In preparation

Submitted

2026

12. Single-additive Cu microvia filling by pulse-reverse electrodeposition using DPS, Huiju Seo,# Jae Jeong Kim, Young Yoon,* Myung Jun Kim*, Electrochimica Acta, under proof

2025

11. Machine learning for voltammetric analysis of Cu electroplating additives: electrochemically-guided design for dataset structure, Wonyeong Jo,# Young Yoon,# Myung Jun Kim*, Journal of Electroanalytical Chemistry, 999, 119552 (2025)

10. Extrapolability of machine learning for determining additive concentrations in copper electrolyte, Hyunwoo Jeon,# Hyeonsu Kim,# Jeong Wuk Kim, Young Yoon, Myung Jun Kim,* Jae Jeong Kim*, Electrochimica Acta, 533, 146503 (2025)

2021

9. Machine learning to electrochemistry: Analysis of polymers and halide ions in a copper electrolyte, Young Yoon# , Myung Jun Kim,∗ Jae Jeong Kim*, Electrochimica Acta, 399, 139424 (2021)

8. Through Silicon Via Filling with Suppression Breakdown of PEG–Br– in Absence of Accelerator, Youngkeun Jeon,# Young Yoon, Myung Jun Kim,* and Jae Jeong Kim*, Journal of The Electrochemical Society, 168, 082510 (2021)

7. Acid-durable, high-performance cobalt phosphide catalysts for hydrogen evolution in proton exchange membrane water electrolysis, Young Yoon,# Hoyoung Kim, Soo-Kil Kim, Jae Jeong Kim*, International Journal of Energy Research, 45, 16842-16855 (2021)

6. The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs), Sang Hoon Jin,# Young Yoon,# Yugeun Jo, SangYul Lee, HyungSoo Moon, Seongho Seok, Myung Jun Kim,* Jae Jeong Kim,* Min Hyung Lee*, Journal of Industrial and Engineering Chemistry, 96, 376-381 (2021)

2020

5. Selective determination of PEG-PPG concentration in Cu plating bath with cyclic voltammetry stripping using iodide ion, Young Yoon,# Hyeonsu Kim , Tae Young Kim, Kyu Hwan Lee, Seunghoe Choe*, Jae Jeong Kim*, Electrochimica Acta, 339, 135916 (2020)

2019

4. Bromide Ion as a Leveler for High-Speed TSV Filling, Minjae Sung,# Young Yoon,# Jinwoo Hong, Myung Jun Kim,* and Jae Jeong Kim*, Journal of The Electrochemical Society, 166 (13) D546-D550 (2019)

3. Sulfur-Containing Additives for Mitigating Cu Protrusion in Through Silicon via (TSV), Minjae Sung,# Anna Lee,# Taeyoung Kim, Young Yoon, Taeho Lim,* and Jae Jeong Kim*, Journal of The Electrochemical Society, 166 (12) D514-D520 (2019)

2. Observation of Bis-(3-sulfopropyl) Disulfide (SPS) Breakdown at the Cu Cathode and Insoluble Anode under Open-Circuit, Unpowered Closed-Circuit, and Electrolysis Conditions, Tae Young Kim,# Minjae Sung, Young Yoon, Kyu Hwan Lee, Seunghoe Choe,* and Jae Jeong Kim*, Journal of The Electrochemical Society, 166 (8) G61-G66 (2019)

2018

1. Cyclic Voltammetry Stripping Analysis to Determine Iodide Ion Concentration in Cu Plating Bath, Young Yoon,# Yu Seok Ham, Tae Young Kim, Seunghoe Choe*, and Jae Jeong Kim*, Journal of The Electrochemical Society, 165 (5) H213-H218 (2018)