Rick Sturdivant

Nepal Pico-Hydroelectic Generation

Hsi-Jen (James) Yeh, Ph.D., Rick Sturdivant, Ph.D., Ryan Brown, and many others

  • Ongoing research in Pico-Hydroelectric generator prioritized load control system to provide turbine failsafe and utilize excess generated power

Publications/Presentations:

  1. IGESSC2019 conference presentation
  2. CSCI2019 conference presentation
  3. IEEE GreenTech 2020 conference presentation

Electronic packaging at microwave and millimeter-wave frequencies

Rick Sturdivant, Ph.D. and others

  • Research into electronic packaging at microwave and millimeter-wave frequencies

  • Applications include radar and communication systems

Publications/Presentations:

  1. R. Sturdivant, C. Quan, B. Young, “Using the matrix metal-on-elastomer connector at microwave frequencies,” Presented at 27th International Symposium on Microelectronics, Boston, MA. 1994.
  2. R. Sturdivant, T. Theisen, “Heat Dissipating Transmission Lines,” Applied Microwave & Wireless, Spring 1995, pp. 57-63.
  3. R. Sturdivant, “Transmission Line Conductor Loss and the Incremental Inductance Rule,” Microwave Journal, Sept. 1995.
  4. R. Sturdivant, “Millimeter-wave characterization of several substrate materials for automotive applications,” in Proceedings of the IEEE Electrical Performance of Electronic Packaging Conference, Oct 2-4, 1995, pp. 137-139. (Published on IEEE Xplore with DOI number)
  5. R. Sturdivant, “Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chips,” in Proceedings of the IEEE MTT-S International Symposium Digest, 1995, pp. 1591-1595. (Published on IEEE Xplore with DOI number)
  6. Midford, T., Wooldridge, J., Sturdivant, R., “The evolution of packages for monolithic microwave and millimeter-wave circuits,” IEEE Transactions on Antennas and Prop., Vol 43, No. 9, 1995, pp. 983-991. (Published on IEEE Xplore with DOI number)
  7. R. Sturdivant, et. al., “Transitions and interconnects using coplanar waveguide and other three conductor transmission lines,” in Proceedings of the IEEE MTT-S International Symposium, May 1996. (Published on IEEE Xplore with DOI number)
  8. R. Sturdivant, “Packaging and Filters At Microwave Frequencies,” Presentation at Buenaventura IEEE Section Meeting, March 22, 1996.
  9. R. Sturdivant, et. al., “Design and Performance of a High Density 3D Microwave Module,” in Proceedings of the IEEE MTT-S International Symposium, 1997, pp. 501-504. (Published on IEEE Xplore with DOI number)
  10. R. Sturdivant, et. al., “Using MMIC flip chips and CVD diamond for improved thermal management of microwave modules,” in Proceedings of the IEEE MTT-S International Symposium, 1997, pp. 505-507. (Published on IEEE Xplore with DOI number)
  11. R. Sturdivant, “MCMs, 3D Packaging, Wafer Scale Packaging, Plastic Packaging,” WMA Workshop, Presented at the IEEE MTT-S International Microwave Symposium, Baltimore, MD June 1998. (Published on IEEE Xplore with DOI number)
  12. C.P. Schaffer, I.C. Chen, R.L. Sturdivant, et. al., “Commercial CVD diamond films: Material properties and their related effects on microwave characteristics,” Diamond and Related Materials, vol. 7, Feb. 1999, pp. 585-588. (Published with DOI number)
  13. R. Sturdivant, ‘Investigation of MMIC flip chips with sealants for improved reliability without hermeticity,’ in Proceedings of the IEEE MTT-S International Symposium, 1996, pp. 239-242. (Published on IEEE Xplore with DOI number)
  14. R. Sturdivant, G.E. Ponchack, “Should I choose a ceramic or organic board?” PWB Workshop, Presented at the IEEE International Microwave Symposium, Fort Worth, TX, June 2004. (Published on IEEE Xplore with DOI number)
  15. R. Sturdivant, “Ceramic Packaging Issues for Wireless High Power Amplifiers,” WSJ Workshop, Presented at the IEEE International Microwave Symposium, Fort Worth, TX, June 2004. (Published on IEEE Xplore with DOI number)
  16. R. Sturdivant, “Millimeter-wave Performance of Alumina High Temperature Cofired Ceramics IC Packages,” Presented at IMAPS 2006 International Conference and Exhibition on Device Packaging, March 20-23, Scottsdale, AZ.
  17. R. Sturdivant, “Microwave Performance of Ball Grid Array Packages,” Presented at IMAPS 2006 International Conference and Exhibition on Device Packaging, March 20-23, Scottsdale, AZ.
  18. R. Sturdivant, “Millimeter-wave Radio System In A Package,” Presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2008.
  19. R. Sturdivant, “Design of Transmit/Receive Modules”, Presented at IMAPS Advanced Technology Workshop on RF and Microwave Packaging, Sept. 2009.
  20. R. Sturdivant, “Broadband Electrical Modeling of Transitions and Interconnects Useful for PCB and Co-fired Ceramic Packaging,” Presented at 2014 IMAPS RaMP Conference, San Diego, CA. Winner of best session paper award.
  21. R. Sturdivant, “Materials and Transmission Line Measurements Comparing HTCC and Thick Film Alumina,” Presented at 2014 IMAPS RaMP Conference, Diego, CA
  22. R. Sturdivant, “How to Successfully Measure and Model Electronic Packages for SI,” Presented at WMJ Workshop, at the IEEE MTT-S International Microwave Symposium, Phoenix, AZ, May 2015.
  23. R. Sturdivant, “Electronic Packaging at Microwave and Millimeter-wave Frequencies: Applications, Key Components, and Design Issues”, Presented at IEEE CLASTECH Conference, Los Angeles, 2015.
  24. R. Sturdivant, E.K.P. Chong, “Modeling and Simulation of Via Conductor Losses in Co-fired Ceramic Substrates Used In Transmit/Receive Radar Modules,” Presented at the 2016 IMAPS RaMP Conference, San Diego, CA.
  25. R. Sturdivant, A.J. Bogdon, E.K.P. Chong, “A simple closed form solution to single layer heat spreading angle appropriate for microwave hybrid modules,” Journal of Electronics Cooling and Thermal Control, June 2016, no. 6, pp.52-61. (Published with DOI number)
  26. R. Sturdivant, A. Bogdon, E.K.P. Chong, “Balancing Thermal and Electrical Packaging Requirements for GaN Microwave and Millimeter-Wave High Power Amplifier Modules,” Journal of Electronics Cooling and Thermal Control, Vol. 7, No. 1, 2017, pp. 1-7. (Published with DOI number)
  27. R. Sturdivant, “Electronic packaging for 5G microwave and millimeter wave systems,” Professional Development Course at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017.
  28. R. Sturdivant, “Panel Session: Challenge Of 5-G mm-wave Packaging and Opportunity,” Panel Session at IEEE 19th Electronics Packaging Technology Conference, Singapore, Dec 6-9, 2017.
  29. R. Sturdivant, “5G Systems and Packaging Opportunities,” Presented at 51st International Symposium on Microelectronics, Pasadena, CA, October 8-11, 2018.
  30. R. Sturdivant, “Electronic Packaging for 5G Microwave and Millimeter Wave Systems,” Professional Development Course Presented at 51st International Symposium on Microelectronics, Pasadena, CA, October 8-11, 2018.

Books:

  1. K. Kuang, R. Sturdivant, editors, RF and Microwave Microelectronics Packaging II (New York, NY: Springer Publishing, 2017).
  2. R. Sturdivant, Microwave and Millimeter-wave Electronic Packaging (Norwood, MA: Artech House, 2014).

Book Chapters:

  1. R. Sturdivant, “Fundamentals Of Packaging at Microwave and Millimeter-wave Frequencies,” Chapter 1 in RF and Microwave Microelectronic Packaging (New York: Springer Publishing, 2010).
  2. R. Sturdivant, “Introduction to RF and Microwave Microelectronic Packaging,” Chapter 1 in RF and Microwave Microelectronic Packaging II (New York: Springer Publishing, 2017).
  3. R. Sturdivant, “Packaging of Transmit/Receive Modules,” Chapter 2 in RF and Microwave Microelectronic Packaging II (New York: Springer Publishing, 2017).
  4. R. Sturdivant, “3D Transitions and Connections,” Chapter 3 in RF and Microwave Microelectronic Packaging II (New York: Springer Publishing, 2017).

Applied Electromagnetics and Microwave Circuits

Rick Sturdivant, Ph.D. and others

  • Applied electromagnetics for RF and microwave passive and active circuits.

Publications/presentations:

  1. R. Sturdivant, “Balun Designs For Wireless … Mixers, Amplifiers and Antennas,” Applied Microwave and Wireless, Summer 1993.
  2. R. Sturdivant, “A Capacitively Coupled BPF Design Using a Suspended Substrate Stripline,” Microwave Journal, Nov. 1993, pp 71-74.
  3. R. Sturdivant, E.K.P. Chong, “Dielectric Notch Radiator Antennas with Integrated Filtering For 5G and IoT Access,” in Proceedings of the IEEE Radio and Wireless Symposium, Phoenix, AZ, January 15-18, 2017. (Published on IEEE Xplore with DOI number)
  4. R. Sturdivant and E. K. P. Chong, “Systems Engineering Baseline Concept Of A MultiSpectral Drone Detection Solution For Airports,” IEEE Access, Vol. 5, April 25, 2017, pp. 2169-3536. (Published on IEEE Xplore with DOI number)
  5. R. Sturdivant and E. K. P. Chong, “Smart base stations for IoT,” presented at Cyber Cycles for the Internet of Things (IoT), workshop at 1st IEEE Conference on Control Technology and Applications (CCTA), Kohala Coast, Hawai’i, August 27–30, 2017.

Systems Engineering Research

Rick Sturdivant, Ph.D. and others

  • Systems engineering applied to renewable energy, radar systems, active electronically scanned arrays (AESAs), and satellite systems.

Publications/Presentations:

  1. R. Sturdivant, E.K.P. Chong, “Systems Engineering Of Hybrid Renewable Electric Power,” in Proceedings of the IEEE Green Tech 2016 Conference, Kansas City, MO, April 7-8. (Published on IEEE Xplore with DOI number)
  2. R. Sturdivant, E.K.P. Chong, “Systems Engineering Contributions To Digital Receivers For Phased Array Radar,” in Proceedings of the 2016 IEEE International Symposium on Phased Array Systems and Technology, Oct. 18-21, Waltham, MA. (Published on IEEE Xplore with DOI number)
  3. R. Sturdivant, E.K.P. Chong, “Systems engineering of low cost AESAs for high volume consumer LEO satellite ground stations,” Presented at Ka and Broadband Communications Conference, Cleveland, OH, Oct. 2016. (archived at kaconf.org)
  4. R. Sturdivant and E. K. P. Chong, “Systems engineering of a terabit elliptic orbit satellite and phased array ground station for IoT connectivity and consumer Internet access,” IEEE Access, Vol. 4, Sept 13, 2016, pp. 9941-9957. (Published on IEEE Xplore with DOI number)
  5. R. Sturdivant, L. Miller, E.K.P. Chong, “Systems Engineering Of Digitally Beam Formed Electronically Scanned Phased Arrays for Terabit per Second Satellites,” in Proceedings of the IEEE Topical Workshop On The Internet of Space (IoT), Phoenix, AZ, January 15-18, 2017. (Published on IEEE Xplore with DOI number)
  6. R. Sturdivant, J. Lee, “Systems engineering of IoT connectivity in commercial airliners using satellite backhaul links,” Proceedings of the IEEE Radio and Wireless Conference, Topical Workshop On The Internet of Space, Jan 14-17, 2018, Anaheim, CA. (Published on IEEE Xplore with DOI number)
  7. E. Chang, R. Sturdivant, B. Quilici, E. Patigler, “Micro and Mini Drone Classification Based on Coherent Radar Imaging,” IEEE Radio and Wireless Week Conference, Anaheim, CA, Jan 15, 2018. (Published on IEEE Xplore with DOI number)
  8. R. Sturdivant, “Challenges and opportunities for the internet of space,” in Proceedings of Microwaves, Cubesats, and Small Satellites Workshop at IEEE Radio and Wireless Week Conference, Anaheim, CA, Jan 15, 2018.
  9. R. Sturdivant and E. K. P. Chong, “Packageability as an ‘Ility’ for Systems Engineering,” Systems, 5(4), 48, Sept 23, 2017. (Published with DOI number)

Book:

  1. R. Sturdivant, C. Quan, E. Chang, Systems Engineering of Phased Arrays (Norwood, MA: Artech House, 2018).

Renewable Energy

Rick Sturdivant, Ph.D. and others

  • Renewable energy systems

Publications/Presentations:

  1. M. Stambaugh, A. Zahnd, R. Sturdivant, J. Yeh, “Improving the utilization factor for islanded renewable energy systems,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017.
  2. R. Sturdivant, J. Yeh, M. Stambaugh, A. Zahnd, “Sustainability as a characteristic of renewable energy systems in remote Himalayan villages,” in Proceedings of the Solar World Congress, Abu Dhabi, UAE, Oct 29-Nov 2, 2017.
  3. A. Zahnd, M. Stambaugh, D. Jackson, T. Gross, C. Hugi, R. Sturdivant, J. Yeh, S. Sharma, “Modular Pico-Hydro Power System for Remote Himalayan Villages,” Presented at World Renewable Energy Congress XVI, Feb 5-9, 2017.
  4. J. Yeh, R. Sturdivant, M. Stambaugh, A. Zahnd, “Prioritized load control system for pico-hydroelectric power in the Nepal Himalayas,” In Proceedings of IEEE Green Tech 2020 Conference, Oklahoma City, OK, April 1-3, 2020. (To appear on IEEE Xplore with DOI number)

Book Chapter:

  1. A. Zahnd, M. Stambaugh, D. Jackson, T. Gross, C. Hugi, R. Sturdivant, J. Yeh, S. Sharma, “Modular Pico-Hydro Power System for Remote Himalayan Villages,” in Transition Towards 100% Renewable Energy, Springer, 2018, pp 491-499.

Research into Emergence

Rick Sturdivant, Ph.D. and others

  • Research into emergence in engineering with application to AI and robotics

Publications/Presentations:

  1. R. Sturdivant and E. K. P. Chong, “The Necessary and Sufficient Conditions for Emergence in Systems Applied To Symbol Emergence in Robots,” IEEE Transactions on Cognitive and Developmental Systems, Vol. PP, No. 99, July 24, 2017. (Published on IEEE Xplore with DOI number)
  2. R. Sturdivant, “The Incompatibility of Emergent and Thomistic Views of the Soul,” Student Paper, Presented at 59th Annual Midwest Regional Evangelical Theological Society Meeting, 2014.

Research into the relationship between science and religion

Rick Sturdivant, Ph.D.

  • Research into the relationship between science and religion

Publications/Presentations:

  1. R. Sturdivant, “The Reflective Reciprocal Support Model for Integration of Science and Christianity,” Southern California Christians in Science Conference, Riverside, CA, April 8, 2017.