RESEARCH
Research Goal: Explore innovative circuit- and system-level techniques to enable 10-1,000 GHz future wireless systems.
Circuits for X-band (6-18 GHz) phased-array systems in 0.18 um CMOS
Programmable True-time delay (TTD) IC
Programmable attenuator IC
Broadband amplifier
A 150 GHz amplifier in 65nm CMOS
Three-stage common-source stages with minimum matching losses
Dummy-prefilled microstrip lines for design-rule compliance
A 600 GHz 30 dB gain, 2 mW Psat amplifier in InP-HBT process
Among the fastest amplifier reported with a record output power
12-stage common-base for high-gain
Cross-coupled feedback stabilization
4:1 differential-to-SE output combiner for high saturated output power
A 300 GHz single-chip phase-locked loop (PLL) IC in InP-HBT process
Highest-frequency fundamental PLL reported.
2:1 dynamic frequency divider for ultra-high frequency operation
Sub-harmonic phase detection to reduce circuit complexity
A 600 GHz single-chip transmitter (TX) chip in InP-HBT process
Highest-frequency RF front-end chip reported
Integrated sub-harmonic local oscillator (LO) PLL at 210 GHz
Sub-harmonic transmit mixer
Millimeterwave (60 GHz) sensor network experimental prototype
Simultaneous sensor localization and data read-out
3D sensor localization using a narrow pencil beam and radar ranging techniques
Reflection-type sensor prototype using a slot antenna and PIN-diode modulator
Experimental prototype (60 GHz) for sensor network based on a distributed phased array
Local sensors collaborate to combine their RF carrier power to reach far-out reader.
Feedback-based approach to synchronize sensor phase/frequencies in distributed fashion.
Signal processing techniques for mismatch error correctons in time-interleaved ADCs (TIADC)
Time-interleaving enables much higher sampling frequencies than a single A-D converter
However, signal-to-noise ratios of TIADCs are significantly affected by mismatch errors
Various foreground/background signal processing techniques are developed to correct such mismatch errors