Awards & Achievements
Awards:
#3 top-cited paper in 2006 Classics in Computer Hardware Design , based on Google Scholar statistics as of 2017.
Top Picks by IEEE Micro Magazine, 2016 and 2003 (Top 1% acceptance rate among all computer architecture paper submissions in that year).
IBM High-Value Patent, 2014
Best Paper Award at International Green Computing Conference (IGCC) 2011.
Second Place Winner, System-on-Chip Design Challenge (Phase 2), sponsored by Semiconductor Research Corporation (SRC), 2006.
First Place Winner, System-on-Chip Design Challenge (Phase 1), sponsored by Semiconductor Research Corporation (SRC), 2005.
Best Student Paper Award at International Symposium on Computer Architecture (ISCA), 2003.
Software:
HotSpot thermal modeling tool at http://lava.cs.virginia.edu/HotSpot/ , with thousands of downloads (and still counting...) from industry and academia.