The modern approach based on multi-chip technology developed in the 1980s, the mechanical sensor (MEMS) and the drive electronics (IC) are manufactured in different facilities using different processing techniques. The two chips are tested separately and then wired together during packaging.
The disadvantages of this approach include the size and cost of two chips, the cost and capacity constraints of specialized MEMS fabrication and the performance limitations of interconnecting two separate chips into a single package.
I have focused on the poineering development of a unique monolithic single-chip MEMS technology allowing for extremely cost-effective, high performance motion sensors. With the approach, the MEMS sensors are fabricated directly on top of the IC electronics in a standard CMOS fabrication facility.
http://ieeexplore.ieee.org/document/6474354/
https://www.sciencedirect.com/science/article/pii/S0924424714001666
Quantitative study on the temperature coefficient of frequency (TCf) of the micromechanical resonator is performed.
The effects on n-type doping on the temperature dependence of elastic constants is calculated based on free carrier contribution on elastic constants.
The dependence of TCf on both crystal orientation and vibration mode is discussed for single-crystal-silicon based resonator.
Multiple samples with various dimensions are studied and the scaling effect is discussed.
It is indicative that doping is a viable approach to enhance the temperature stability of silicon based micromechanical resonator.
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