Extreme Transistor Scaling In the "Silicon-Impossible" Territory
We push the physical limits of transistor performance using two-dimensional semiconductors and advanced nanofabrication techniques. Our work focuses on understanding and engineering quantum transport in atomically thin channels to enable electronics that surpass the fundamental constraints of silicon.
Our research includes:
Large-scale synthesis of high-mobility 2D semiconductors
Ballistic and near-ballistic transport in ultra-short channels
Contact engineering to reduce resistance and maximize current delivery
Material–device–process co-optimization for next-generation electronics
Through the integration of materials innovation, device physics, and scalable fabrication, we aim to establish a new paradigm for transistor scaling beyond the silicon limit.
Neuromorphic and Memory-Centric Computing
By co-designing materials, devices, circuits, and algorithms, we aim to build new computing frameworksthat go fundamentally beyond conventional digital architectures.
These next-generation hardware systems are inherently:
Energy-efficient
Compact
Tunable
Problem-aligned
Our approach treats the hardware not merely as a substrate for algorithms, but as an active computational medium whose physical laws encode useful transformations. Ultimately, we seek to demonstrate that the future of AI hardware lies in unlocking the computational power already embedded in the physics of devices.
Quantum Materials Synthesis and Integration
Our lab conducts bottom-up synthesis and heterogeneous integration of quantum materials to build functional devices at scale.
Key areas:
Wafer-scale synthesis of 2D materials
PVD/CVD growth of tellurium, MoTe₂, and novel chalcogenides
Ultra-clean transfer and deterministic placement
Integrated electronic, photonic and thermal platforms
Our synthesis efforts support the entire device research ecosystem.
Reconfigurable Metasurface & Active Thermal/Optical Devices
We develop programmable metasurfaces that dynamically control electromagnetic and thermal fields with high speed. Our research includes:
Fast-switching infrared emission and thermal patterning
Kirigami-actuated adaptive metasurfaces
Co-design of materials, mechanics, and electrothermal systems
These platforms combine tunable materials, scalable device architectures, and adaptive mechanics to enable real-time, reconfigurable field control for next-generation imaging, sensing, display, and communication technologies.