FACILITY

Wet bench

RIE

CF4, SF6, O2, Ar

RTA

Ar, N2, O2

Furnace

SiO2, Diffusion doping

LPCVD

Poly-Si, SiN

ALD

HfO2, ZrO2, Al2O3

E-beam evaporator

Al, Au, Pt, Ti, Ni etc.,

Sputter

Mo, Ti, TiN, IGZO

Spin coater

Photo resist: AZ5214, GXR601, DNR-L300


Aligner

Minimum resolusion 2nm