Distinguished Lecturer: IEEE Electronics Packaging Society, 2023 – current.
Editorial board member: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 – current.
Technical Contributor:
Heterogeneous Integration Roadmap, 2021 – current
Chapter 13: Co-Design for Heterogeneous Integration
IEEE EPS Packaging Benchmarking Committee, 2020 – current
Chair: IEEE EPS Technical Committee of Electrical Design, Modeling and Simulation (TC – EDMS), 2020 – 2023.
General Chair: 29th International Symposium on VLSI Design and Test (VDAT), 2025, Chandigarh, India.
General Chair: IEEE Electrical Design of Advanced Packaging and Systems 2024 (EDAPS), Bangalore, India.
Program Chair: 23rd International Symposium on VLSI Design and Test (VDAT), 2019, Indore, India.
General Chair: IEEE Electrical Design of Advanced Packaging and Systems 2018 (EDAPS), Chandigarh, India.
Technical Program Committee member:
IEEE Electronic Components and Technology Conference (ECTC)
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
IEEE Workshop on Signal and Power Integrity (SPI)
Asia-Pacific Symposium in Electromagnetic Compatibility (APEMC)
Dean, International Relations (2025 – current)