Publications

Books

Book chapters

• Rohit Sharma and Atul Kumar Nishad, "Performance Evaluation of AsF5-intercalated Top Contact Multilayer Graphene Nanoribbons for Deeply Scaled Interconnects," in High-Speed and Lower Power Technologies, Choi Jung Han, Iniewski Krzysztof (Eds), CRC Press, 2017.

• Rohit Sharma and Kiyoung Choi, “Emerging Interconnect Technologies for 3D Networks-on-Chip,” in Design of 3D Integrated Circuits and Systems, Rohit Sharma and Krzysztof Iniewski (Eds.), CRC Press, 2014.

• Rohit Sharma, Rajarshi Saha and Paul Kohl, “Low-Loss,High-Performance Chip-to-Chip Electrical Connectivity using Air-Clad Copper Interconnects,” in High-speed Photonics Interconnects, Lukas Chrostowski and Krzysztof Iniewski (Eds.), CRC Press, 2013.

Patents 

1. Indian patent granted: “An embedded system for analysis of microstrip-like interconnects”, (Patent no. 319102), 2019.

2. Indian patent published: “Trolley System, Device and Method for Controlling Navigation of the Trolley System” 2022. 

Journals

1. Suyash Kushwaha, Avirup Dasgupta, Sourajeet Roy, and Rohit Sharma, “Fast Multi-ANN Composite Models for Repeater Optimization in Presence of Parametric Uncertainty for On-Chip Hybrid Copper-Graphene Interconnects”, IEEE Access, 2023 (accepted).

2. Surila Guglani, Asha Kumari Jakhar, Km Dimple, Ankit Sukhija, Avirup Dasgupta, Rohit Sharma, Brajesh Kumar Kaushik, and Sourajeet Roy, “Artificial Neural Networks with Fast Transfer Learning for Statistical Signal Integrity Analysis of MWCNT and MLGNR Interconnect Networks”, IEEE Transactions on Electromagnetic Compatibility, 2023.

3. Sherin A. Thomas, Rohit Sharma, Devarshi Mrinal Das, “Analyzing the impact of parasitics on a CMOS-Memristive crossbar neural network based on winner-take-all and Hebbian rule”, Memories - Materials, Devices, Circuits and Systems, vol. 5, 2023.

4. Yiliang Guo, Xiaofan Jia, Xingchen Li, Yifan Wang, Rahul Kumar, Rohit Sharma, and Madhavan Swaminathan “Extrapolation with Range Determination of 2D Spectral Transposed Convolutional Neural Network for Advanced Packaging Problems”, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023.

5. Km Dimple, Surila Guglani, Avirup Dasgupta, Rohit Sharma, Sourajeet Roy, Brajesh Kumar Kaushik “Modified Knowledge Based Neural Networks Using Control Variates for the Fast Uncertainty Quantification of On-Chip MWCNT Interconnects”, IEEE Transactions on Electromagnetic Compatibility, vol. 65, no. 4, pp. 1232-1246, 2023. 

6. Suyash Kushwaha, Nastaran Soleimani, Felipe Treviso, Rahul Kumar, Riccardo Trinchero, Flavio Canavero, Sourajeet Roy, and Rohit Sharma, “Comparative Analysis of Prior Knowledge Based Machine Learning Metamodels for Modeling Hybrid Copper-Graphene On-Chip Interconnects”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 2249-2260, 2022. 

7. Surila Guglani, Km Dimple, Sourajeet Roy, Rohit Sharma, and Brajesh K. Kaushik, “A Bilevel Multi-Fidelity Polynomial Chaos Approach for the Uncertainty Quantification of MWCNT Interconnect Networks with Variable Imperfect Contact Resistances”, IEEE Access, vol. 10, pp. 109925-109936, 2022.

8. Bhawana Kumari, Manodipan Sahoo and Rohit Sharma, “Electro-Thermal Modeling and Reliability Analysis of Cu-Carbon Hybrid Interconnects for Beyond-CMOS Computing”, Applied Physics Letters, Applied Physics Letters, vol.121, no. 10, pp.101901-6, 2022.

9. Sherin A. Thomas, Sahibia Kaur Vohra, Rahul Kumar, Rohit Sharma, and Devarshi Mrinal Das, “Analysis of Parasitic Effects in a Crossbar in CMOS based Neuromorphic System for Pattern Recognition using Memristive Synapses”, IEEE Transactions on Nanotechnology, vol. 21, pp. 380-389, 2022. 

10. Vijay Rao Kumbhare, Rahul Kumar, Manoj Kumar Majumder, Somesh Kumar, Punya Prasanna Paltani, Brajesh Kumar Kaushik, and Rohit Sharma, "High-speed Interconnects: History, Evolution and the Road Ahead", IEEE Microwave Magazine, vol. 23, no. 8, pp. 66-82, 2022.

11. Bhawana Kumari, Santhosh Pandranki, Rohit Sharma and Manodipan Sahoo, “Thermal-Aware Modeling and Analysis of Cu-Mixed CNT Nanocomposite Interconnects”, IEEE Transactions on Nanotechnology, vol. 21, pp. 163-171, 2022.

12. Bhawana Kumari, Rohit Sharma and Manodipan Sahoo, “Performance and Reliability Improvement in Intercalated MLGNR Interconnects using Optimized Aspect Ratio”, Scientific Reports, 12, 1475, 2022.

13. Rahul Kumar, S. S. Likith Narayan, Somesh Kumar, Sourajeet Roy, Brajesh Kumar Kaushik, Ramachandra Achar and Rohit Sharma, “Knowledge Based Neural Networks for Fast Design Space Exploration of Hybrid Copper-Graphene On-Chip Interconnect Networks”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 1, pp. 182-195, 2022.

14. Bhawana Kumari, Rahul Kumar, Rohit Sharma and Manodipan Sahoo, “Design, Modeling and Analysis of Cu-Carbon Hybrid Interconnects”, IEEE Access, vol. 9, pp. 113577-113584, 2021.

15. Vipul Kumar Nishad, Atul Kumar Nishad, Brajesh Kumar Kaushik, Rohit Sharma, “First-Principle Analysis of Transition Metal Edge-Passivated Armchair Graphene Nanoribbons for Nanoscale Interconnects”, IEEE Transactions on Nanotechnology, vol. 20, no. 1, pp. 92-98, 2020.

16. Rahul Kumar, Amit Kumar, Surila Guglani, Somesh Kumar, Sourajeet Roy, Brajesh Kumar Kaushik, Rohit Sharma, Ramachandra Achar, “A Temperature and Dielectric Roughness-aware Matrix Rational Approximation (MRA) Model for the Reliability Assessment of Copper-Graphene Hybrid On-Chip Interconnects”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 10, no. 9, pp. 1454-1465, 2020.

17. Sunil Pathania, Somesh Kumar and Rohit Sharma, "Analyzing Crosstalk-induced Effects in Rough On-chip Copper Interconnects", IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 10, pp. 1984-1992, 2019.

18. Rohit Sharma and Somesh Kumar, "Design of energy-aware interconnects for next generation micro systems", CSI Transactions on ICT, vol. 7, pp. 215–220, 2019. 

19. Maneesh Pandey, Tuhina Gupta, Pallavi Raj and Rohit Sharma, "Implication of On-chip Single Source Clocking on High-Speed Serial Interfaces in Network SoC", IEEE Design and Test, 2019.

20. Somesh Kumar and Rohit Sharma, "Investigating the Role of Interconnect Surface Roughness towards the Design of Power-Aware Network on Chip", IET Computers and Digital Techniques, 2019.

21. Somesh Kumar and Rohit Sharma, "Analytical Modeling and Performance Benchmarking of On-Chip Interconnects with Rough Surfaces", IEEE Transactions on Multi-Scale Computing Systems, 2018. 

22. Manoj Yadav, Ravi Shankar RV and Rohit Sharma, “Colloidal Synthesized Cobalt Nanoparticles forNon-Volatile Memory Device Application”, IEEE Transactions on Semiconductor Manufacturing, 2018.

23. Manoj Yadav, Ravi Shankar RV, D. Mandal and Rohit Sharma, "Microwave Assisted Size Control of Colloidal Nickel Nanocrystals for Colloidal Nanocrystals based Non-Volatile Memory Devices", IEEE/TMS Journal of Electronic Materials, 2018.

24. Somesh Kumar and Rohit Sharma, "Analytical Model for Resistivity and Mean Free Path in On-Chip Interconnects with Rough Surfaces", IEEE Transactions on Emerging Topics in Computing, 2018.

25. Somesh Kumar and Rohit Sharma, "Chip-to-Chip Copper Interconnects with Rough Surfaces: Analytical models for Parameter Extraction and Performance Evaluation", IEEE Transactions on Components, Packaging and Manufacturing Technology, 2018.

26. T. Agrawal, P. K. Biswas and R. Sharma, "A Novel-Q Anti-Collision Algorithm for Passive RFID Systems", Pervasive and Mobile Computing, 2017.

27. Atul Kumar Nishad and Rohit Sharma, "Lithium-intercalated Graphene Interconnects: Prospects for On-chip Applications", IEEE Journal of the Electron Devices Society, 2016.

28. AtulKumar Nishad and Rohit Sharma,“Performance Improvement in SC-MLGNRs Interconnects using Interlayer Dielectric Insertion”, IEEE Transactions on Emerging Topics in Computing, 2015.

29. Atul Kumar Nishad and Rohit Sharma, “Self-Consistent Capacitance Model for Multilayer Graphene Nanoribbon Interconnects”, IET Micro and Nano Letters, 2015.

30. Rohit Dhiman, Rohit Sharma and Rajeevan Chandel, “Compact Models and Delay Computation of Sub-threshold Interconnect Circuits”, Analog Integrated Circuits and Signal Processing, 2015.

31. Rohit Sharma et. al.,“Airgap Interconnects: Modeling, Optimization and Benchmarking for Backplane, PCB and Interposer Applications”, IEEE Transactions on Components, Packaging and Manufacturing Technologies, 2014.

32. Atul Kumar Nishad and Rohit Sharma, “Analytical Time Domain Models for Performance Optimization of Multilayer GNR Interconnects”, IEEE Journal of Selected Topics in Quantum Electronics, 2014.

33. Rohit Sharma, T. Chakravarty and Kiyoung Choi, “Fast and Efficient Extraction Algorithm for High-Speed Interconnects with Arbitrary Boundaries”, The Journal of Supercomputing, 2012.

34. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Empirical Expressions for Characteristic Impedance of Novel Microstrip-like Interconnections”, AEÜ – International Journal of Electronics and Communication, 2010.

35. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Reduction of Signal Overshoots in High-Speed Interconnects Using Adjacent Ground Tracks” Journal of Electromagnetic Waves and Applications, 2010.

36. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Analytical Model for Optimum Signal Integrity in PCB Interconnects using Ground Tracks”, IEEE Transactions on Electromagnetic Compatibility, 2009.

37. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Analytical Modeling of Microstrip-like Interconnects in presence of Ground Plane Aperture”, IET Microwaves, Antennas and Propagation, 2009

38. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Signal Integrity Issues in High-Speed Interconnects over a Ground Plane Aperture”, Journal of Electromagnetic Waves and Applications, 2008.

39. Rohit Sharma, T. Chakravarty, and A. B. Bhattacharyya, “Transient Analysis of Microstrip-Like Interconnections Guarded by Ground Tracks”, Progress in Electromagnetic Research, 2008.

40. Rohit Sharma, T. Chakravarty, Sunil Bhooshan and A. B.Bhattacharyya, “Design of a Novel 3dB Coupler using Defected Ground Structure”, Progress in Electromagnetic Research, 2006.

 Conferences

1. Suyash Kushwaha, Surila Guglani, Nastaran Soleimani, Sunil Pathania, Somesh Kumar, Riccardo Trinchero, Sourajeet Roy and Rohit Sharma, “Space Mapped Neuromodeling for Fast & Accurate Signal Integrity Analysis of Rough On-chip Copper Interconnects”, 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 2023 (accepted).

2. Mingeun Choi, Sriharini Krishnakumar, Ramin Khorasani, Inna Vaisband, Rohit Sharma, Madhavan Swaminathan and Satish Kumar, “Thermal Analysis of High Current Vertical Power Delivery Network with Embedded Microchannel Cooling”, 23rd Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2024 (accepted).

3. Pradyot Yadav, Rohit Sharma, Madhavan Swaminathan and Tomás Palacios, “Heterogeneous Integration of GaN and Si CMOS for W-Band 3D Integrated RF Front Ends”, SRC CHIMES Annual Review, State College, PA, USA, 2023. [Awarded Best Poster]

4. Sunil Pathania, Suyash Kushwaha, Somesh Kumar, Mallikarjun Vasa, Ashish Shrivastava, Vijender Kumar, Bhyrav Mutnury, and Rohit Sharma “An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects”, 2023 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), Winnipeg, MB, Canada, 2023, pp. 154-157.

5. Yifan Wang, Yiliang Guo, Rahul Kumar, Rohit Sharma, and Madhavan Swaminathan, “Edge-based Material Cell Meshing for Improved Accuracy of Laguerre-FDTD Method”, 2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI), Portland, OR, USA, 2023, pp. 1429-1430.

6. S. A. Thomas, S. K. Vohra, S. Kushwaha, R. Sharma and D. M. Das, "Modeling and Analysis of CMOS-based Folded Memristive Crossbar Array for 3D Neuromorphic Integrated Circuits," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 960-966.

7. Kavitha Nagarajan, Ajay Kumar Vaidhyanathan, Parthasarathy Ramaswamy, Suyash Kushwaha and Rohit Sharma “Hybrid Copper-Graphene Package Interconnects for Channel loss Improvement in High-Speed Serial Interfaces”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, December 2022.

8. Surila Guglani, Km Dimple, Avirup Dasgupta, Rohit Sharma, Brajesh Kumar Kaushik, and Sourajeet Roy, “A Transfer Learning Approach to Expedite Training of Artificial Neural Networks for Variability-Aware Signal Integrity Analysis of MWCNT Interconnects”, Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, October 2022.

9. Soniya , Shivdeep, K. K. Jha, D. M. Das and Rohit Sharma, “A Low-Overhead PUF Based Hardware Security Technique to Prevent Scan Chain Attacks for Industry-Standard DFT Architecture”, 2022 IEEE 65th International Midwest Symposium on Circuits and Systems, August 2022.

10. Adeeba Sharif, Sunil Pathania, Suyash Kushwaha, Sourajeet Roy, Rohit Sharma, and Brajesh Kumar Kaushik, “An Artificial Neural Network Surrogate Model for Repeater Optimization in the Presence of Parametric Uncertainty for Hybrid Copper-Graphene Interconnect Networks”, 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization, Limoges, July 2022.

11. Bhawana Kumari, Rohit Sharma and Manodipan Sahoo, “Stability Analysis of Nanoscale Copper-Carbon Hybrid Interconnects”,  Proceedings of the 72nd IEEE Electronic Components and Technology Conference, San Diego, May 2022.

12. KM Dimple, Surila Guglani, Suyash Kushwaha, Rahul Kumar, Sourajeet Roy, Rohit Sharma and B K Kaushik, “Exploring the Impact of Parametric Variability on Eye Diagram of On-Chip Multi-walled Carbon Nanotube Interconnects using Fast Machine Learning Techniques”,  Proceedings of the 72nd IEEE Electronic Components and Technology Conference, San Diego, May 2022.

13. Rohit Sharma et al., “The IEEE EPS Packaging Benchmark Suite”,  Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, October 2021.

14. Mohit Goyal, Maneesh Pandey, Sharad Kumar and Rohit Sharma, “Prediction of De-embedded Eye Height/Width Parameters using Machine Learning in High-Speed Serial Link Characterization”, Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, October 2021.

15. Suyash Kushwaha, Amir Attar, Riccardo Trinchero, Flavio Canavero, Rohit Sharma and Sourajeet Roy, “Hybrid Copper-Graphene Interconnects via Generalized Knowledge Based Machine Learning”, Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, October 2021.

16. Sherin A. Thomas, Sahibia Kaur Vohra, Rahul Kumar, Rohit Sharma, and Devarshi Mrinal Das, “Analysis of Parasitics in CMOS Based Memristor Crossbar Array for Neuromorphic Systems”, 2021 IEEE 64th International Midwest Symposium on Circuits and Systems, August 2021. 

17. Bhawana Kumari, Santosh Pandranki, Manodipan Sahoo, Rohit Sharma, “Copper-MWCNT Composite: A Solution to Breakdown in Copper Interconnects”, 2021 IEEE 21st International Conference on Nanotechnology, July 2021.

18. Bhawana Kumari, Rahul Kumar, M. Sahoo and Rohit Sharma, "Performance Analysis of Self Heated Multilayer Vertical Graphene Nanoribbon Interconnects", Proceedings of the 71st IEEE Electronic Components and Technology Conference, Lake Buena Vista, May 2021.

19. S. Guglani, K. M. Dimple, B. K. Kaushik, S. Roy, Rohit Sharma, “A Multi-Fidelity Polynomial Chaos Approach for Uncertainty Quantification of MWCNT Interconnect Networks in the Presence of Imperfect Contacts”, Proceedings of the 25th IEEE Workshop on Signal and Power Integrity, Cologne, May 2021.

20. Rahul Kumar, Bhawana Kumari, Somesh Kumar, M. Sahoo and Rohit Sharma, “Temperature and Dielectric Surface Roughness Dependent Performance Analysis of Cu-Graphene Hybrid Interconnects”; Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems, Shenzhen, China, December 2020.

21. Rahul Kumar, S. S. Likith Narayan, Somesh Kumar, Sourajeet Roy, Brajesh K. Kaushik, Ramachandra Achar and Rohit Sharma, “Estimating Per-Unit-Length Resistance Parameter in Emerging Copper-Graphene Hybrid Interconnects via Prior Knowledge based Accelerated Neural Networks”, Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, San Jose, October 2020. 

22. Sunil Pathania, Bhyrav Mutnury, Mallikarjun Vasa, Vijender Kumar, Sukumar Muthusamy, Seema P K and Rohit Sharma, “Thermal Sensitivity of Dielectric Materials in High-Speed Designs”, Proceedings of the 29th IEEE Electronic Performance of Electronic Packaging and Systems, San Jose, October 2020. 

23. Vipul Kumar Nishad Atul Kumar Nishad, Brajesh K. Kaushik, Sourajeet Roy and Rohit Sharma, “First Principle Analysis of Os-passivated Armchair Graphene Nanoribbons for Nanoscale Interconnects”, Proceedings of the 20th IEEE International Conference on Nanotechnology, Montreal, July 2020. [Awarded Best Paper]

24. Rahul Kumar, Somesh Kumar, Surila Guglani, Sourajeet Roy, Brajesh K. Kaushik, Rohit Sharma and Ramachandra Achar, "Temperature-Aware Compact Modeling of Ultra-Scaled Cu-Graphene Hybrid Interconnects", Proceedings of the 24th IEEE Workshop on Signal and Power Integrity, Cologne, May 2020.

25. Vipul Kumar Nishad and Rohit Sharma, "First Principle Analysis of Li-Doped Armchair Graphene Nanoribbons for Nanoscale Metal Interconnect Applications", Proceedings of the 70th IEEE Electronic Components and Technology Conference, Lake Buena Vista, May 2020.

26. RahulKumar, Sunil Pathania,Somesh Kumar, Surila Guglani, Amit Kumar,Sourajeet Roy, and Rohit Sharma, "Role of Grain Size on theEffective Resistivity of Cu-Graphene Hybrid Interconnects", Proceedings of the 70th IEEE Electronic Components and Technology Conference, Lake Buena Vista, May 2020.

27. Sunil Pathania, Mallikarjun Vasa, Ashish Shrivastava, Sanjay Kumar, Vijender Kumar, Sukumar Muthusamy,Seema P K, Bhyrav Mutnury and Rohit Sharma, "Multiphysics Approach Using Computational Fluid Dynamics for Signal Integrity Analysis in High Speed Serial Links", Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Kaohsiung, December 2019.

28. Maneesh Kumar Pandey, Mohit Goyal, Parul Kumar Sharma and Rohit Sharma, "Dual Current Based Power Discharge Model for Embedded USB Host-Devices System", Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Kaohsiung, December 2019.

29. Surila Guglani, Amit Kumar, Rahul Kumar, Brajesh K. Kaushik, Rohit Sharma, Ramachandra Achar, and Sourajeet Roy "Temperature-Aware Closed-Form Matrix Rational Approximation Model for Crosstalk Analysis of Multi-Walled Carbon Nanotube Interconnects", Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Kaohsiung, December 2019.

30. Maneesh K Pandey, Anand Kumar Sinha, Parul K Sharma and Rohit Sharma, "Quality & Reliability Assessment of USB PLL Clock Failure in Silicon Products", Proceedings of the 21st  IEEE Electronics Packaging Technology Conference, Singapore, December 2019. 

31. Sunil Pathania, Mallikarjun Vasa, Bhyrav Mutnury and Rohit Sharma, "Thermal Impact on High Speed PCB Interconnects", Proceedings of the 28th IEEE Electronic Performance of Electronic Packaging and Systems, Montreal, October 2019. 

32. Shah Zahid Yousuf, Anil Kumar Bhardwaj and Rohit Sharma, "Investigating the Role of Parasitic Resistance in a Class of Nanoscale Interconnects", Proceedings of the 23rd International Symposium on VLSI Design and Test, Indore, July 2019.

33. Maneesh Pandey, Mohit Goyal, Parul Kumar Sharma and Rohit Sharma, “Modeling and Characterization of VBUS Power Discharge for Embedded Superspeed USB Host/Devices”, Proceedings of the 32nd International Conference on  VLSI Design, New Delhi, January 2019.

34. Sunil Pathania, Somesh Kumar and Rohit Sharma, “Crosstalk Analysis for Rough Copper Interconnects in Ternary Logic”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Chandigarh, December 2018.

35. Akash Dang, S. P. Jilla, Krishan Kumar, Gurvinder Singh, Rohit Sharma and Atanu Mukherjee, “Simulation-Based Impedance Characterization of PDN in High-Performance Multi-Chip HTCC Packages for Avionics”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Chandigarh, December 2018.

36. Manoj Yadav, Ravi Shankar RV and Rohit Sharma, “Microwave Aided Synthesis ofColloidal Nickel Nanoparticles for Memory Device Application”, Proceedings of the IEEE NANO 2018, Cork, July2018.

37. Manoj Yadav, Ravi Shankar RV and Rohit Sharma, "Colloidal Synthesis of Cobalt Nanoparticles for Application in Non Volatile Memory Device", Proceedings of the IEEE NANO 2018, Cork, July 2018.

38. Somesh Kumar, Sunil Pathania and Rohit Sharma, "Investigating the Role of Sidewall Surface Roughness on the Performance of Through Silicon Vias", Proceedings of the 19th  IEEE Electronics Packaging Technology Conference, Singapore, December 2017. [Awarded Best Paper]

39. Manoj Yadav, D. Mandal, Ravi Shankar R V and Rohit Sharma, "Colloidal Nanoparticles based Non-Volatile Memory Device: Role of Wettability by Nanoparticles Solvents", Proceedings of the 13th IEEE International Conference on Electron Devices and Solid-State Circuits, Taiwan, October 2017. 

40. Somesh Kumar and Rohit Sharma, "Performance Modeling and Broadband Characterization of Chip-to-Chip Interconnects with Rough Surfaces", Proceedings of the 18th Electronics Packaging Technology Conference, Singapore, November 2016.

41. Atul Kumar and Rohit Sharma, "Performance Improvement in Side Contact Multilayer Graphene NanoRibbon Interconnects Using Intercalation Doping",  Proceedings of the 66th IEEE Electronic Components and Technology Conference, Las Vegas, May 2016.

42. Somesh Kumar and Rohit Sharma, “Design Space Exploration of Nanoscale Interconnects with Rough Surfaces”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium, Seoul, December 2015.

43. Somesh Kumar, Sarabjeet Kaur and Rohit Sharma, “A High-k, Metal Gate Vertical-Slit FET for Ultra-Low Power and High-Speed Applications”, Proceedings of the IEEE INDICON 2015, New Delhi, December 2015.

44. AtulKumar Nishad and Rohit Sharma, "Performance Analysis of AsF5-intercalated Top-Contact MultiLayer Graphene NanoRibbon Interconnects”, Proceedings of the 2015 IEEE International Symposium on Nanoelectronic and Information Systems, Indore, December 2015.

45. T. Agrawal, P. K. Biswas and R. Sharma, "An Energy-Efficient Query-DFSA Algorithm for Passive RFID Systems", Proceedings of the 6th International Conference and Workshop on Computing and Communication 2015, Vancouver, October 2015.

46. Rohit Sharma et al.,“Design Space Exploration of Through Silicon Vias for High-Speed, Ultra-Low Loss Vertical Links”, Proceedings of the IEEE Electrical Design of Advanced Packaging and Systems Symposium 2014, Bangalore, December 2014.

47. Atul Kumar Nishad and Rohit Sharma, “Some Investigations on MLGNRs for Post-CMOS Applications”, IEEE-CAS Workshop on Microelectronic Circuits, Roorkee, October 2014. [Awarded Best Paper]

48. Rohit Sharma et. al.,“Analytical Model for Inverter Design using Floating Gate Graphene Field Effect Transistors”, Proceedings of the IEEE Computer Society Annual Symposium on VLSI, Tampa, July 2014.

49. Erdal Uzunlar, Rohit Sharma, Rajarshi Saha, Vachan Kumar, Rizwan Bashirullah, Azad Naeemi, and PaulA. Kohl, “Design and Fabrication of Ultra Low-Loss, High-Performance 3D Chip-Chip Air-Clad Interconnect Pathway”, Proceedings of the 63rdIEEE Electronic Components and Technology Conference, Las Vegas, May 2013.

50. Tanvi Agrawal, P. K. Biswas, A. D. Raoot and Rohit Sharma,“Optimum Frame Size Evaluation Framework for Efficient Tag Identification in Passive RFID Systems”, Proceedings of the 2013 IEEE Wireless Power Transfer Conference, Perugia, May 2013.

51. Prashant Kumar, Arun Singh, Anshul Garg and Rohit Sharma,“Compact Models for Transient Analysis of Single-layer Graphene Nanoribbon Interconnects”, Proceedings of the 15th International Conference on Computer Modelling and Simulation, Cambridge, April 2013.

52. Rohit Sharma, Erdal Uzunlar, Vachan Kumar, Rizwan Bashirullah, Azad Naeemi and Paul Kohl, “Design and Fabrication of Air-clad TSVs in Silicon Interposer”, Proceedings of the TechCon Conference, Austin,September 2012.

53. V. Kumar, Rohit Sharma,Rizwan Bashirullah, Paul Kohl, and Azad Naeemi, “Compact Modeling and Performance Optimization of 3D Chip-Chip Interconnect Pathway with Transmission Lines, Vias and Discontinuities”, Proceedings of the 15thIEEE International Interconnect Technology Conference, San Jose, June 2012.

54. Rohit Sharma, Vachan Kumar, Rizwan Bashirullah, Azad Naeemi and Paul Kohl, “Design and Fabrication of Low-loss, Horizontal and Vertical Interconnect Links using Air-Clad Transmission Lines and through Silicon Vias”, Proceedings of the 62nd IEEE Electronic Components and Technology Conference, San Diego, June 2012.

55. Rohit Sharma,“Ultra-high Performance, Air-Clad Interconnect on Substrates and Silicon Interposer: Design, Modeling, and Fabrication”, Global Interposer Technology Workshop, Atlanta, November 2011. [Awarded Best Paper]

56. Jinho Lee, Mingyang Zhu,Kiyoung Choi, Jung ho Ahn, and Rohit Sharma, “3D Network-on-Chip with Wireless Links through Inductive Coupling”, Proceedings of the International SoC Design Conference, Jeju Island, November 2011.

57. Rohit Sharma, T.Chakravarty and K Choi, “Generalized Parameter Extraction Model for High-Speed Interconnects with Arbitrary Boundary Conditions”, Proceedings of the 30thIEEE-URSI Conference, Istanbul, August 2011.

58. Rohit Sharma and Kiyoung Choi, “A Formal Approach toward Developing an Equivalent Circuit for High-Speed Coupled Interconnects with Intermediate Ground Insertion”, Proceedings of the Asia Symposium on Quality Electronic Design, Penang, August 2010. [Awarded Best Paper]

59. Rohit Sharma and A. B. Bhattacharyya, “Delay Modeling of High-Speed Interconnects with Shield Insertion”, Proceedings of the Compact Modeling of Advance MOSFET Structures and Mixed Mode Applications, pp. 10-11, New Delhi, India, January 2008.

60. Rohit Sharma, Nitin, V. K. Sehgal, and D. S. Chauhan, “Closed-form Expressions for Extraction of Capacitances in Multilayer VLSI Interconnects”, Proceedings of the IEEE TENCON Conference, Hyderabad, November 2008.

61. Rohit Sharma, T.Chakravarty, and A. B. Bhattacharyya, “Characteristic impedance ofmicrostrip-like interconnects guarded by ground tracks”, Proceedings of the29th General Assembly of the URSI, Chicago, Chicago, August 2008.

62. Rohit Sharma, T.Chakravarty and A. B. Bhattacharyya, “Transient Analysis of Microstrip – like Interconnects with Ground Plane Aperture”, Proceedings of the IEEE Applied Electromagnetic Conference, Kolkata, December 2007.

63. Rohit Sharma,Chakravarty, T., Navadha, Khimta T., Raghuvanshi V., and Bhattacharyya A. B.,“Design of a Microstrip Coupler with Ground Plane Aperture for Broadband Operation”, Proceedings of INDICON Conference, Bangalore, September 2007.

64. Rohit Sharma, Kushagra Kumar and Shashank Vig, “DTMF Based Remote Control System”, Proceedings of IEEE International Conference on Industrial Technology, Mumbai, December 2006.