Publications

Journal Articles & Book Chapters

Google Scholar · Verified September 11, 2026

Refereed Journal Articles (23)

2026 (6)

1. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “A Digital Twin Framework With Deep Feature Extraction and Gaussian Process for Multi-Objective Optimization in Semiconductor Manufacturing.” IEEE Transactions on Automation Science and Engineering, vol. 23, pp. 1928–1949, 2026.

2. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “Adaptive Reinforcement Learning-Driven Digital Twin for Multiobjective and Multimachine Process Optimization.” IEEE Transactions on Artificial Intelligence, vol. 7, no. 8, pp. 4291–4310, 2026.

3. C.-Y. Lin, S. H. Emon, and T.-L. Tseng. “GeMeR-TS: Generative Memory-Based Retrieval and Mixture-of-Experts for Cross-Domain Time-Series Forecasting.” IEEE Transactions on Big Data, vol. 12, no. 4, pp. 1401–1419, 2026.

4. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “Two-Level Pareto-Based Hierarchical Reinforcement Learning for Dynamic Multi-Objective Scheduling in Semiconductor Fabs.” IEEE Transactions on Semiconductor Manufacturing, vol. 39, no. 3, pp. 590–613, 2026.

5. C.-Y. Lin, A. d. O. Barros, S. H. Emon, and T.-L. Tseng. “Feasibility-Aware Inverse Virtual Metrology for Top-K Recipe Recommendation in Semiconductor Process Correction.” IEEE Transactions on Automation Science and Engineering, vol. 23, pp. 13445–13468, 2026.

6. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “Virtual Metrology via Intervention-Anchored Hidden-State Decomposition for Post-Maintenance Recovery and Recipe Migration.” IEEE Transactions on Semiconductor Manufacturing, vol. 39, no. 3, pp. 572–589, 2026.

2025 (8)

1. C.-Y. Lin, T.-H. Tsai, and T.-L. Tseng. “Generative AI for Intelligent Manufacturing Virtual Assistants in the Semiconductor Industry.” IEEE Robotics and Automation Letters, vol. 10, no. 4, pp. 4132–4139, 2025.

2. C.-Y. Lin, T.-L. Tseng, S. H. Emon, and T.-H. Tsai. “Large Pre-Trained Models and Few-Shot Fine-Tuning for Virtual Metrology: A Framework for Uncertainty-Driven Adaptive Process Control in Semiconductor Manufacturing.” IEEE Transactions on Automation Science and Engineering, vol. 22, pp. 15351–15370, 2025.

3. C.-Y. Lin, T.-L. Tseng, S. H. Emon, and T.-H. Tsai. “Generative AI-Driven Data Augmentation for Robust Virtual Metrology: GANs, VAEs, and Diffusion Models.” IEEE Transactions on Semiconductor Manufacturing, vol. 38, no. 3, pp. 642–658, 2025.

4. C.-Y. Lin, T.-L. Tseng, and H. Xu. “GPT-Augmented Bayesian Reinforcement Learning Framework for Multiobjective Supplier Selection.” IEEE Transactions on Engineering Management, vol. 72, pp. 3779–3804, 2025.

5. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “A Digital Twin Framework With Bayesian Optimization and Deep Learning for Semiconductor Process Control.” IEEE Access, vol. 13, pp. 50821–50837, 2025.

6. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “A Digital Twin Framework With Meta- and Transfer Learning for Scalable Multi-Machine Modeling and Optimization in Semiconductor Manufacturing.” IEEE Access, vol. 13, pp. 84380–84398, 2025.

7. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “A Multi-Machine and Multi-Modal Drift Detection (M2D2) Framework for Semiconductor Manufacturing.” Applied Sciences, vol. 15, no. 12, Art. no. 6500, 2025.

8. C.-Y. Lin, T.-L. Tseng, and T.-H. Tsai. “CLARiC: Contrastive Learning and Root-Cause Inference With Causality for Explainable Smart Manufacturing.” IEEE Access, vol. 13, pp. 161279–161298, 2025.

2023 (1)

1. Y.-M. Hsieh, C.-Y. Lin, J. Wilch, B. Vogel-Heuser, Y.-C. Lin, Y.-C. Lin, M.-H. Hung, and F.-T. Cheng. “An Intelligent Factory Automation System With Multivariate Time Series Algorithm for Chip Probing Process.” IEEE Robotics and Automation Letters, vol. 8, no. 9, pp. 5464–5471, 2023.

2022 (2)

1. C.-Y. Lin, C.-K. Ing, P.-H. Peng, Y.-M. Hsieh, and F.-T. Cheng. “Golden Path Search Algorithm for the KSA Scheme.” IEEE Transactions on Automation Science and Engineering, vol. 19, no. 3, pp. 1517–1529, 2022.

2. Y.-M. Hsieh, T.-J. Wang, C.-Y. Lin, Y.-F. Tsai, and F.-T. Cheng. “Convolutional Autoencoder and Transfer Learning for Automatic Virtual Metrology.” IEEE Robotics and Automation Letters, vol. 7, no. 3, pp. 8423–8430, 2022.

2021 (1)

1. Y.-M. Hsieh, T.-J. Wang, C.-Y. Lin, L.-H. Peng, F.-T. Cheng, and S.-Y. Shang. “Convolutional Neural Networks for Automatic Virtual Metrology.” IEEE Robotics and Automation Letters, vol. 6, no. 3, pp. 5720–5727, 2021.

2019 (2)

1. Y.-M. Hsieh, C.-Y. Lin, Y.-R. Yang, M.-H. Hung, and F.-T. Cheng. “Automatic Virtual Metrology for Carbon Fiber Manufacturing.” IEEE Robotics and Automation Letters, vol. 4, no. 3, pp. 2730–2737, 2019.

2. C.-Y. Lin, Y.-M. Hsieh, F.-T. Cheng, H.-C. Huang, and M. Adnan. “Time Series Prediction Algorithm for Intelligent Predictive Maintenance.” IEEE Robotics and Automation Letters, vol. 4, no. 3, pp. 2807–2814, 2019.

2018 (1)

1. C.-Y. Lin, Y.-M. Hsieh, F.-T. Cheng, Y.-R. Yang, and M. Adnan. “Interaction-Effect Search Algorithm for the KSA Scheme.” IEEE Robotics and Automation Letters, vol. 3, no. 4, pp. 2778–2785, 2018.

2017 (2)

1. C.-Y. Lin, F.-T. Cheng, C.-F. Chen, R.-X. Xiao, J.-W. Zheng, and Y.-S. Hsieh. “Blind-Stage Search Algorithm for the Key-Variable Search Scheme.” IEEE Robotics and Automation Letters, vol. 2, no. 4, pp. 1840–1847, 2017.

2. F.-T. Cheng, Y.-S. Hsieh, J.-W. Zheng, S.-M. Chen, R.-X. Xiao, and C.-Y. Lin. “A Scheme of High-Dimensional Key-Variable Search Algorithms for Yield Improvement.” IEEE Robotics and Automation Letters, vol. 2, no. 1, pp. 179–186, 2017.

Book Chapters — Wiley–IEEE Press

2023

1. Y.-C. Chiu, Y.-M. Hsieh, C.-Y. Lin, and F.-T. Cheng. “Intelligent Predictive Maintenance (IPM).” In Industry 4.1: Intelligent Manufacturing With Zero Defects, Wiley–IEEE Press, 2023, pp. 331–375.

2. Y.-M. Hsieh, C.-Y. Lin, and F.-T. Cheng. “Intelligent Yield Management (IYM).” In Industry 4.1: Intelligent Manufacturing With Zero Defects, Wiley–IEEE Press, 2023, pp. 377–407.

3. F.-T. Cheng, Y.-C. Chiu, Y.-M. Hsieh, H. Tieng, C.-Y. Lin, and H.-C. Huang. “Application Cases of Intelligent Manufacturing.” In Industry 4.1: Intelligent Manufacturing With Zero Defects, Wiley–IEEE Press, 2023, pp. 409–519.