Publications
2019
- Understanding the Implications of Socket Density in Density Optimized Servers
M. Arora, M. Skach, W. Huang, X. An, J. Mars, L. Tang, D. Tullsen
IEEE Symposium on High-Performance Computer Architecture (HPCA), 2019
2018
- Implications of Integrated CPU-GPU processors on Thermal and Power Management Techniques
K. Dev, I. Paul, W. Huang, Y. Eckert, W. Burleson, S. Reda
arXiv:1808.09651
- Numerical Analysis of Rectangular Channel Heat Sink for Supercomputing Applications
X. An, M. Arora, W. Huang, I. Paul, B. Brantley
Thermal and Fluid Engineering Conference (TFEC-IWHF), 2018
2017
- Ti-States: Power Management in Active Timing Margin Processors
Y. Zu, W. Huang, I. Paul, V. Reddi
IEEE Micro, Top Picks from the 2016 Computer Architecture Conferences, May/June, 2017
- Dynamic GPGPU Power Management using Adaptive Model Predictive Control
A. Majumdar, L. Piga, J. Greathouse, I. Paul, W. Huang, D. Albonesi
IEEE Symposium on High-Performance Computer Architecture (HPCA), 2017
- Design and Analysis of an APU for Exascale Computing
T. Vijayaraghavan, Y. Eckert, G. Loh, M. Schulte, M. Ignatowski, B. Beckmann, W. Brantley, J. Greathouse, W. Huang, A. Karunanithi, O. Kayiran,
M. Meswani, I. Paul, M. Poremba, S. Raasch, S. Reinhardt, G. Sadowski, V. Sridharan
IEEE Symposium on High-Performance Computer Architecture (HPCA), 2017
2016
- Ti-states: Processor Power Management in the Temperature Inversion Region
Y. Zu, W. Huang, I. Paul, V. Reddi
International Symposium on Microarchitecture (MICRO), 2016
- Workload-Aware Power Gating Design and Runtime Management for Massively Parallel GPGPUs
K. Dev, S. Reda, W. Huang, I. Paul, W. Burleson
International Symposium on VLSI (ISVLSI), 2016
- Performance Boosting Opportunities under Communication Imbalance in Power-Constrained HPC Clusters
L. Piga, I. Paul, W. Huang
International Conference on Parallel Computing (ICPP), 2016
- A Framework for Evaluating Promising Power Efficiency Techniques in Future GPUs for HPC
K. Dev, I. Paul, W. Huang
High Performance Computing Symposium (HPC), 2016
- Measuring and Modeling On-Chip Interconnect Power on Real Hardware
V. Adhinarayanan, I. Paul, J. Greathouse, W. Huang, A Pattnaik, W-C Feng
IEEE International Symposium on Workload Characterization (IISWC), 2016
2015
- Harmonia: Balancing Compute and Memory Power in High Performance GPU
I. Paul, W. Huang, M. Arora, S. Yalamanchili
International Symposium on Computer Architecture (ISCA), 2015
- A Taxonomy of GPGPU Performance Scaling
J. Greathouse, A. Majumdar, A. Venugopal, I. Paul, W. Huang, G. Wu, K. Dev, L. Piga, C. Freitag, S. Puthoor
IEEE International Symposium on Workload Characterization (IISWC), 2015
2014
- PPEP: Online Performance, Power and Energy Prediction Framework and DVFS Space Exploration
B. Su, J. Gu, L. Shen, W. Huang, J. Greathouse, J. Wang
International Symposium on Microarchitecture (MICRO), 2014
2012
- Accurate Fine-Grained IBM POWER7+ Power Proxies
W. Huang, C. Lefurgy, W. Kuk, M. Floyd, A. Buyuktosunoglu, M. Allen-Ware, B. Brock, K. Rajamani
International Symposium on Microarchitecture (MICRO), 2012
- Power-Efficient Time-Sensitive Mapping in CPU/GPU Heterogeneous Systems
C. Liu, J. Li, W. Huang, J. C. Rubio, E. Speight, X. Lin
International Conference on Parallel Architectures and Compilation Techniques (PACT), 2012
- Some Limits of Power Delivery in Multicore Era
Runjie Zhang, Brett Meyer, Wei Huang, Kevin Skadron and Mircea Stan
Workshop on Energy Efficient Design (WEED, collocated with ISCA 2012)
- Processor-Memory Power Shifting for Multi-Core Systems
Heather Hanson, Wes Felter, Wei Huang, Charles Lefurgy, Karthick Rajamani, Freeman Rawson and Guillermo Silva
Workshop on Energy Efficient Design (WEED, collocated with ISCA 2012)
- Tiered Memory: an Iso-Power Memory Architecture to Address the Memory Power Wall
K. Sudan, K. Rajamani, W. Huang, F. Rawson, J. B. Carter
IEEE Transactions on Computers, 2012
- Architectural Implications of Spatial Thermal Filtering
K. Sankaranarayanan, B. H. Meyer, W. Huang, R. J. Ribando, H. Haj-Hajiri, M. R. Stan, and K. Skadron.
Elsevier Integration, the VLSI Joural, 2012
2011
- Scaling with Design Constraints - Predicting the Future of Big Chips
Wei Huang, Karthick Rajamani, Mircea Stan, Kevin Skadron
IEEE Micro, Special Issue on Big Chips, July/Aug, 2011
- (Best Paper Award) TAPO: Thermal-Aware Power Optimization Techniques for Servers and Data Centers
Wei Huang, Malcolm Allen-Ware, John Carter, Elmootazbellah Elnozahy, Hendrik Hamann, Tom Keller, Charles Lefurgy, Jian Li,
Karthick Rajamani, Juan Rubio
International Green Computing Conference (IGCC), 2011
- Temperature-Aware Architecture: Lessons and Opportunities
Wei Huang, Malcolm Allen-Ware, John B. Carter, Edmund Cheng, Kevin Skadron, Mircea Stan
IEEE Micro, May/June 31(3), 82-86, 2011
- Power Shifting in Thrifty Interconnection Network
J. Li, W. Huang, L. Zhang, C. Lefurgy, W. Denzel, R. Treumann, K. Wang
IEEE International Symposium on High-Performance Computer Architecture (HPCA), 2011
2010
- Thermal Modeling for Processors and Systems-on-Chip (book chapter, ISBN: 978-1-4419-6174-7)
K. Skadron, M. R. Stan, W. Huang
Processor and System-on-Chip Simulation. Eds. O. Temam and R. Leupers, Springer Inc., 2010
- Temperature-to-Power Mapping
Z. Qi, B. H. Meyer, W. Huang, R. J. Ribando, K. Skadron, M. R. Stan
IEEE International Conference on Computer Design (ICCD), 2010
- Interaction of Scaling Trends in Processor Architecture and Cooling
W. Huang, M. R. Stan, S. Gurumurthi, R. J. Ribando, and K. Skadron
IEEE Semiconductor Thermal Measurement, Modeling, and Management Symposium (Semi-Therm 26), 2010
- Exploring the Thermal Impact on Manycore Processor Performance
W. Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, and M. R. Stan
IEEE Semiconductor Thermal Measurement, Modeling, and Management Symposium (Semi-Therm 26), 2010
2009
- Differentiating the Roles of IR Measurement and Simulation for Power and Temperature-Aware Design
W. Huang, K. Skadron, S. Gurumurthi, R. J. Ribando, and M. R. Stan
In Proceedings of the IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS), 2009
2008
- Accurate, Pre-RTL Temperature-Aware Processor Design Using a Parameterized, Geometric Thermal Model
W. Huang, K. Sankaranarayanan, K. Skadron, R. J. Ribando, and M. R. Stan
IEEE Transactions on Computers 57(9), 2008
- Many-Core Design from a Thermal Perspective
W. Huang, M. R. Stan, K. Sankaranarayanan, Robert J. Ribando, and K. Skadron
ACM/IEEE Conference on Design Automation (DAC), 2008
2007
- An Improved Block-Based Thermal Model in HotSpot-4.0 with Granularity Considerations
W. Huang, K. Sankaranarayanan, R. J. Ribando, M. R. Stan, and K. Skadron.
Workshop on Duplicating, Deconstructing, and Debunking (WDDD), in conjunction with the 34th International Symposium on Computer Architecture (ISCA), 2007
- Interconnect Lifetime Prediction for Reliability-Aware Systems
Z. Lu, W. Huang, M. Stan, K. Skadron, and J. Lach
IEEE Transactions on VLSI Systems 15(2), 2007
2006
- A Design Methodology for a Low-Power, Temperature-Aware SoC Developed for Medical Image Processors
Z. Qi, W. Huang, A. Cabe, W Wu, Y Zhang, G. Rose, M. R. Stan
IEEE International System-On-Chip Conference (SOCC), 2006
- HotSpot: A Compact Thermal Modeling Method for CMOS VLSI Systems
W. Huang, M. R. Stan, K. Skadron, K. Sankaranarayanan, and S. Ghosh
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 14(5), 2006
2005
- Experiences using FPGAs for Temperature-Aware Microarchitecture Research
S. Velusamy, W. Huang, J. Lach, M. Stan, and K. Skadron
Workshop on Architecture Research using FPGA Platforms (WARFP), in conjunction with HPCA, 2005
- Parameterized Physical Compact Thermal Modeling
W. Huang, K. Skadron, and M. R. Stan
IEEE Transactions on Component Packaging and Manufacturing Technology 28(4), 2005
- The Need for a Full Chip and Package Thermal Model for Thermally Optimized IC Designs
W. Huang, E. Humenay, K. Skadron, and M. R. Stan
ACM/IEEE International Symposium on Low-Power Electronics Design (ISLPED), 2005
- Monitoring Temperature in FPGA based SoCs
S. Velusamy, W. Huang, J. Lach, M. R. Stan, and K. Skadron
IEEE International Conference on Computer Design (ICCD), 2005
- Analytical Model for Sensor Placement on Microprocessors
K.-J. Lee, K. Skadron, W. Huang
IEEE International Conference on Computer Design (ICCD), 2005
2004
- Physically-Based Compact Thermal Modeling -- Achieving Parameterization and Boundary Condition Independence
W. Huang, M. R. Stan, and K. Skadron
International Workshop on Thermal Investigations of ICs (THERMINIC), 2004
- Temperature-Aware Microarchitecture: Modeling and Implementation
K. Skadron, K. Sankaranarayanan, S. Velusamy, D. Tarjan, M.R. Stan, and W. Huang
ACM Transactions on Architecture and Code Optimization 1(1), 2004
- The Need for a Computer-Architecture Approach to Thermal Management in Computer Systems
K. Skadron, M.R. Stan, W. Huang, K. Sankaranarayanan, Z. Lu, and J. Lach
IEEE International Conference on Thermal, Mechanical and Thermo-Mechanical Simulation and Experiments in Micro- electronics and Micro-systems (EuroSimE), 2004
- Compact Thermal Modeling for Temperature-Aware Design
W. Huang, S. Ghosh, K. Sankaranarayanan, K. Skadron, and M. R. Stan
ACM/IEEE Design Automation Conference (DAC), 2004
- Interconnect Lifetime Prediction under Dynamic Stress for Reliability-Aware Design
Z. Lu, W. Huang, J. C. Lach, M. R. Stan, and K. Skadron
IEEE/ACM International Conference on Computer Aided Design (ICCAD), 2004
2003
- HotSpot: A Dynamic Compact Thermal Model at the Processor-Architecture Level
M. R. Stan, K. Skadron, M. Barcella, W. Huang, K. Sankaranarayanan, and S. Velusamy
Microelectronics Journal: Circuits and Systems 34(12), Elsevier, 2003
- Temperature-Aware Computer Systems: Opportunities and Challenges
K. Skadron, M.R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan
IEEE Micro, Top Picks from the 2003 Computer Architecture Conferences, May/June 2003
- (Best Student Paper Award) Temperature-Aware Microarchitecture
K. Skadron, M. R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, and D. Tarjan
International Symposium on Computer Architecture (ISCA), 2003
2002
- HotSpot: Techniques for Modeling Thermal Effects at the Processor-Architecture Level
K. Skadron, M. Stan, M. Barcella, A. Dwarka, W. Huang, Y. Li, Y. Ma, A. Naidu, D. Parikh, P. Re, G. Rose, K. Sankaranarayanan, R. Suryanarayan, S. Velusamy, H. Zhang, Y. Zhang
International Workshop on Thermal Investigations of ICs (THERMINIC), 2002