[ITHERM 2018] Designing a Temperature Model to Understand the Thermal Challenges of Portable Computing Platforms

• Ying-Ju Yu and Carole-Jean Wu. To Appear in Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), 2018.

Received the 2018 IEEE ITHERM Best Paper Award

[IISWC 2017] Understanding the Thermal Challenges of High-Performance Mobile Devices Through An Accurate and Detailed Platform Level Temperature Model

• Ying-Ju Yu and Carole-Jean Wu. To Appear in Proceedings of the IEEE International Symposium on Workload Characterization as a poster abstract, 2017.

[ITHERM 2016] Thermoelectric-based Sustainable Self-Cooling for Fine-Grained Processor Hot Spots

• Soochan Lee, Dhinakaran Pandiyan, Jae-sun Seo, Patrick E. Phelan, and Carole-Jean Wu. In Proceedings of the IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2016.

[EP 2015] Hot Spot Cooling and Harvesting Central Processing Unit Waste Heat Using Thermoelectric Modules

• Soochan Lee, Patrick E. Phelan, and Carole-Jean Wu. In Proceedings of the ASME Journal of Electronic Packaging, 2015.

[InterPACK 2015] Harvesting CPU Waste Heat through Pyroelectric Materials

• Soochan Lee, Nishant Singh, Patrick E. Phelan, and Carole-Jean Wu. In Proceedings of the ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015.

[IMECE 2014] Hot Spot Cooling and Harvesting CPU Waste Heat using Thermoelectric Modules

• Soochan Lee, Patrick E. Phelan, and Carole-Jean Wu. In Proceedings of the ASME International Mechanical Engineering Congress and Exposition Conference, 2014.

[CAL 2013] Architectural Thermal Energy Harvesting Opportunities for Sustainable Computing

• Carole-Jean Wu. In Proceedings of the IEEE Computer Architecture Letter, 2013.

Best of Computer Architecture Letters (CAL), 2014