Publications

Books

Book chapters

• Rohit Sharma and Atul Kumar Nishad, "Performance Evaluation of AsF5-intercalated Top Contact Multilayer Graphene Nanoribbons for Deeply Scaled Interconnects," in High-Speed and Lower Power Technologies, Choi Jung Han, Iniewski Krzysztof (Eds), CRC Press, 2017.

• Rohit Sharma and Kiyoung Choi, “Emerging Interconnect Technologies for 3D Networks-on-Chip,” in Design of 3D Integrated Circuits and Systems, Rohit Sharma and Krzysztof Iniewski (Eds.), CRC Press, 2014.

• Rohit Sharma, Rajarshi Saha and Paul Kohl, “Low-Loss,High-Performance Chip-to-Chip Electrical Connectivity using Air-Clad Copper Interconnects,” in High-speed Photonics Interconnects, Lukas Chrostowski and Krzysztof Iniewski (Eds.), CRC Press, 2013.

Patents 

• Indian patent granted: “An embedded system for analysis of microstrip-like interconnects”, (Patent no. 319102), 2019.

• Indian patent granted: “Trolley System, Device and Method for Controlling Navigation of the Trolley System”, (Patent no. 531011), 2024.

• Indian patent granted: “A three-dimensional folded capacitive crossbar array system” (Patent No: 565891), 2024. 

• US patent application titled “Voltage Regulator” (Patent No: 63/648,449), 2024.

• Indian patent application titled “Drafting patent application for Sensor-based, economical Hand Hygiene Prompt device for use in the Open bay design ICUs: HHP-OICU”, 2025.

Recent Journals

1. G. Bhatti, Y. Agrawal, V. Palaparthy, M. G. Kumar and R. Sharma, "Novel Electrical Analytical Model of Serpentine Stretchable Interconnect Under Mechanical Effects," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 16, no. 6, pp. 1290-1302, June 2026, doi: 10.1109/TCPMT.2025.3622034. 

2. Rahul Kumar Verma, Jaiprakash, Manodipan Sahoo, Rohit Sharma, “Electrothermal modeling and reliability analysis of all-carbon interconnects: An effective medium theory-based approach”, Micro and Nanostructures, vol. 216, 2026, 208743, doi: https://doi.org/10.1016/j.micrna.2026.208743. 

3. S. Kushwaha, P. R. Shamini, S. Roy, D. Spina and R. Sharma, "Machine Learning-Based Performance Optimization of Copper–Graphene Heterointerconnects," IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 16, no. 3, pp. 638-641, March 2026, doi: 10.1109/TCPMT.2026.3658703. 

4.  A. K. Jakhar, R. Sharma, A. Dasgupta and S. Roy, "A Neural Network Guided Approach for Repeater Optimization in Multilayer Graphene On-Chip Interconnect Networks Including TSVs," IEEE Journal on Multiscale and Multiphysics Computational Techniques, vol. 10, pp. 483-495, 2025, doi: 10.1109/JMMCT.2025.3625423. 

5. Suyash Kushwaha, Chintu Bhaskara Rao, Shamini P R, Sourajeet Roy, and Rohit Sharma, “Performance Enhanced Copper- Graphene Hetero Interconnect Structures in Crossbar Arrays for Neuromorphic Computing,” IEEE Journal on Multiscale and Multiphysics Computational Techniques, vol. 10, pp. 379-387, 2025. doi: 10.1109/JMMCT.2025.3593872. 

6. G. Bhatti, Y. Agrawal, V. S. Palaparthy, M. G. Kumar and R. Sharma, "Explicit Analytical Model of Stretchable Interconnects for Flexible Electronics System," in IEEE Transactions on Signal and Power Integrity, vol. 4, pp. 156-168, 2025, doi: 10.1109/TSIPI.2025.3592610.

7. G. Bhatti, Y. Agrawal, V. S. Palaparthy, R. Sharma and M. Girish Kumar, "Reliability Assessment Using Electrical and Mechanical Characterization of Stretchable Interconnects on Ultrathin Elastomer for Emerging Flexible Electronics System," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 15, no. 10, pp. 2114-2125, Oct. 2025, doi: 10.1109/TCPMT.2025.3587385. 

8. Gulafsha Bhatti, Yash Agrawal, Vinay Palaparthy, Rohit Sharma, Mekala Girish Kumar, “Mechanical and electrical testing of encapsulated stretchable substrate interconnect models for emerging flexible electronic systems,” Microelectronics Reliability, vol. 172, 2025, 115824, https://doi.org/10.1016/j.microrel.2025.115824. 

9. M. G. Kumar, Y. Agrawal, H. Pulluri and R. Sharma, "Essential Frequency Analysis for Stacked Cu-CNT Composite Cells of TSVs," IEEE Access, vol. 13, pp. 41221-41229, 2025, doi: 10.1109/ACCESS.2025.3547963. 

10. Bhawana Kumari, Rohit Sharma and Manodipan Sahoo, “ABCD parameter based analytical AC modeling of novel Cu–carbon hybrid interconnects for noise constrained nanoscale systems,” Scientific Reports, vol. 15, pp. 18440, 2025. https://doi.org/10.1038/s41598-024-81729-9. 

11. R. Sharma et al, “Benchmarking and Reproducibility in Computational and Experimental Characterization of Electronic Packages for Signal/Power Integrity: Four benchmarks serve as standardized cases,” IEEE Antennas and Propagation Magazine, vol. 67, no. 2, pp. 51-63, 2025, doi: 10.1109/MAP.2025.3537412. 

12. R. Sharma et al., “New and Emerging Directions in the Fields of Antennas and Propagation,” IEEE Transactions on Antennas and Propagation, vol. 73, no. 1, pp. 566-581, 2025, doi: 10.1109/TAP.2024.3514092. 

Recent Conferences

1. Twinkel Manna, Gulafsha Bhatti, Akansha Verma, Sourajeet Roy, Yash Agrawal and Rohit Sharma. “Design and Simulation of Stretchable Crossbar Array for Neuromorphic Computing”, IEEE Workshop on Signal and Power Integrity, Turin, Italy, 2026 (accepted).

2. Ajayvir Singh Sandhu, Raghav Sharma, and Rohit Sharma, “Scalable magnetic tunnel junction arrays for wireless radio frequency sensing and energy harvesting”, IEEE International Magnetics Conference (INTERMAG 2026), Manchester, UK, 2026 (accepted).

3. A. S. Sandhu, R. Sharma and R. Sharma, "Design of Coplanar Waveguide Architecture for Magnetic Tunnel Junction Arrays in Wireless RF Sensing Applications," 2025 IEEE 7th International Conference on Emerging Electronics (ICEE), Bengaluru, India, 2025, pp. 1-4, doi: 10.1109/ICEE67165.2025.11409750.

4. S. Kushwaha, C. B. Rao, S. P R, S. Roy and R. Sharma, "Impact of Scaling on Large Crossbar Arrays for Neuromorphic Applications," 2025 IEEE 29th Workshop on Signal and Power Integrity (SPI), Gaeta, Italy, 2025, pp. 1-4, doi: 10.1109/SPI64682.2025.11014309.

5. M. G. Kumar, Y. Agrawal and R. Sharma, "High Frequency Analysis of Cu-CNT Based Tapered TSV Bumps," 2025 IEEE 29th Workshop on Signal and Power Integrity (SPI), Gaeta, Italy, 2025, pp. 1-4, doi: 10.1109/SPI64682.2025.11014342.