Voluteering
Professional services
Distinguished Lecturer: IEEE Electronics Packaging Society, 2023 – 2026.
Chair: International Committee, Indian Semiconductor Mission, 2023 – current.
Chair: IEEE EPS Technical committee of Electrical Design, Modeling and Simulation, 2020 – current.
Associate Editor: IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 – current.
Technical Contributor:
Heterogeneous Integration Roadmap, 2021 – current
Chapter 13: Co-Design for Heterogeneous Integration
IEEE EPS Packaging Benchmarking Committee, 2020 – current
General Chair: IEEE Electrical Design of Advanced Packaging and Systems 2018 (EDAPS), Chandigarh, India.
Program Chair: 23rd International Symposium on VLSI Design and Test (VDAT), 2019, Indore, India.
Session/Track Chair:
Packaging with Additive Manufacturing for Harsh Conditions, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, USA.
Packaging and Interconnects, 35th International Conference on VLSI Design (VLSID), 2022, India.
Beyond 2D Packaging and Interconnects, 36th International Conference on VLSI Design (VLSID), 2023, India.
Next Generation Quantum, AI, and Secure System Design, 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, USA.
Packaging Benchmark Simulation, 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2023, San Jose, USA
Technical Program Committee member:
IEEE Electronic Components and Technology Conference (ECTC)
IEEE Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
IET Fellowship Assessor: The Institution of Engineering and Technology, UK
Examiner:
Science and Engineering Research Board (SERB), India
National Science Foundation (NSF), USA
Referee:
o IEEE Transactions on Components, Packaging and Manufacturing Technology
o IEEE Transactions on Electromagnetic Compatibility
o IEEE Transactions on Microwave Theory and Techniques
o IEEE Transactions on VLSI
o IEEE Transactions on Nanotechnology
o IEEE Transactions on Electron Devices
o IEEE Access
o IET Microwave Antennas and Propagation
o IET Micro and Nano Letters
o IET Circuits, Devices and Systems
o Elsevier Integration
o IOP Engineering Research
o ACS Applied Nano Materials
o International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
Performance Auditor: Technical Education Quality Improvement Programme (TEQIP), MHRD
Joint Secretary: IEEE Delhi Section Execom
Administrative assignments at IIT Ropar
Associate Dean (independent charge), International Relations (2017-2021)
Coordinator, Indo-Taiwan Joint Research Centre on AI and ML (2018-2021)
Coordinator of MTech programme (Microelectronics and VLSI Design) (2018-2022)