Research

MEMS & Micro/Nano Systems Laboratory

The integration of electronic and mechanical components on the same silicon chip gave birth to a new technology, appropriately named microelectromechanical systems (MEMS) or microsystem technology (MST). MEMS has found applications in wide ranging areas such as chemical sensors, biosensors, aerospace, RF circuits, consumer electronics, etc. and it has been identified as one of the most promising technologies for the 21st Century. MEMS-based devices can range in size from a few micrometers to millimeters and have the ability to sense, control and actuate on the micro/nano scale. The MEMS industry is expected to be the driving force for next generation systems and subsystems.

MEMS and Micro/Nano Systems Laboratory established in 2010 to perform both basic and applied research in MEMS and Micro/Nanosystems. We constantly leverage our scale to new and more challenging heights. The research work in our lab primarily focuses on 

• Silicon Micromachining

• Glass Micromachining

• Anodic Oxidation of Silicon

• Thin films for MEMS

• Silicon Surface texturing for Solar Cell

Research Achievements

• A process to fabricate through holes (or deep cavities and microfluidic channels) in glass wafer using wet bulk micromachining

• Precise identification of crystallographic directions on different orientation silicon wafer surface (e.g., Si{100}, Si{110} and Si{111}) using self-aligning pre-etched technique.

• Surface texturing of Si{100} in extremely low concentration alkaline solution for minimized reflectivity

• Involved in developing Etching Simulator (IntelliEtch), one of the modules of Intellisuite software for MESM design.

• A novel process for the fabrication of perfect convex corners for MEMS structures using bulk micromachining technology.

• A technique to fabricate microstructures inside wet anisotropically etched cavities in silicon wafer (i.e., recessed microstructures in silicon wafer).

• A front-to-back alignment method using mask pattern.

• The design and development of MEMS components with reduced stress at the sharp corners using complementary metal–oxide–semiconductor (CMOS) process compatible silicon wet anisotropic etchants.

• A novel fabrication method for the formation of different kinds of freestanding conventional (e.g., cantilever beams, diaphragms, etc.) and unconventional (various shapes channels, sharp convex and rounded concave corner structures, etc.) silicon structures for MEMS-based devices using standard semiconductor processes.

• In-situ detection of orientation dependent adsorption of surfactant molecules during etching process. (Selected as prominent research work in Nagoya University in 2010)

• Novel fabrication methods for the realization of complex 3D structures using two-step wet etching and local oxidation of silicon (LOCOS) processes.

Equipment