Publications

Books

Book chapters

• Rohit Sharma and Atul Kumar Nishad, "Performance Evaluation of AsF5-intercalated Top Contact Multilayer Graphene Nanoribbons for Deeply Scaled Interconnects," in High-Speed and Lower Power Technologies, Choi Jung Han, Iniewski Krzysztof (Eds), CRC Press, 2017.

• Rohit Sharma and Kiyoung Choi, “Emerging Interconnect Technologies for 3D Networks-on-Chip,” in Design of 3D Integrated Circuits and Systems, Rohit Sharma and Krzysztof Iniewski (Eds.), CRC Press, 2014.

• Rohit Sharma, Rajarshi Saha and Paul Kohl, “Low-Loss,High-Performance Chip-to-Chip Electrical Connectivity using Air-Clad Copper Interconnects,” in High-speed Photonics Interconnects, Lukas Chrostowski and Krzysztof Iniewski (Eds.), CRC Press, 2013.

Patents 

• Indian patent granted: “An embedded system for analysis of microstrip-like interconnects”, (Patent no. 319102), 2019.

• Indian patent granted: “Trolley System, Device and Method for Controlling Navigation of the Trolley System”, (Patent no. 531011), 2024.

• US patent application titled “Voltage Regulator” (Patent No: 63/648,449), 2024.

• Indian patent application titled “A three-dimensional folded capacitive crossbar array system” (Patent No: 202411046210), 2024. 

Selected Journals

• Suyash Kushwaha, Nastaran Soleimani, Felipe Treviso, Rahul Kumar, Riccardo Trinchero, Flavio Canavero, Sourajeet Roy, and Rohit Sharma, “Comparative Analysis of Prior Knowledge Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2249-2260, 2022. 

• Sherin A. Thomas, Sahibia Kaur Vohra, Rahul Kumar, Rohit Sharma, and Devarshi Mrinal Das, “Analysis of Parasitic Effects in a Crossbar in CMOS based Neuromorphic System for Pattern Recognition using Memristive Synapses”, IEEE Transactions on Nanotechnology, vol. 21, pp. 380-389, 2022. 

• Rahul Kumar, S. S. Likith Narayan, Somesh Kumar, Sourajeet Roy, Brajesh Kumar Kaushik, Ramachandra Achar and Rohit Sharma, “Knowledge Based Neural Networks for Fast Design Space Exploration of Hybrid Copper-Graphene On-Chip Interconnect Networks”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 1, pp. 182-195, 2022.

• Vipul Kumar Nishad, Atul Kumar Nishad, Brajesh Kumar Kaushik, Rohit Sharma, “First-Principle Analysis of Transition Metal Edge-Passivated Armchair Graphene Nanoribbons for Nanoscale Interconnects”, IEEE Transactions on Nanotechnology, vol. 20, no. 1, pp. 92-98, 2020.

• Rahul Kumar, Amit Kumar, Surila Guglani, Somesh Kumar, Sourajeet Roy, Brajesh Kumar Kaushik, Rohit Sharma, Ramachandra Achar, “A Temperature and Dielectric Roughness-aware Matrix Rational Approximation (MRA) Model for the Reliability Assessment of Copper-Graphene Hybrid On-Chip Interconnects”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 9, pp. 1454-1465, 2020.

 Selected Conferences

• Sherin A. Thomas, S. Kushwaha, Rohit Sharma, D. M. Das, “Modeling & Comparing the Impact of Resistive and Capacitive Crossbar Associated Parasitics of Neuromorphic Circuits”, 31st International Conference on Mixed Design of Integrated Circuits and Systems (MIXDES), 2024 (accepted). [Awarded Best Paper]

• Suyash Kushwaha, Surila Guglani, Nastaran Soleimani, Sunil Pathania, Somesh Kumar, Riccardo Trinchero, Sourajeet Roy and Rohit Sharma, “Space Mapped Neuromodeling for Fast & Accurate Signal Integrity Analysis of Rough On-chip Copper Interconnects”, 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), Rose-Hill, Mauritius, 2023, pp. 1-3.

• Sunil Pathania, Suyash Kushwaha, Somesh Kumar, Mallikarjun Vasa, Ashish Shrivastava, Vijender Kumar, Bhyrav Mutnury, and Rohit Sharma “An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects”, 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Winnipeg, MB, Canada, 2023, pp. 154-157.

• Sherin A. Thomas, S. K. Vohra, S. Kushwaha, R. Sharma and D. M. Das, "Modeling and Analysis of CMOS-based Folded Memristive Crossbar Array for 3D Neuromorphic Integrated Circuits," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 960-966.

• Bhawana Kumari, Rohit Sharma and Manodipan Sahoo, “Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects”,  Proceedings of the 72nd IEEE Electronic Components and Technology Conference, San Diego, May 2022.