Material-Device-Circuit co-design Lab (MDCL)

Building Predictive Multi-Scale, Multi-Physics Modeling Frameworks for Future Electronics

Welcome to the MDCL Group! Our research focuses on bridging semiconductor processes, materials, devices, and circuits through physics-driven, multi-scale simulations to enable next-generation electronic technologies.

As integrated circuits (ICs) continue to shape the modern world, semiconductor device scaling is reaching atomic dimensions, where quantum effects, thermal challenges, and material limitations impose fundamental barriers. Overcoming these challenges requires novel materials, novel device architectures, and holistic design methodologies that integrate physics from atoms to systems.

At MDCL, we aim to create predictive modeling frameworks that span process, material, device, and circuit levels, enabling co-design approaches for emerging technologies in logic, memory, interconnects, and energy applications.

Our Material-Device-Circuit Co-Design approach aims to enable physics-based predictions that shorten design cycles and guide experimental efforts, paving the way for the next generation of electronics.

We work on future-oriented problems, including:

• 2D Materials for CMOS Beyond-Si

• Emerging Memory Devices (TMD based RRAM)

• Advanced Interconnects and Power Delivery Networks

• Process-development of Multi-junction Solar Cells

• Technology-Circuit co-design for frequency synthesizers above 100 GHz

The figure illustrates our integrated multi-scale and multi-physics approach.