Thermomechanical Finite Element Analysis Simulation of Power Semiconductor Device

This semiconductor device is a MOSFET composed of multi-parts assembly, each parts has its own CTE (Coefficient of Thermal Expansion) and other critical material properties. This project involve the study of various internal stress as it undergo to temp cycling temperature of -55°C to 150 °C.

While this project has many internal pictures to show its stress study, I opted not to show the internal design due to the confidentiality of the subject.

I will only show here the external of the overall semiconductor package and how it expand when subjected to 150°C and how it contract when subjected to -55°C.

expansion.mp4

This video showed the overall assembly expansion as it is subjected to 150 deg.C Ramp-Up from 25 deg.C. (deformation scale: 30x)

My role in the simulation involve from the creation of its 3D model reference, material selections or assignment, set-up of physics, solving, capture of stress data and generate comprehensive report.

contraction.mp4

This video showed the overall assembly contraction as it is subjected to -55 deg.C Ramp-Down from 25 deg.C. (deformation scale: 30x)

I performed many thermomechanical simulation similar to this specially for the purpose of EMC (epoxy mold compound) material characterization, Clip/Ribbon interconnect comparison, Die Tilt response, etc.

Marketing Drawing for Semiconductor Device Datasheet, SOP-8LD

I have done many marketing drawings from my previous employer Fairchild Semiconductor and with my current client Taiwan semiconductor. This sample drawing is what will appear in the product datasheet. My role in this drawing involve review of its industry package standard JEDEC/EIAJ to insure the conformity of package dimensions, review with tooling drawings, review of the actual unit measurement, and generate comprehensive comparative study.

Thermal and Thermomechanical Finite Element Analysis Simulation of Aluminum Heater Plate used for Plastic Pallet Welding

thermal.mp4

This video showed the overall thermal distribution from a source of 176 deg.C temperature from an array of heater strips across the whole Aluminum plate used for pre-melting the plastic pallet prior to welding assembly.

My role in the simulation involve from the importing of selected model reference from Solidworks, material selections or assignment, set-up of physics, solving, capture of temp data and generate comprehensive report.

My report generated in this FEA as well as the videos has provided my client a confident understanding of the heater plate design which they will present to their customer.

deformation.mp4

This video showed the overall deformation (scale:5x) of the whole Aluminum plate when subjected to thermal load of 176 deg.C used for pre-melting the plastic pallet prior to welding assembly.

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