Advanced Semiconductor Packaging and Metallization Lab 

Microelectronic and 3D IC packaging technologies.

Low-temperature Cu–Cu direct bonding and Cu/oxide hybrid bonding.

Electrodeposition of low-resistance, high-strength nanotwinned Cu for advanced electronic packaging.

Reliability of Cu joints: electromigration, thermal cycling, and high-temperature storage.

Electromigration and thermomigration in flip-chip and microbump interconnects.

Metallurgical reactions in solder joints.

Fatigue, fracture, creep, stress–strain analysis, and mechanical characterization of materials.

Thermal stress analysis in metal hydride storage vessels.

Fabrication of high-efficiency perovskite solar cells.