Overview of Status of Analysis, Design, Fabrication, Tests, etc.
Preliminary analyses that can be done from project assignment details completed.
Heat transfer from controlled airflow to the silicon coupon substrate modeled using analytical solution and real physical parameters.
Power dissipation limits found to be approximately 3W, setting a target for hardware performance.
Fin-based passive heat sinks revisited from MAE 101C.
Analytical solutions relevant to project reviewed.
Fin physical parameters briefly considered (primarily mass concerns).
Accomplishments from Previous Week
Heat transfer analyses sufficient to provide basic framework of performance requirements for hardware components, qualifying forays into purchasing supplies.
Solidification of project direction (prioritization and alignment of individual focuses better this week).
Assignments for Next Week
Jayant Mathur
Investigate available power sources and temperature measurement tools (thermistor, Arduino measurements)
Begin testing of first set of purchased hardware.
Nate Goldberg
Perform preliminary analysis of potential dry ice cooling solution.
Refine previously completed simulations/calculations based on updated information.
Kristen Matsuno
Examine available heat sinks (or feasibility of custom-made structures).
Research potential alternatives based on updated project limitations (microfluidic chill plates).
Nathaniel Liu
Obtain first set of purchased hardware (pending delivery).
Characterize hardware and seek guidance from available documentation and/or manufacturer/supplier information to refine hardware selection.
Sponsor Contact and Feedback
Several project definition questions sent to sponsor, pending a response to update project parameters.
Limitations on vibration of test setup due to mass balance sensitivity?
Reconfiguration of precedent test setup permissible?
Clarification on temperature limits required - project assignment contains arbitrary wording.
Updates for Instructor
Pursuant to the guidance provided in the previous Project Definition Meeting, risk reduction was improved from simulation and MATLAB analyses to physical deliverables, namely the testing of actual thermoelectric coolers and power supplies, as well as available heat sinks.
Comments from Other Students
N/A
Risks and Areas of Concern
Spending on the project has commenced, should resolve to budget the allocated funds carefully to avoid overambitious spending.
Resources or Information Required but not Available
Precedent test setup is located in Corvallis, Oregon and is not well-documented in the project assignment briefing. Further information regarding its construction, operation, and limitations is required to refine the project definition.
Currently awaiting sponsor response to several questions regarding test setup, as well as more in-depth details not initially included.
Schedule
Tuesday 3/14 - Hardware shipment scheduled for delivery.
Wednesday 3/15 - Testing of first thermoelectric cooling plates and rudimentary power
sources.
Thursday 3/16 - Update project direction based upon results of hardware testing.
Tuesday 3/21 - Provide updated progress report.
Budget (list amount spent and amount remaining)
$24.99 - 10-pack of TEC1-12706 coolers from Amazon.
$9.99 - Single TEC1-12712 cooler from Amazon.
$1165 Remaining for hardware purchases.
$1500 Remaining for shop expenses.
Progress on Report and Webpage
Weekly progress reports scheduled, procedure for furnishing website initiated.