Embedded Files
Test Enclosures
Test Enclosures
PN: ENC-500-01 - Compatible with 600 Series
Modular enclosure for PISMO 3D surface used in testing of electronic products
Light tight for optical and laser test setup's
Retrofitted for RF testing
Applications: Electronics Final Assembly and Test (FATP) for RF, optical, laser and other applications
Features
Features
Fast prototype development: Compatible will all current drop-in modules and PISMO 3D surface
Handle High Mix Environment: Modular plates for easy changeover
Decrease Changeover time: Quick change from high mix, low volume to high mix, medium volume production
In-Line and Off-line automation: Enclosure can be assembled with conveyor and pift capabilties for in-line and off-line setup's.
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