Dr. Kumar received the B. Tech. degree in Electronics and Telecommunication Engineering from Kurukshetra University (Ch. Devilal Memorial Government Engineering College) in 2009, the M. Tech degree in VLSI Design & CAD from Thapar University in 2012 under the supervision of Prof. Ravi Kumar. He did Ph. D. degree in Electrical Engineering from Indian Institute of Technology Ropar (IIT Ropar) in 2018. His Ph. D. supervisor was Prof. Rohit Y. Sharma - with whom he learned the rudiments of high-speed interconnect design and 3D IC Design. During his doctoral studies, he worked on modeling, fabrication and performance benchmarking of on-chip and chip-to-chip interconnects considering surface roughness. His current research interests include Application of Machine Learning in the Design and Analysis of Interconnects and Packages, Modeling and Fabrication of High-Speed Interconnects, 3D Integration and Design of Through-Silicon-Via (TSV), Antenna for 5G And 6G Applications, Interconnect Architecture for Network-On-Chips, Digital and Analog VLSI Design, Flexible Devices, Nanoscale Device Modelling and Simulation, Reversible Circuits, IOT-Based Hardware Design and Biosensors.

He is a referee for several journals including IEEE Transactions on Electromagnetic Compatibility, IEEE Transactions on Emerging Topics in Computing, IEEE Transactions on Components, Packaging and Manufacturing Techniques, IET Digital & computer techniques and Journal of Supercomputing. He is a Senior Member of the IEEE and convener of IEEE student branch at ABV-IIITM, Gwalior. He is also GIAN local coordinator of IIITM Gwalior. He has conducted more than 100 national and international events since 2019 to till date.