Key Highlights from My Experience at IEDM 2023


At IEDM 2023, a significant emphasis was placed on addressing high computation/memory demands while minimizing interconnect delay, leading to a focus on low-energy electronics. Ongoing research highlighted the potential of Gate-All-Around (GAA) designs and projected the impending dominance of 2D materials by 2035. The considerable industry interest and investment in 2D materials underscored their promising applications. Additionally, the conference highlighted the importance of advanced packaging methods like 2.5D/3D stacking, offering immediate and future benefits, with ample room for enhancements and advancements.