FEA or Finite Element Analysis is a numerical method to solve engineering problems. FEA has become an integral part of design, research and development of numerous engineering systems. It is used in many industries such as Aerospace, Automotive, Electrical, Electronics, Semiconductor, Power Construction, and Healthcare implants and devices.
My experience with FEA is in Semiconductor industry which covers from the creation of the 3D-model in AutoCAD or SolidWorks, study of the problems, setting-up the Ansys or Comsol physics, search for material for validity, search for relevant published paper and FEA methodologies as needed, and generate FEA report. In my current client Taiwan Semiconductor, my FEA report is being forwarded to engineering departments, the management, and sometime to my client's customer to address customer complain.
The FEA that I performed include Static Structural, Static Thermal, Thermomechanical and Electrical Resistance. Some of the problems in the semiconductor package that I investigated in the simulation are stresses in the Die (IC) surface, cracks at solder interconnects, structural strength of clip and leadframe design, delamination area interfacing leadfame and plastic mold interface, Die top metal deformation. Other simulation I performed are related to Thermomechanical Design of Experiments, RDSon simulation (Resistance at Drain to Source at "ON" state of MOSFET device), and Thermal Resistance.
While I only mentioned four FEA physics modules as my actual work experience, I am also interested to explore other FEA physics modules/tools if requested by my client.
