Patents
US Patent US 20030041286, Digital component test apparatus an apparatus for testing electronic assemblies and a method for remotely testing a peripheral device having an electronic assembly. View patent.
US Patent US 6420878 B1: System and method of integrated circuit self-testing of circuit board connectors. View patent.
Engineering Publications
Boorom, Ken and Awasthi, Shawn. Evaluating Design Tradeoffs and Options through a Full Chip Substrate and Metal Layer Noise Analysis for a Commercial Image Sensor Chip. Design Automation Conference, June 2012.
Boorom, Ken. Performing High-Speed USB Pre-Qualification with HSPICE. Synopsys Verification Avenue Technical Bulletin, 5:2, June 2005.
Boorom, Ken. SPICE Models Help Engineers Understand Issues in High-Frequency Interconnects. Electronic Design News, May 2000.
Burkett, S. ; Duttagupta, S. ; Honfhine, M. ; Erickson, G. ; Holscher, R. ; Boorom, K. ; Rosato, J. ; Clifford, R. Microelectronics education and research in the Idaho Microfabrication Laboratory at Boise State University. Proceedings of the Thirteenth Biennial University/Government/Industry Microelectronics Symposium, 1999. Coming soon-link.
Image Sensor Chips
AR1230 (click for flyer) is a 4000 x 3000, 12 Megapixel back side illuminated image sensor,
1.1 micron pixel Clk = 6 to 48 Mhz, 10-bit ADC, 4-lane MIPI, 6.8mm x 6.42mm die size,
-30C to 70C
AR1330CP (click for flyer) is a 4208 x 3120, 13-Megapixel back-side illuminated image
sensor, 1.1 micron pixel, 6 to 48 Mhz, 10-bit ADC, 4-lane MIPI, 6.78 x 5.89 mm die size,
-30C to 70C, optical format = 1/3 inch
Here are some photos available publicly, and from a Chipworks Teardown of a cell phone:
Public Service Work
I do organizing and volunteer work with infectious disease scientists, who study organisms about the same size as the circuits I work on. I've helped with statistical analysis, Design of Experiments (DOE), and paper submission. A list of my papers is available on the National Institutes of Health's Pubmed Server.
Journals: Lancet Infectious Diseases, The New Scientist, PLOS-One, others
Organizational Affiliations of Co-Authors: US CDC; China CDC; US Air Force; WHO; Pasteur Institute, others