Dinh-Phuc Tran, Ph.D.
Assistant professor, Graduate Institute of Manufacturing Technology,
National Taipei University of Technology
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Dr. Dinh-Phuc Tran received his B.S. and MSc. degrees in Mechanical Engineering from Ho Chi Minh City University of Technology, Vietnam, in 2011 and 2013, respectively, and the Ph.D. degree from National Central University, Taiwan, in 2018. He worked as a postdoctoral fellow at University of the Western Cape, South Africa (2019), National Taiwan University, Taiwan (2020), and National Yang Ming Chiao Tung, Taiwan (2020-2025). In 2025, he joined the Department of Mechanical Engineering at National Taipei University of Technology as an Assistant Professor. Dr. Tran has published 60+ SCI journal articles. His current research interests include low-temperature Cu-to-Cu direct bonding, high-strength nanotwinned Cu lines and films for 3D IC integration, and the reliability of flip-chip solder joints and microbumps in semiconductor packaging, with a focus on electromigration and metallurgical reactions.
Dr. Dinh-Phuc Tran received his B.S. and MSc. degrees in Mechanical Engineering from Ho Chi Minh City University of Technology, Vietnam, in 2011 and 2013, respectively, and the Ph.D. degree from National Central University, Taiwan, in 2018. He worked as a postdoctoral fellow at University of the Western Cape, South Africa (2019), National Taiwan University, Taiwan (2020), and National Yang Ming Chiao Tung, Taiwan (2020-2025). In 2025, he joined the Department of Mechanical Engineering at National Taipei University of Technology as an Assistant Professor. Dr. Tran has published 60+ SCI journal articles. His current research interests include low-temperature Cu-to-Cu direct bonding, high-strength nanotwinned Cu lines and films for 3D IC integration, and the reliability of flip-chip solder joints and microbumps in semiconductor packaging, with a focus on electromigration and metallurgical reactions.
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