Overview of Status of Analysis, Design, Fabrication, Tests, etc.
Completed Individual Component Analyses, and made appropriate decisions based upon findings.
Divided tasks for Design Proposal Presentation.
Significantly improved project understanding and TE Cooler understanding, now believe solution is completely viable, with challenges in the form of meeting mass requirements.
Accomplishments from Previous Week
Returned to thermoelectric Peltier cooling.
Project requirements clarified, new minimum substrate temperature is above room temp., so definitely achievable using heat sinking to ambient air.
Several engineering personnel from multiple companies were consulted to verify project direction with TE cooling.
Greg Specht was consulted as well.
First CAD documentation of hardware assembly completed (Kristen).
Relevant engineering literature obtained for eventual thermal/electrical modeling (Nate G.)
Assignments for Coming Week
Jayant Mathur
Research available batteries and assist with CAD
Design Proposal Presentation: Review risk reduction and current project understanding
Explain recent project updates (from sponsor)
Recap justification of return to Peltier cooling despite initial risk reduction denying viability.
Nate Goldberg
Continue heat transfer analyses relevant to thermoelectric cooling (http://edge.rit.edu/content/P15611/public/Detailed%20Design%20Documents/Heat%20Transfer/Modeling-Analysis_Thermoelectrics.pdf)
Design Proposal Presentation: Current design decisions and project management.
Analyses conducted and relevant equations/results.
Project timeline and projected progress points (Gantt chart)
Kristen Matsuno
Refine CAD (distribute CAD workload accordingly)
Design Proposal Presentation: Present current design proposal and associated CAD
Explain structural choices
Discuss refinements to be made/current issues
Nathaniel Liu
Assist with CAD and next stage of thermoelectric module testing. Design "risk reduction v.2."
Design Proposal Presentation: Present hardware purchasing timeline, and go over decisions that remain to be made.
Sponsor Feedback and Corresponding Action Items
Sponsor indicated that minimum target temperature is now 30oC, which lead to the decision to revive TE cooling as an option.
Thermoelectric cooling is now the chosen solution as a direct result of sponsor feedback.
Required action: Update sponsor and inquire about depth of Chill Puck module. Depending on answer, heat sinking solution will be chosen accordingly.
Instructor Feedback and Corresponding Action Items
Professor Tustaniwskyj's skepticism about the conclusiveness of the risk reduction lead to the reconsideration of TE cooling. It has now been reselected as the primary solution route.
Also, as per Professor T.'s suggestion, 1D graphite heat sinks were considered and are now listed among the potential heat sinking solutions.
http://powerelectronics.com/content/graphite-heatsinks-copper-without-weight
Comments from Other Students
"Your project sounds pretty solid and I'm sure thermoelectric coolers will work out for you." - Former MAE student who now works at Hi-Z Technology, a thermoelectric manufacturer in San Diego.
Risks and Areas of Concern
Achieving the required degree of substrate cooling is known to be possible, but the ability to perform temperature control has not yet been fully demonstrated.
Unsure if difficulties will arise in attempting to "match" a heat sink to our chosen TEC device, to control temperature at steady-state operation.
Resources or Information Required but not Available
Must ask sponsor about depth of silicon substrate in test chamber (heated airflow). Depending on the depth, a standard-type aluminum parallel plate heat sink could be feasible.
If sponsor replies that depth cannot be too small, Professor T.'s suggestion for 1D graphite heat sink will be taken into consideration.
Schedule
Monday 4/10 - 8:00 am Team Meeting - Rehearse Design Proposal Presentation
3:00 pm Design Proposal Presentation
4:00 pm Possible meeting with Prof. T., otherwise tentative team meeting.
Wednesday 4/12 - 2:00 pm Phone call with sponsor contact (Jeremy)
5:00 pm Team meeting
Friday 4/14 - Decide on first hardware iteration based on CAD assembly (see Design Proposal Presentation)
Budget
(No changes since previous week, hardware currently in possession is enough for next stage of testing.)
$35 Spent on Risk Reduction (Winter 2017)
$1165 Remaining Budget for Equipment and Parts
Progress on Report and Webpage
Gantt chart divided into two subsections, one for class deadlines and one for strictly project progress deadlines (hardware iterations, report status, etc.).
First draft of report to be completed after Design Proposal Presentation.
Website front page updated, but nowhere near complete. Time will be allocated for this later.