminar], the University of Utah, 21. Feb. 2020.