Fully Automatic Die Bonder Equipment Market was valued at USD 1.50 Billion in 2022 and is projected to reach USD 2.30 Billion by 2030, growing at a CAGR of 6.5% from 2024 to 2030.
Over the period from 2018 to 2022, the Fully Automatic Die Bonder Equipment market has experienced steady growth, driven by technological advancements and the rising demand for consumer electronics. In particular, the semiconductor industry has been the primary consumer of die bonders, with increasing demand for compact and efficient systems to handle smaller components. Innovations such as improved bonding accuracy, higher throughput, and enhanced automation have propelled the market forward. The increasing adoption of automation and Industry 4.0 technologies has also played a pivotal role in enhancing productivity and reducing operational costs for manufacturers.
The market has also been influenced by the shift towards more environmentally friendly manufacturing processes. Companies have increasingly sought energy-efficient die bonding solutions that reduce waste and support sustainability initiatives. However, challenges such as the high initial investment costs and the technical complexity of fully automatic systems have limited the broader adoption of these systems in smaller manufacturing plants. Despite these hurdles, the market outlook for the next decade looks promising, with a projected rise in demand driven by growing industries such as automotive electronics, telecommunications, and AI-based devices.
Looking ahead to 2023-2033, demand for Fully Automatic Die Bonder Equipment is expected to continue its upward trajectory. The demand for smaller, faster, and more energy-efficient components is expected to intensify as industries strive to meet the growing needs of the Internet of Things (IoT) and other advanced technologies. The adoption of AI and machine learning in semiconductor manufacturing is set to increase the demand for automated bonding solutions, enhancing the precision and efficiency of production processes. Furthermore, the rise of electric vehicles and 5G technologies is expected to further drive demand for advanced die bonding equipment, as these sectors require high-performance chips and precise manufacturing techniques.
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The global Fully Automatic Die Bonder Equipment market has witnessed significant developments from 2018 to 2022. The demand for advanced packaging solutions, particularly in the semiconductor and electronics sectors, has driven market growth. With the increasing trend of miniaturization in electronic devices and the demand for high-precision bonding processes, die bonder equipment has become a crucial part of the production line. These machines are designed to ensure high-speed and accurate bonding of semiconductor chips to their substrates, which is a critical step in the manufacturing of microelectronic devices.
Toray Engineering
FASFORD TECHNOLOGY
Besi
ASM Pacific Technology Limited (ASMPT)
Kulicke & Soffa Industries Inc.
Tresky AG
SHIBAURA MECHATRONICS CORPORATION
West Bond
Panasonic Corporation
MRSI Systems
SHINKAWA LTD.
Palomar Technologies
DIAS Automation
By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. The Asia-Pacific region is expected to be a key driver of growth, accounting for more than 35% of total revenue growth. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global Fully Automatic Die Bonder Equipment Market
Die Bonder Equipment for Integrated Device Manufacturers (DMs)
Die Bonder Equipment for Outsourced Semiconductor Assembly and Test (OSAT)
Based on Types the Market is categorized into Below types that held the largest Fully Automatic Die Bonder Equipment market share In 2023.
Epoxy Die Bonder
Eutectic Die Bonder
Soft Solder Die Bonder
Flip Chip Die Bonder
Global (United States, Global and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global Fully Automatic Die Bonder Equipment Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global Fully Automatic Die Bonder Equipment Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global Fully Automatic Die Bonder Equipment Market, By Type
6. Global Fully Automatic Die Bonder Equipment Market, By Application
7. Global Fully Automatic Die Bonder Equipment Market, By Geography
Global
Europe
Asia Pacific
Rest of the World
8. Global Fully Automatic Die Bonder Equipment Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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