Course Launch

CREST, BITS Pilani, together with the International Microelectronics Assembly and Packaging Society (IMAPS) and IDSPS, will launch the Professional Development Courses (PDCs).

Introduction to Semiconductor Legacy Packaging (ISLP) will be offered virtually tentatively beginning from Saturday, 10 January 2026. The eight Professional Development Courses (PDCs) will be:

• ~ 2 hours in duration each.

• Delivered live in a virtual format (no recordings or replays).

• Comprising four legacy packaging courses: Wirebond, Flip Chip, Polymers, and Introduction to Packaging.

• Comprising four advanced packaging courses: mm-wave, Advanced Fan-Out WLP, Reliability in Advanced Packaging, and Substrates/Interposers.

• Scheduled as one course per day following the established Saturday–Sunday rotation.