The 6th IEEE/IFToMM International conference on
Reconfigurable Mechanisms and Robots
(ReMAR2024)
Chicago, U.S. June 24-27, 2024
The 6th IEEE/IFToMM International conference on
Reconfigurable Mechanisms and Robots
(ReMAR2024)
Chicago, U.S. June 24-27, 2024
Welcome to ReMAR 2024
Following successful completion in London (2009), Tianjin (2012), Beijing (2015), Delft (2018), and Toronto (2021), the 6th IEEE/IFToMM International conference on Reconfigurable Mechanisms and Robots (ReMAR2024) will be held in Chicago, US, on June 24‐27, 2024. We aim at a highly inspiring event by bringing together researchers from a variety of research areas pertaining to reconfigurable mechanisms and robots.
Topics of Interest Include but not limited to:
Reconfigurable Mechanisms and Robots
Planar and Spatial Deployable Mechanisms
Metamorphic Mechanisms and Robots
Kinematics and Dynamics of Reconfiguration
Cable-Driven Parallel Robots
Engineering Origami
Variable Topology Modelling
Reconfigurable Manufacturing Systems
Application of Reconfigurable Systems
Compliant Mechanisms and robots
Soft Mechanisms and robots
Morphing mechanisms and applications
Important Dates
30 January 2024 - Submission of full draft paper
04 March 2024 - Acceptance notification
22 March 2024 - Submission of final paper
Conference Committees
Honorary Chair
Jian S. Dai, Southern University of Science and Technology and King’s College London
General Chair
Dongming Gan, Purdue University
General Co-Chairs
Carl Nelson, University of Nebraska–Lincoln
Volkert van der Wijk, Delft University of Technology
Fengfeng Xi, Toronto Metropolitan University
Xilun Ding, Beihang University
Program Chairs
Mark Yim, University of Pennsylvania
Ketao Zhang, Queen Mary University of London
Guangbo Hao, University College Cork
Mark Plecnik, University of Notre Dame
Organizing Committee Chairs
Yu She, Purdue University
Jared Butler, Penn State University
Pierre Larochelle, South Dakota School of Mines and Technology
Guowu Wei, University of Salford
Awards & Sponsor Chairs
Mary Frecker, Penn State University
Gim Song Soh, Singapore University of Technology and Design
Chin-Hsing Kuo, University of Wollongong
Long Wang, Stevens Institute of Technology
Scientific Committee
Sunil K Agrawal, University of Pennsylvania
Jorge Angeles, McGill University
Shaoping Bai, Aalborg University
Darwin Caldwell, Italian Institute of Technology
Marco Ceccarelli, University of Rome Tor Vergata
Jorge Dias, Khalifa University of Science and Technology
Mary Frecker, Penn State University
Pietro Fanghella, University of Genova
Raffaele Di Gregorio, University of Ferrara
Clément Gosselin, Laval University
Jeffrey Ge, Stony Brook University
Just Herder, Deft University of Technology
Larry Howell, Brigham Young University
Manfred Husty, University of Innsbruck
Andres Kecskeméthy, University of Duisburg-Essen
Venkat N. Krovi, Clemson University
XianWen Kong, Heriot-Watt University
Pierre Larochelle, South Dakota School of Mines and Technology
Andreas Müller, Johannes Kepler University Linz
Andrew Murray, University of Dayton
J. Michael McCarthy, University of California Irvine
Vincenzo Parenti-Castelli, University of Bologna
Alba Perez-Gracia, Idaho State University
Bahram Ravani, University of California Davis
Lakmal Seneviratne, Khalifa University of Science and Technology
Haijun Su, Ohio State University
Yukio Takeda, Tokyo Institute of Technology
Federico Thomas, CSIC-UPC
Richard Voyles, Purdue University
Helge Wurdemann, University College London
Mark Yim, University of Pennsylvania
Zhong You, University of Oxford
JianWei Zhang, Universität Hamburg
Program Committee
Andres Arrieta Diaz, Purdue University
Giovanni Berselli, University of Genova
Ferdinando Cannella, Italian Institute of Technology
Carlo Canali (IT), Italian Institute of Technology
Giuseppe Carbone, University of Calabria
Stéphane Caro, National Center for Scientific Research (CNRS)
Chao Chen, Monash University
GuiMin Chen, Xi’an Jiaotong University
Lei Cui, Curtin University
Huijuan Feng, Southern University of Science and Technology
Sachin Goyal, University of California Merced
Lei Guo, Beijing University of Posts and Telecommunications
Kaiyu Hang, Rice University
Kuan-Lun Hsu, National Taiwan University
Yan Jin, Queen's University Belfast
Rongjie Kang, Tianjin University
Xi Kang, Harbin Institute of Technology
Girish Krishnan, University of Illinois Urbana-Champaign
Patrice Lambert, Laval University
Darwin Lau, The Chinese University of Hong Kong
Jae-Woo Lee, Konkuk University
Bing Li, Harbin Institute of Technology
Xingyu Li, Purdue University
Xin Ma, The Chinese University of Hong Kong
Daniel Martins, Federal University of Santa Catarina
Todd Nelson, University of Southern Indiana
Scott Nokleby, Ontario Tech University
Leila Notash, Queen's University
Latifah Nurahmi, Institut Teknologi Sepuluh Nopember
Nina Robson, California State University
Umer Shah, Ajman University
Ekta Singla, Indian Institute of Technology Ropar
Cynthia Sung, University of Pennsylvania
Philip Voglewede, Marquette University
Long Wang, Stevens Institute of Technology
Guowu Wei, University of Salford
Fugui Xie, Tsinghua University
Qinqsong Xu, University of Macau
Jingjun Yu, Beihang University
Haohan Zhang, University of Utah
Jianguo Zhao, Colorado State University
Jingshan Zhao, Tsinghua University
Keynote
ReMAR 2024 Program Plan
Sponsors
Contact us
Dr. Dongming Gan
Email: dgan@purdue.edu
Phone: 765-496-0517