Research

My interest and area of expertise are extreme ultraviolet (EUV) and Soft X-ray (SXR) technology, nanotechnology, nanofabrication, imaging, optics, plasmas, in particular:

EUV, SXR radiation, and sources: generation optimization, applications, designing and development of laser-produced plasma EUV and SXR sources up to 1-keV photon energy, based on gas targets.

Coherent and incoherent nanoimaging and microscopy: X-ray coherence tomography with single nm axial resolution, EUV microscopy with zone plate optics, "water-window" imaging, coherent and incoherent EUV/SXR imaging including diffractive (lens-less) imaging, Talbot imaging, EUV tomography, X-ray coherence tomography, EUV and SXR holography (Gabor, Fourier), full-field imaging,

Spectroscopy: near-edge X-ray fine structure spectroscopy (NEXAFS), spectromicroscopy, single-shot NEXAFS for time-resolved studies of electronic transitions, extended X-ray absorption fine structure (EXAFS).

Nanofabrication: Extreme Ultraviolet Lithography (EUVL), fabrication in submicron and nanoscale with coherent EUV light sources, interferometric lithography (IL).

Mechanics: design, modeling, and fabrication of high precision optomechanical setups for EUV and SXR experiments.

Modeling: fdmnes simulations for X-ray spectroscopy (NEXAFS/EXAFS), electromagnetic waves interactions with matter, diffraction, modeling of imaging properties of diffractive optics, coherent imaging: Fourier transform holography, diffraction (lens-less) imaging, radiation interaction with photoresists, shadowgram modeling and density evaluation, resolution and feature size estimation from images based on correlation method, phase retrieval problems in the coherent imaging and spectroscopy.

Material Processing: Reactive Ion Etching (RIE), Chemically Assisted Ion Beam Etching (CAIBE), thin film deposition, evaporation.

Characterization techniques: Scanning Electron Microscopy (SEM), Optical Microscopy, Atomic Force Microscopy (AFM), Scanning Probe Microscopy (SPM), Focused Ion Beam (FIB), EDS, WDS.