Conference
Seungmin Woo, Taehoon Kim, Madison Manley and Muhannad S. Bakir, "Design Space Exploration of Chiplet and Interposer PDNs for 2.5D AI Systems," IEEE 76th Electronic Components and Technology Conference (ECTC), 2026 (accepted)
Taehoon Kim, Seungmin Woo, Madison Manley and Muhannad S. Bakir, "Integrated IR-Drop Analysis Framework for PDNs in 3D Stacked Dies," IEEE 76th Electronic Components and Technology Conference (ECTC), 2026 (accepted)
Taesoo Kim, Seungmin Woo, Srujan Penta and Muhannad S. Bakir, "A Design-Space Exploration of Active Interposer Architectures for Long-Reach Signaling in Large-Area Advanced Packages," IEEE 76th Electronic Components and Technology Conference (ECTC), 2026 (accepted)
Seungmin Woo, Juyeop Baek, Pruek Vanna-iampikul, Srujan Penta, Per Viklund, Fan Yang, Bongyoung Yoo and Sung Kyu Lim, "AI-Driven Interconnect Optimization for Signal Integrity in 2.5D ICs with Nickel-Iron Alloys," IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2026 (accepted)
Amaan Rahman, Seungmin Woo, Zheng Yang and Sung Kyu Lim, “On-chip Integrated Voltage Regulators: Frontside, Backside, or Off-Chip?,” IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), 2025 (accepted)
Seungmin Woo, Pruek Vanna-iampikul, and Sung Kyu Lim, "AI-Driven Evaluation and Optimization of Bump Pitch Effects on Chiplet and Interposer Design Quality", IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 2024 (link)
Seungmin Woo, Hyunsoo Lee, Yunjeong Shin, MinSeok Han, Yunjeong Go, Jongbeom Kim, Hyundong Lee, Hyunwoo Kim and Taigon Song, "Reinforcement Learning-Based Optimization of Back-side Power Delivery Networks in VLSI Design for IR-drop Reduction," IEEE/ACM Design, Automation and Test in Europe Conference (DATE), 2024 (link)
Taehak Kim, Jaehoon Jeong, Seungmin Woo, Jeonggyu Yang, Hyunwoo Kim, Ahyeon Nam, Changdong Lee, Jinmin Seo, Minji Kim, Siwon Ryu, Yoonju Oh, Taigon Song, "NS3K: A 3nm Nanosheet FET Library for VLSI Prediction in Advanced Nodes," IEEE International Symposium on Circuits & Systems (ISCAS), 2021 (Selected as a representative paper of 2021 Semiconductor System Fusion Human Resource Research and Invited to a special session on 2021 Summer Annual Conference of IEIE) (link)
Journal
Jonti Talukdar, Seungmin Woo, Sung Kyu Lim, Krishnendu Chakrabarty, "Dynamic Interposer Obfuscation through Distributed Scramblers in Heterogeneously Integrated 2.5D ICs," IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024 (accepted) (link)
Pruek Vanna-iampikul, Seungmin Woo, Serhat Erdogan, Lingjun Zhu, Mohanalingam Kathaperumal, Ravi Agarwal, Ram Gupta, Kevin Rinebold, Madhavan Swaminathan and Sung Kyu Lim, “Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2024 (link)
Taehak Kim, Jaehoon Jeong, Seungmin Woo, Jeonggyu Yang, Hyunwoo Kim, Ahyeon Nam, Changdong Lee, Jinmin Seo, Minji Kim, Siwon Ryu, Yoonju Oh, Taigon Song, " NS3K: A 3 nm Nanosheet FET Standard Cell Library Development and Its Impact," IEEE Transactions on Very Large Scale Integration Systems (TVLSI), 2022 (link)