We develop metallization and integration processes for semiconductor interconnects and advanced packaging. Our research focuses on metal filling, redistribution layers, vertical interconnects, and hybrid Cu bonding for high-density integration.

We explore vapor-phase and electrochemical deposition to control thin-film nucleation, growth, and microstructure. We investigate how deposition conditions and thermal treatments shape grain size, crystallographic texture, and twin formation to tailor film properties.

We investigate metals, alloys, and interfaces for semiconductor and packaging applications. Our research connects material composition and interfacial reactions with electrical, thermal, and mechanical performance and long-term reliability.

We combine process measurements, electrochemical analysis, and machine learning to monitor and optimize semiconductor manufacturing processes. We focus on plating bath analysis, process-state estimation, quality prediction, and data-guided process optimization.