MEMBER

Xinyi Li

M.S. Student, 

School of Electronic Science and Engineering,

Nanjing University, China 

(Last update: Sep. 2025)

Contact Information

• Address : #308, Science Building II, POSTECH, Pohang, Korea

• Email : xinyili24[at]postech.ac.kr 

• Office : +82-(0)54-279-5587

Educational Backgrounds

• [2023/09~Present] M.S. Candidate in Integrated Circuit Engineering, Nanjing University, Nanjing, China

• [2019/09~2023/06] B.S. in Telecommunications Engineering, Nanjing University, Nanjing, China 

Professional Experiences

• [2024/09~2025/02] Visiting Scholar, Dept. of Electrical Engineering, POSTECH, Pohang, Korea 

Research Interests

• Network-on-Chip (NoC) design

• Thermal management in NoC

• Mapping algorithm optimization

• HW/SW Co-design

Publications (with EPIC LAB after 2025/09)

• International Journal Papers

  1. [Accepted] Xinyi Li+, Eunbin Park+, Myeongjun Lee, Wenjie Fan, Yuxiang Fu, Li Li*, and Youngjoo Lee*, "NMIX: NoC-aware mixed precision quantization for energy-efficient ML accelerator," IEEE Transactions on Circuits and Systems II: Express Briefs.

  2. M. Guo, T. Cheng, X. Li, L. Li and Y. Fu*, "A Nearest-Neighbor-Based Thermal Sensor Allocation and Temperature Reconstruction Method for 3-D NoC-Based Multicore Systems," in IEEE Sensors Journal, vol. 22, no. 24, pp. 24186-24196, 15 Dec.15, 2022. 

• International Conference Proceedings

  1. Tong Cheng, Zirui Xu, Xinyi Li, Yuxiang Fu*, "Compact Interleaved Thermal Control for Improving Throughput and Reliability of Networks-on-Chip", 2025 IEEE/ACM Asia and South Pacific Design Automation Conference (ASP-DAC 2025).

  2. Xinyi Li, Wenjie Fan, Heng Zhang, Jinlun Ji, Tong Cheng, Shiping Li, Li Li, and Yuxiangfu Fu*. 2024. TTNNM: Thermal- and Traffic-Aware Neural Network Mapping on 3D-NoC-based Accelerator. In Proceedings of the Great Lakes Symposium on VLSI 2024 (GLSVLSI '24).

  3. Y. Xue, J. JI, X. Li et al., "AOME: Autonomous Optimal Mapping Exploration Using Reinforcement Learning for NoC-based Accelerators Running Neural Networks," 2022 IEEE 40th International Conference on Computer Design (ICCD), Olympic Valley, CA, USA, 2022, pp. 364-367