Expertise: Professor Chang-Chun Lee has extensive expertise in computational solid mechanics, flexible displays, physical reliability analysis of nano-micro devices, strained silicon engineering, and advanced electronic packaging/MEMS technology.

Publication Record: With over 270 publications, he has contributed significantly to journals and conferences in these fields.

Project Leadership: Overseeing fifty projects in electronic packaging/MEMS and display technology, Professor Lee managed diverse areas, including flexible OLED devices, package design, modeling, and 3D-IC reliability estimation.