(Last update: Aug. 2025)
Contact Information
Current Affiliation: University of Michigan, Ann Arbor
Email : mjyun[at]umich.edu
Educational Backgrounds
[2025/09~Present] Ph.D. Student in Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA
[2023/09~2025/08] M.S. in Electrical Engineering, POSTECH, Pohang, Korea
[2019/03~2023/08] B.S. in Electrical Engineering, POSTECH, Pohang, Korea
Professional Experiences
[2025/09~Present] Research Assistant, Dept. Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI, USA
[2025/01~2025/06] Visiting Research, Dept. Electrical Engineering and Computer Science, Yale University, New Haven, CT, USA
[2021/01~2025/08] Research Assistant, Dept. Electrical Engineering, POSTECH, Pohang, Korea
Research Interests
Intelligent Mobile System-on-Chip
HW/SW Co-design
ASIC/FPGA Implementation
Deep Learning
Publications (with EPIC LAB)
International Conference Proceedings
Myeongji Yun, Jung Gyu Min, Sein Oh, Jiwoung Choi, Minkyu Je, Jang-Sik Lee, and Youngjoo Lee*, "Cost-efficient processing-in-memory architecture with training-free and universal error compensation," ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED), Reykjavik, Iceland, Aug. 2025. (Best Paper Award Candidate)
Dongyun Kam, Myeongji Yun, Sunwoo Yoo, Seungwoo Hong, Zhengya Zhang, and Youngjoo Lee*, "Panacea: Novel DNN accelerator using accuracy-preserving asymmetric quantization and energy-saving bit-slice sparsity," IEEE International Symposium on High-Performance Computer Architecture (HPCA), Las Vegas, NV, USA, Mar. 2025.
Myeongji Yun, Seungwoo Hong, Sunwoo Yoo, Sungmin Park, Junho Kim, Youngjoo Lee*, "Lightweight end-to-end stress recognition using binarized CNN-LSTM models," IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS), Incheon, Korea, June 2022.
Awards and Honors
Best Paper Award Candidate, ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED), 2025
Bronze Prize (Circuit Design Section), Samsung Humantech Paper Awards, 2025