The workshop was organized as part of our ongoing collaboration with Prof. Subramanian S. Iyer. Prof. Iyer leads the Center for Heterogeneous Integration and Performance Scaling at University of California Los Angeles. He is an IBM fellow and has an illustrious career in the area of microelectronic devices, heterogeneous integration and advanced packaging.
The workshop focused on the emerging area of heterogeneous integration and system scaling. Newer applications of sensors and devices are presenting unique challenges in integration and packaging of these systems. Within this workshop we organized expert talks from academia and industry to address these issues. The talks covered the following areas
1. Flexible and wearable device integration
2. Heterogeneous integration
3. Integration for HPC and RF systems
4. Fundamental problems in heterogeneous integration
The main aim of the workshop was to: (a) discuss the latest progress in the area; and (b) explore options for collaborative research. Apart from students, the workshop was attended by participants from industry and strategic sector companies. The workshop was supported by the SPARC program of Ministry of Human Resource and Development.