Thermal Analysis Computer Chip

Thermal Analysis- Thermal Analysis is analysis of 16 equally spaced computer chips. The heat is dissipated by convection from the substrate. The convection film coefficient is 25W/ m K and the bulk (ambient) temperature is 300 °K . The dimension of the chip is 6 X 6 X 0.5 mm and each chip generates a maximum heat power of 0.2 Watts.

Solidwork simulation is used to create this simulation. First I added hear source to all the chips and then ran different features to determine the properties of the chip.