I subscribe to the belief that designs right from the start of CAD (Computer Aided Design) and FEA (Finite Element Analysis) should be Purposely Functional and Relevant to its original intention.

Skills:  

1.  Finite Element Analysis using Ansys and Comsol Multiphysics.  Static Structural,  Static Thermal,  Thermomechanical, Electrical Resistance.

2.  2D detailing and 3D molding using AutoCAD , Solidworks, Autodesk Inventor, and Fusion 360.  Experienced in Geometric Dimensioning and Tolerancing (GD&T) and industry drawing standard.

3. Expertise in semiconductor packaging and design.

4. Skills in manufacturing settings in electronics and semiconductor industry. 

5.  Product concept designing and Equipment concept designing. 

6. Computer: Experienced in Photoshop, Premiere Pro, Video Pad, Sketchup, Office365.  Operating System installations and Hardware installation.

7. Mechanical designing aided with electro-pneumatics, PLC and electronic controls.

8. Can read electronics circuits and electrical wiring diagram.

Current job title:  Freelancer in the field of CAD and FEA Engineering, CAD FEA Engineer, Packaging Engineer

Career goal: To constantly acquire home based job  and make my clients happy of my services.

Taiwan Semiconductor,  based in Taipei Taiwan, https://www.taiwansemi.com/en/

Education

Master’s Degree:

· Master in Management for Executives and Managers (MMExM) at University of San Jose-Recoletos, Cebu, Philippines;  Graduated on April 2015

Bachelor’s Degree:

· Bachelor of Science in Electronics and Communications Engineering (BSECE) at  University of San Jose-Recoletos, Cebu, Philippine;  Graduated on March 2006

3-Year Technical Course:

· Industrial Electronics Technology, Xavier University – Ateneo de Cagayan, Cagayan de Oro City Philippines; Graduated on March 1995