Publications

S. Kumar et al., “Optimal Design of High-Speed PCB Interconnects using Electrical-Thermal Co-Simulation”, IEEE Transactions on Signal and Power Integrity, 2023 (under review).  

S. Kumar et al., “Knowledge Distillation Based Few-Shot Learning for Intrusion Detection”, Multimedia Tools and Applications, Springer, 2023 (under review)

S. Kumar et al., “Automated Passive Income from Stock Market Using Machine Learning and Big Data Analytics with Security Aspects”, Concurrency and Computation: Practice and Experience, 2023 (under review).

S. Kumar et al., “High-speed Interconnects: History, Evolution, and the Road Ahead”, IEEE Microwave Magazine, vol. 23, no. 8, pp. 66-82, 2022. (SCI, IF-3.062); DOI: 10.1109/MMM.2021.3136268.

S. Kumar et al., “Knowledge-Based Neural Networks for Fast Design Space Exploration of Hybrid Copper-Graphene On-Chip Interconnect Networks”, IEEE Tran. on Electromagnetic Compatibility, vol. 64, no. 1, pp. 182-195, 2022. (SCI, IF: 2.036); DOI: 10.1109/TEMC.2021.3091714

S. Kumar et al., “Design and Implementation of Low Power, High-speed Configurable Approximation 8-bit Booth Multiplier”, Journal of Circuits, Systems, and Computers (JCSC), 2022 (in press, pre-print available). (SCI, IF-1.278); DOI: https://doi.org/10.1142/S0218126622502966

S. Kumar et al., “Coverage Hole Detection Using Social Spider Optimized Gaussian Mixture Model”, Journal of King Saud University - Computer and Information Sciences (Elsevier), 2021 (in press, pre-print available). (SCI, IF: 8.839); DOI: https://doi.org/10.1016/j.jksuci.2021.12.010.

S. Kumar et al., “Disease Detection in Apple Leaves Using Deep Convolutional Neural Network,” Agriculture MDPI Journal, pp. 1-23, vol. 11, no. 7: 617, 2021. (SCI, IF-3.408); DOI: https://doi.org/10.3390/agriculture11070617

S. Kumar et al., “Analysis and Implementation of Threat Agents Profiles in Semi-Automated Manner for a Network Traffic in Real-Time Information Environment,” Electronics MDPI Journal, pp. 1-18, vol 10, no. 15: 1849, 2021. (SCI, IF-2.690); DOI: https://doi.org/10.3390/electronics10151849.

S. Kumar et al., “A Survey on Layer-wise Security attacks in IoT: Attacks, Countermeasures, and Open-Issues,” Electronics MDPI Journal, pp. vol. 10, no. 2365, 2021. (SCI, IF-2.690); DOI: https://doi.org/10.3390/electronics10192365

S. Kumar et al., “A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation (MRA) Model for the Reliability Assessment of Copper-Graphene Hybrid On-Chip Interconnects”, IEEE Tran. on Components, Packaging and Manufacturing Technology, vol. 10, no. 9, pp. 1454-1465, 2020. (SCI, IF-1.922); DOI: 10.1109/TCPMT.2020.3004414

S. Kumar et al., “Analyzing Crosstalk-induced Effects in Rough On-chip Copper Interconnects”, IEEE Tran. on Components, Packaging and Manufacturing Technology, vol. 9, no. 10, pp. 1984-1992, 2019. (SCI, IF-1.922); DOI: 10.1109/TCPMT.2019.2941871

S. Kumar, and R. Sharma, “Design of energy-aware interconnects for next generation micro systems”, CSI Transactions on ICT (Springer), vol. 7, no. 3, pp. 215-220, 2019. DOI: 10.1007/s40012-019-00239-6

S. Kumar, and R. Sharma, “Investigating the Role of Interconnect Surface Roughness towards the Design of Power-Aware Network on Chip”, IET Computers and Digital Techniques, vol. 13, no. 1, pp. 49-56, 2019. (SCI, IF-0.906); DOI: https://doi.org/10.1049/iet-cdt.2018.5067

S. Kumar, and R. Sharma, “Chip-to-Chip Copper Interconnects with Rough Surfaces: Analytical models for Parameter Extraction and Performance Evaluation”, IEEE Tran. on Components, Packaging and Manufacturing Technology, vol. 8, no. 2, pp. 286-299, 2018. (SCI, IF-1.922); DOI: 10.1109/TCPMT.2017.2774252

S. Kumar, and R. Sharma, “Analytical Model for Resistivity and Mean Free Path in On-Chip Interconnect with Rough Surfaces”, IEEE Tran. on Emerging Topics in Computing, vol. 6, no. 2, pp. 233-243, 2018. (SCI, IF-6.595); DOI: 10.1109/TETC.2016.2597542

S. Kumar, and R. Sharma, “Analytical Modeling and Performance Benchmarking of On-Chip Interconnects with Rough Surfaces”, IEEE Tran. on Multi-Scale Computing System, vol. 4, no. 3, pp. 272-284, 2018. DOI: 10.1109/TMSCS.2017.2696941

S. Kumar and Monika, “Study of Effect of Variations in slot dimensions on Fractal Patch antenna Performance”, International Journal of Computers & Technology, vol. 5, no. 1, pp. 41-48, 2013.

S. Kumar and R. Kumar, “A 1.8V and 2GHz Inductively Degenerated CMOS Low Noise Amplifier”, International Journal of Electronics Communication and Computer Technology, vol. 2, no. 4, pp. 150-154, 2012.

S. Kumar and Kuldeepak, “A 0.18µm and 2GHz CMOS Differential Low Noise Amplifier”, International Journal of Electronics Communication and Computer Technology, vol. 2, no. 4, pp. 155-158, 2012.

S. Kumar et al.,   “Exploring Real-Time scenarios and isolated execution via a Remote Code Executor,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).

S. Kumar et al.,   “Reconfigurable Antennas: A new paradigm for reliable 5G and 6G communications,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted). 

S. Kumar et al.,   “An Interactive Ride-Sharing System via Web Application,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted). 

S. Kumar et al.,   “Crop Recommendation using Machine Learning and Plant Disease Identification using CNN and Transfer-Learning Approach,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).   S. Kumar et al.,   “Meals On Wheels : A Platform To Connect Tiffin Services to Users,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).

S. Kumar et al.,   “PlantKart: Connecting Nurseries to everyone,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).

S. Kumar et al.,   “Medical Waste Classification using Deep Learning and Convolutional Neural Networks,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).

S. Kumar et al.,   “NGO Portal - A Platform to connect NGOs with prospective members,” in proc. IEEE International Conference on Interdisciplinary Approaches in Technology and Management for Social Innovation (IATMSI), 2022 (accepted).

S. Kumar et al., “Fraud Detection on Bank Payments Using Machine Learning,” in proc. IEEE International Conference for Advancement in Technology (ICONAT), 2022, pp. 1-4

S. Kumar et al., “Disease Predictor Using Random Forest Classifier,” in proc. IEEE International Conference for Advancement in Technology (ICONAT), 2022, pp. 1-4

S. Kumar et al., “Design and Comparative Valuation of an MSML Based Low Power Content Addressable Memory Cell”, in proc. IEEE IBSSC, India, 2021.

S. Kumar et al., “Songs Recommendation using Context-Based Semantic Similarity between Lyrics”, in proc. IEEE INDISCON, India, 2021.

S. Kumar et al., “Quantum Cost-Efficient Design of Synchronous Reversible Shift Registers using Reversible Logic”, in proc. IEEE IBSSC, India, 2021.

S. Kumar et al., “Design and Performance Benchmarking of Dual Gate Flexible Bilayer Graphene FETs”, in proc. IEEE IBSSC, India, 2021.

S. Kumar et al., “Smart IoT-based Water Monitoring System using Redundancy Elimination Strategy”, in proc. IEEE IBSSC, India, 2021.

S. Kumar et al., “Temperature and Dielectric Surface Roughness Dependent Performance Analysis of Cu-Graphene Hybrid Interconnects”, in proc. IEEE Electrical Design of Advanced Packaging and System Symposium (EDAPS), China, 2020.

S. Kumar et al., “2D- Discrete Cosine Transform based Dynamically Controllable Image Compression Technique”, in proc. IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2020.  

S. Kumar et al., “Estimating Per-Unit-Length Resistance Parameter in Emerging Copper-Graphene Hybrid Interconnects via Prior Knowledge Accelerated Neural Networks”, in proc. IEEE EPEPS, San Jose, USA, 2020.

S. Kumar and Shivangi Gupta, “A Novel Perspective in Designing a Low Quantum Cost Synchronous Reversible Counters”, in proc. IEEE International Conference on Design & Technology of Integrated Systems in Nanoscale Era, Morocco, Marrakech, Morocco, 2020, pp. 1-6.

S. Kumar et al., “Role of Grain Size on the Effective Resistivity of Cu-Graphene Hybrid Interconnects”, in proc. IEEE Electronic Components and Technology Conference (ECTC), Florida, US, pp. 1-4, 2020.

S. Kumar et al., “Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects”, in proc. IEEE Workshop on Signal and Power Integrity (SPI), Cologne, Germany, 2020.

S. Kumar et al., “Malaria Parasite Recognition in Thin Blood Smear Images using Squeeze and Excitation Networks”, in proc. IEEE CICT, Allahabad, India, pp. 1-5, 2019.

S. Kumar et al., “Crosstalk Analysis for Rough Copper Interconnects considering Ternary Logic” in proc. IEEE Electrical Design of Advanced Packaging and System Symposium (EDAPS), Chandigarh, India, 2018, pp. 1-3.

S. Kumar et al., “A Shortest Path Algorithm for 3D Integrated Circuit TSV Assignment” in proc. IEEE Electrical Design of Advanced Packaging and System Symposium (EDAPS), Chandigarh, India, 2018.

S. Kumar et al., “Investigating the Role of Surface Roughness on the Performance of Through Silicon Vias”, in proc. IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2017, pp. 1-4. 

S. Kumar, and R. Sharma, “Performance Modeling and Broadband Characterization of Chip-to-Chip Interconnects with Rough Surfaces”, in proc. IEEE Electronics Packaging Technology Conference (EPTC), Singapore, 2016, pp. 629-632.

S. Kumar, and R. Sharma, “Design Space Exploration of Nanoscale Interconnects with Rough Surfaces”, in proc. IEEE Electrical Design of Advanced Packaging and System Symposium (EDAPS), Seoul, South Korea, 2015, pp.  125-128.

S. Kumar et al., “A High-k, Metal Gate Vertical-Slit FET for Ultra-Low Power and High-Speed Applications”, in proc. IEEE International India conference (INDICON), New Delhi, India, 2015, pp. 1-5.

S. Kumar, and Sudha, “Design of Low Power, High Gain LNA for WCDMA range and Parameters Extraction using Artificial Neural Network (ANN), in proc. IEEE Power, Communication and Information Technology (PCITC), Bhubaneshwar, India, 2015, pp. 436-441.

S. Kumar et al., “Analytical Model for Design of Complementary Inverter using Floating Gate Graphene Field Effect Transistors”, in proc. ISVLSI, Tampa, Florida, USA, 2014, pp. 148-153.

S. Kumar et al., “Design Space Exploration of Through Silicon Vias for High-Speed, Low Loss Vertical Links”, in proc. IEEE Electrical Design of Advanced Packaging and System Symposium (EDAPS), Bangalore, India, 2014, pp. 9-12.

S. Kumar et al., “Low Power CMOS Current Reuse Low Noise Amplifier at 2.4 GHz Frequency”, in proc. IEEE International conference on research and development prospects on Engineering and technology, Tamilnadu, India, 2013, pp. 68-70.

S. Kumar, “Fast Adders Synthesis and Simulation using VHDL”, in proc. National Conference on Latest Advancement in Science, Engineering and Research 2011 (LASER’11), Bhatinda, India, 2011, pp. 140-143.