Research

Research Areas: 

• Application of Machine Learning in the Design and Analysis of Interconnects and Packages. 

• Modeling And Fabrication of High-Speed Interconnects.

• 3D Integration and Design of Through-Silicon-Via (TSV).

• Antenna for 5G And 6G Applications. 

• Micro and Nanotechnology Manufacturing.

• Design and Optimization of Graphene-Based Nanoelectronic Circuits.

• Interconnect Architecture for Network-On-Chips.

• Digital and Analog VLSI Design.

• Flexible Devices. 

• Reversible Circuits

• IOT-Based Hardware Design 

• Biosensors

• Nanoscale Device Modelling and Simulation