1. Y.-Q. Lin, Y.-W. Hung, D.-P. Tran, C. Chen, Effect of residual nanotwin on electromigration in copper lines with bamboo-like structures, Journal of Materials Research and Technology 37, 921-928, 2025. (SCI, Q1, IF: 6.6).
2. K.-P. Lee, H.-C. Chen, D.-P. Tran, B.-Y. Chen, C Chen, Direction-Dependent Mechanical Strength of Nanostructure-Tuned Copper, Materials Science and Engineering: A, 148666, 2025. (SCI, Q1, IF: 7.0).
3. D.-P. Tran, Y.-T. Xiao, M.-P. La, S.-C. Yang, C. Chen, Regulating Intermetallic Compound Growth and Bridging in SnAg Solder under Electromigration Stress through Ni addition and Sn Crystallographic Orientation-Grain Size, Journal of Advanced Joining Processes, 100320 2025. (SCI, Q1, IF: 4.0).
4. K.-P. Lee, M.-H. Lu, D.-P. Tran, W.-J. Chen, D.-J. Yao, C. Chen, Optimization of Tensile Strength of Nanotwinned Cu-Ni Foils via Complex System Response Methodology, Materials Science and Engineering: A, 148581 2025. (SCI, Q1, IF: 7.0).
5. W.-H. Lu, D.-P Tran, H.-E. Lin, G.-Y. Shen, B.-Y. Chen, K.-P. Lee, C.-C. Tsai, Y.-Q. Lin, K.N Tu, C. Chen, Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging, Journal of Alloys and Compounds 1024, 180265 2025. (SCI, Q1, IF: 6.3).
6. B.-Y. Chen, D.-P. Tran, K.-P. Lee, Y.-H. Chen, C. Chen, Temperature-dependent mechanical properties and fracture behaviors of copper foils with different microstructures, Materials Characterization, 115051, 2025. (SCI, Q1, IF: 5.5).
7. D.-P. Tran, B.-Y. Chen, M.-P. La, K.-P. Lee, C. Chen, Breaking Strength-Conductivity Trade-off in Nanotwinned Cu by Fe Co-electroplating and its Thermal Stability Characterization, Materials Characterization, 114925, 2025. (SCI, Q1, IF: 5.5).
8. J.-Y. Huang, D.-P. Tran, K.-P. Lee, Y.-Q. Lin, E. Kuo, T.-C. Chen, Y.-T. Chen, S. Chung, C. Chen, Fabrication and properties of high thermal stability nanocrystalline Cu for low temperature Cu–Cu bonding. Journal of Materials Research and Technology, 7120-7129, 2025. (SCI, Q1, IF: 6.6).
9. Y.-A. Chen, J.-J. Ong, D.-P. Tran, W.-L. Chiu, H.-H. Chang, W.-Y. Hsu, C. Chen, Efficient Cu/SiO2 hybrid bonding through alkaline surface modification for 3D IC integration, Applied Surface Science, 162534, 2025. (SCI, Q1, IF: 6.7).
10. Y.-W. Hung, D.-P. Tran, Y.-Q. Lin, C. Chen, Effects of additives, cobalt ions, and electrolyte temperature on mechanical properties of electroplated nanotwinned Cu (Co) foils, Materials Characterization, 114780, 2025. (SCI, Q1, IF: 5.5).
11. K.-P. Lee, D.-P. Tran, B.-Y. Chen, Y.-Q. Lin, J.-Y. Huang, P.-C. Chen, C. Chen, Twin Boundary and Grain Boundary Engineering to Enhance Mechanical Strength of Nanotwinned Cu, Materials Science and Engineering: A, 147719, 2025. (SCI, Q1, IF: 7.0).
1. P.-S. He, D.-P. Tran, K.-C. Shie, C. Chen, Design of surface tomography for fabricating nanotwinned Copper/polyimide hybrid joints using in-situ heating atomic force microscopy, Applied Surface Science, 162023, 2024. (SCI, Q1, IF: 6.7).
2. J.-J. Ong, D.-P. Tran, H.-J. Huang, W.-L. Chiu, S.-C. Yang, W.-W. Wu, H.-H. Chiang, C. Chen, Evolutions of Interfacial Microstructures in Cu/SiO2 Hybrid Joints during Temperature Cycling Tests, Journal of Materials Research and Technology, 33, 9811-9819, 2024 (SCI, Q1, IF: 6.4).
3. R.-J. Lee, P.-S. He, D.-P. Tran, W.-L. Chiu, H.-H. Chang, C.-C. Lee, C. Chen, Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation, Applied Surface Science, 684, 161832, 2024. (SCI, Q1, IF: 6.7).
4. K.-J. Chen, C.-C. Hsieh, D.-P. Tran, C. Chen, Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films, Journal of Materials Research and Technology 33, 2530-2537, 2024. (SCI, Q1, IF: 6.4).
5. Y.-W. Hung, D.-P. Tran, Y.-Q. Lin, C. Chen, Effect of heterogeneous microstructures on mechanical properties of thin gradient nanotwinned copper foils, Surface and Coatings Technology, 494, 131381, 2024. (SCI, Q1, IF: 5.3).
6. D.-P. Tran, M.-P. La, M. V. Lototskyy, Stress Analysis of Cyclic Sorption-Desorption in Metal Hydride Vessels, Journal of Energy Storage, 98, 112868, 2024. (SCI, Q1, IF: 8.9).
7. K.-P. Lee, D.-P. Tran, B.-Y. Chen, Y.-Q. Lin, C.-N. Li, J.-Y. Huang, H.-C. Chen, R.-Y. Chen, C. Chen, Enhancement of Anti-oxidation and Tensile Strength of Nanotwinned Cu Foils by Preferential Ni Electrodeposition, Electrochimica Acta, 500, 144769, 2024 (SCI, Q1, IF: 5.5).
8. H.-E. Lin, D.-P. Tran, W.-L. Chiu, H.-H. Chang, C. Chen, Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding, Applied Surface Science, 672, 160784, 2024. (SCI, Q1, IF: 6.7).
9. H.-E. Lin, D.-P. Tran, W.-L. Chiu, H.-H. Chang, C. Chen, In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures, Applied Surface Science, 662, 160103, 2024. (SCI, Q1, IF: 6.7).
10. H.-E. Lin, D.-P. Tran, G.-H. Lin, H.-J. Chuang, C. Chen, Effects of residual stress and microstructure on extremely anisotropic grain growth in nanotwinned Cu films, Materials Characterization, 211, 113891, 2024. (SCI, Q1, IF: 4.7).
11. D.-P. Tran, Y.-T. Liu, C. Chen, Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints, Materials, 17(9), 2004, 2024. (SCI, Q2, IF: 3.4).
1. H.-H Tseng, M.-C Lan, W.-Y Hsu, J.-J Ong, D.-P Tran, C. Chen, Electroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding, Journal of Materials Research and Technology, 27, 7957-7963, 2023. (SCI, Q1, IF: 6.4).
2. W.-Y. Hsu, D.-P. Tran, Y.-J. Li, C. Chen, High toughness of nanotwinned copper lines after annealing, Materials Science and Engineering: A, 887, 145749, 2023. (SCI, Q1, IF: 6.4).
3. M.-P. La, J.-W. Shiu, K.-W. Huang, D.-P. Tran, T.-F. Way, S.-P. Rwei, Synthesis and growth mechanism of starfish-like anatase TiO2 nanocrystal with outstanding antibacterial property and super-hydrophobicity, Inorganic Chemistry Communications, 156, 111180, 2023. (SCI, Q1, IF: 3.8).
4. S.-C. Yang, D.-P. Tran, C. Chen, Recrystallization and Grain Growth in Cu-Cu Joints under Electromigration at Low Temperatures, Materials 16 (17), 5822, 2023. (SCI, Q2, IF: 3.4).
5. H.-H. Tseng, H.-C. Liu, M.-H. Yu, J.-J. Ong, D.-P. Tran, C. Chen, Epitaxial Growth of (111) Nanotwinned Ag on (111) Nanotwinned Cu Films for Low-Temperature Cu–Cu Bonding, Crystal Growth & Design, 23, 8, 5519–5527, 2023. (SCI, Q1, IF: 3.8).
6. M.-H. Yu, J.-J. Ong, D.-P. Tran, W.-L. Chiu, W.-Y. Hsu, H.-E. Lin, Y.-A. Chen, H.-H. Tseng, G.-Y. Shen, S.-C. Yang, C. Chen, Low Temperature Cu/SiO2 Hybrid Bonding via <111>-Oriented Nanotwinned Cu with Ar Plasma Surface Modification, Applied Surface Science, 636, 157854, 2023. (SCI, Q1, IF: 6.7).
7. J.-J. Ong, D.-P. Tran, W.-L. Chiu, S.-C. Yang, M.-H. Yu, F.-C. Shen, H.-H. Chang, O.-H. Lee, C.-W. Chiang, C.-H.Wang, W.-W. Wu, C. Chen, Potassium Hydroxide Surface Modification for Low Temperature Cu/SiO2 Hybrid Bonding, Surfaces and Interfaces, 40, 103076, 2023. (SCI, Q1, IF: 6.2).
8. C. Singh, H. Krishnaswamy, S.P. Pardhasaradhi, F.-C. Chen, D.-P. Tran, C. Chen, J. Jain, Influence of additives induced microstructural parameters on mechanical behavior of (111)-oriented nanotwinned microcrystalline copper. Materials Science and Engineering: A, 877, 145150, 2023. (SCI, Q1, IF: 6.4).
9. P.-S. He, D.-P. Tran, T.-Y. Kuo, W.-Y. Hsu, H.-E. Lin, K.-C. Shie, C. Chen, High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation. Nanomaterials, 13 (9), 157, 2023. (SCI, Q1, IF: 5.4).
10. Y.-R. Huang, D.-P. Tran, P.-N Hsu, S.-C. Yang, A.M. Gusak, K.N. Tu, C. Chen, To Suppress Thermomigration of Cu-Sn Intermetallic Compounds in Flip-chip Solder Joints. Journal of Materials Research and Technology, 24, 7910-7924, 2023. (SCI, Q1, IF: 6.4).
11. S.-C. Yang, D.-P. Tran, J.-J. Ong, W.-L. Chiu, H.-H. Chang, C. Chen, Periodic Reverse Electrodeposition of (111)-oriented Nanotwinned Cu in Small Damascene SiO2 Vias. Journal of Electroanalytical Chemistry, 935, 117328, 2023. (SCI, Q1, IF: 4.5).
12. J.-Y. Lai, D.-P. Tran, S.-C. Yang, I.-H. Tseng, K.-C. Shie, J. Leu, C. Chen, Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing. Nanomaterials, 13 (4), 709, 2023. (SCI, Q1, IF: 5.4).
1. D.-P. Tran, T.-W. Lin, K.-C. Shie, C. Chen, Non-destructive micro analysis of electromigration failures in solder microbumps using 3D X-ray computed tomography. Materials Characterization, 194, 112404, 2022. (SCI, Q1, IF: 4.7).
2. J.-J. Ong, D.-P. Tran, Y.-Y. Lin, F.-C. Shen, S.-C. Yang, K.-P. Lee, G.-Y. Shen, M.-H. Yu, P.-N. Hsu, N.-T. Tsou, W.-W. Wu, C. Chen, Single crystal- like Cu joints with high strength and resistance to fatigue failures. Materials Science and Engineering: A , 857, 144051, 2022. (SCI, Q1, IF: 6.4).
3. P.-N. Hsu, D.-L. Lee, D.-P. Tran, K.-C. Shie, N.-T. Tsou, C. Chen, Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints. Materials, 15 (20), 7115, 2022. (SCI, Q2, IF: 3.4).
4. J.-J. Ong, D.-P. Tran, M.-C. Lan, K.-C. Shie, P.-N. Hsu, N.-T. Tsou, C. Chen, Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints. Scientific Reports, 12 (1), 1-10, 2022. (SCI, Q2, IF: 4.6).
5. P.-N. Hsu, K.-C. Shie, D.-P. Tran, N.-T. Tsou, C. Chen, Failures of Cu-Cu Joints under Temperature Cycling Tests. Failures of Cu-Cu Joints under Temperature Cycling Tests, Materials, 15 (14), 4944, 2022. (SCI, Q2, IF: 3.4).
6. H.-C. Liu, S.-C. Yang, J.-J. Ong, D.-P. Tran, A. M. Gusak, K. N. Tu, C. Chen, Evolution of interfacial voids in Cu-to-Cu joints. Materials Characterization, 190, 112085, 2022. (SCI, Q1, IF: 4.7).
7. Y.-H. Kuo, D.-P. Tran, J.-J. Ong, K. N. Tu, C. Chen, Hybrid Cu-to-Cu bonding with nano-twinned Cu and non-conductive paste. Journal of Materials Research and Technology, 18, 859-871, 2022. (SCI, Q1, IF: 6.4).
8. C.-Y. Fang, D.-P. Tran, H.-C. Liu, J.-J. Ong, Y.-Q. Lin, W.-Y. Hsu, C. Chen, Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils. Journal of The Electrochemical Society, 169, 042503, 2022. (SCI, Q1, IF: 3.9).
9. J.-J. Ong, W.-L. Chiu, O.-H. Lee, C.-W. Chiang, H.-H. Chang, C.-H. Wang, K.-C. Shie, S.-C. Yang, D.-P. Tran, K.-N. Tu, C. Chen, Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials, 15(5), 1888, 2022. (SCI, Q2, IF: 3.4).
10. K.-P. Lee, D.-P. Tran, F.-C. Chen, W.-Y. Hsu, Y.-Q. Lin, H.-C. Liu, C. Chen, Mechanical Strengthening of Nanotwinned Cu Films with Ag Solid Solution. Materials Letters, 313, 131775, 2022. (SCI, Q2, IF: 3.0).
11. P.-F. Lin, D.-P. Tran, H.-C. Liu, Y.-Y. Li, C. Chen, Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films. Materials, 15(3), 937, 2022. (SCI, Q2, IF: 3.4).
1. I-H. Tseng, P.-N. Hsu, W.-Y. Hsu, D.-P. Tran, B. T.-H. Lin, C.-C. Chang, K.N. Tu, C. Chen, Effect of oxidation on electromigration in 2-μm Cu redistribution lines capped with polyimide. Results in Physics, 31, 105048, 2021. (SCI, Q1, IF: 5.3).
2. D.-P. Tran, H.-H. Li, I.-H. Tseng, C. Chen, Enhancement of electromigration lifetime of copper lines by eliminating nanoscale grains in highly <111>-oriented nanotwinned structures. Journal of Materials Research and Technology, 15, 6690-6699, 2021. (SCI, Q1, IF: 6.4).
3. J.-J. Ong, D.-P. Tran, S.-C.Yang, K.-C. Shie, C. Chen, Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-oriented Nanotwinned Cu. Metals, 11(11), 1864, 2021. (SCI, Q2, IF: 2.9).
4. Y.-W. Hung, D.-P. Tran, C. Chen, Effect of Cu Ion Concentration on Microstructures and Mechanical Properties of Nanotwinned Cu Foils Fabricated by Rotary Electroplating. Nanomaterials, Vol. 11 (2021) 2135. (SCI, Q1, IF: 5.4).
5. C.-C. Mo, D.-P. Tran, J.-Y. Juang, C.Chen, Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling. Metals, Vol. 11 (2021) 1065, 2021. (SCI, Q2, IF: 2.9).
6. K.-C. Shie, P.-N. Hsu, Y.-J. Li, D.-P. Tran, C. Chen, Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling. Materials, 14(19), 5522, 2021. (SCI, Q2, IF: 3.4).
7. D.-P. Tran, K.-J. Chen, K. N. Tu, C. Chen, Y.-T. Chen, S. Chung, Electrodeposition of Slanted Nanotwinned Cu Foils with High Strength and Ductility, Electrochimica Acta, 389, 138640, 2021 (SCI, Q1, IF: 6.6).
8. H.-Y. Cheng, D.-P. Tran, K. N. Tu, C. Chen, Effect of Deposition Temperature on Mechanical Properties of Nanotwinned Cu Fabricated by Rotary Electroplating, Materials Science and Engineering: A, Vol. 811, pp. 141065, 2021 (SCI, Q1, IF: 6.4).
1. K.-C. Hsiao, M.-H. Jao, K.-Y. Tain,T.-H. Lin, D.-P. Tran, H.-C. Liao, C.-H. Hou, J.-J. Shyue, M.-C. Wu, and W.-F. Su, Acetamidinium Cation to Confer Ion Immobilization and Structure Stabilization of Organometal Halide Perovskite toward Long Life and High Efficiency p-i-n Planar Solar Cell via Air-processable Method, Solar RRL, Vol. 4, pp. 2000197-1-11, 2020 (SCI, Q1, IF:7.9).
1. D.-P. Tran, C.-K. Lin, and B.-D. To, Combined Cyclic-Static Bending Effect on the Encapsulation Properties of a Barrier Thin Film for Flexible Organic Optoelectronic Devices, Key Engineering Materials, Vol. 850, pp. 140-145, 2019 (EI, Q3, IF: 0.2).
1. D.-P. Tran, H.-I Lu, and C.-K. Lin, Conductive Characteristics of Indium Tin Oxide Thin Film on Polymeric Substrate under Long-Term Static Deformation, Coatings, Vol. 8, No. 212, pp. 1-15, 2018 (SCI, Q2, IF: 3.4).
2. H.-I Lu, D.-P. Tran, C.-K. Lin, and B.-D. To, Effects of Long-Term Static Bending Deformation on a Barrier Thin Film for Flexible Organic Optoelectronic Devices, Coatings, Vol. 8, No. 127, pp. 1-14, 2018 (SCI, Q2, IF: 3.4).
3. D.-P. Tran, C.-K. Lin, and B.-D. To, Effects of Cyclic Deformation on a Barrier Thin Film for Flexible Organic Optoelectronic Devices, Thin Solid Films, Vol. 650, pp. 20-31, 2018 (SCI, Q3, IF: 2.1).
1. D.-P. Tran, H.-I Lu, and C.-K. Lin, Effects of Cyclic Deformation on Conductive Characteristics of Indium Tin Oxide Thin Film on Polyethylene Terephthalate Substrate, Surface and Coatings Technology, Vol. 283, pp. 298–310, 2015 (SCI, Q1, IF: 5.4).