During the IRPS 2024, I presented our work titled "Validating Supply Chain against Recycled COTS ICs using I/O Pad Transistors: A Zero-Area Intrinsic Odometer Approach." Just like a car's odometer tracks mileage, an IC can have its own "odometer" to indicate if it's recycled and its usage history.

Traditionally, detecting recycled ICs necessitates on-chip sensors integrated pre-silicon. However, we propose that you may utilize the readily accessible I/O pad transistors for this purpose. Can you say if a room (core) has been previously used just by observing the door (I/Os)? The concept is straightforward, and our initial investigation yielded promising results. In fact, our findings have immediately attracted the interest of conference attendees. We have engaged in discussions with two industrial groups regarding the implementation of the technique in their applications.

During the IEDM 2023, I presented our work titled "A Holistic Approach to Predict Wirebond Corrosion Failure in Extreme Operating Environments." This work presents a comprehensive corrosion model for the wirebond package, stemming from an extensive long-term collaboration between the industrial research laboratory at NXP Semiconductors and the academic reliability research group at Purdue University. I'm incredibly excited about the chance to present my Ph.D. research work to such a diverse and knowledgeable audience, including experts in the field.

I had the opportunity to present our research work at IRPS for the past two years. However, this marked my first time participating in IEDM. 

At the IEEE International Reliability Physics Symposium (IRPS) 2023 in Monterey, California, USA, I presented our work focused on Transient Leakage Current as a non-destructive Probe of Wire-Bond Electrochemical Failures. The paper's title was "Transient Leakage Current as a Non-destructive Probe of Wire-Bond Electrochemical Failures. This paper was considered as one of the eight highlighted papers of the year 2023  for the novelty of our proposed method to predict corrosion failures at the very early phase of product development.    

Link: https://ieeexplore.ieee.org/document/10117658 

At the IEEE International Reliability Physics Symposium (IRPS) 2022 in Dallas, Texas, United States, I presented our work focused on the lifetime enhancement of plastic packages under intermittent self-heating in the field. This was the first time, I attended IRPS, and learned a lot of things through my interactions with the best researchers in this field, including both academia and industries. The paper title was, Reduced Relative Humidity (RH) Enhances the Corrosion-Limited Lifetime of Self-Heated IC: Peck's Equation Generalized.

 Link:https://ieeexplore.ieee.org/document/9764577