• Spoof Surface Plasmon Polariton Interconnect

The growing demand for high-fidelity, high-speed intra- and inter-chip communication for emerging applications like big data analysis and quantum information processing is leading us into an era where performance characteristics are expected to be dominated more by the interconnects than by the highly-scaled transistors and logic circuits. Though conventional optical interconnect technology offers bandwidth in the range of Gbps to Tbps, the overhead cost associated with electro-optical single conversion, modulation and coupling unfortunately poses hindrance to the application of this technology for short distance inter-chip communication. Spoof surface plasmon polariton (SSPP) interconnect, which is a new class of optical interconnect based on plasmonic quasi-particles capable of traveling along corrugated metallic surface at THz speed, has been drawing significant attention of the research community to design ultrafast chip-to-chip communication systems which can operate with minimal energy budget and maximal reliability. Though performance characteristics of standalone SSPP interconnects have recently been investigated in detail considering process variation, it remains to be seen how these characteristics will be affected by crosstalk resulting from electromagnetic interference between multiple SSPP communication channels operating in unison. In our research work, we explored how dimensional aspects such as groove heights, widths and numbers are going to influence crosstalk between SSPP channels operating at close proximity and provided a detailed analysis addressing these issues to further advance this emerging field of research for next generation high-speed chip-to-chip communication.