We are specifically interested in Bulk Thermoelectric materials for Power Generation in the intermediate temperature range (300 K - 700 K). Some of our research activities are listed below:
(A) Material Property Improvement by Tuning Electrical & Thermal Properties
Material systems which are currently being investigated are solid solutions of Mg2Si-Mg2Sn, ZnSb-CdSb and Mg3Sb2-Mg3Bi2. Solid solutions are known to possess better thermoelectric properties compared to the end members. This is due to the possibility for tuning both the electrical and thermal properties by varying the chemical composition. Our work involves improving TE properties in these solid solutions using a combination of conventional techniques and material specific effects identified from our research.
Some of the recent activities are given below
· Incorporation of embedded nano-precipitates in Mg2Si0.3Sn0.7 for zT improvement
n-type Mg2Si1-xSnx solid solutions have high TE performance due to electronic band convergence effect coupled with enhanced phonon scattering due to alloying. In this work, further reduction of the lattice thermal conductivity was attempted by scattering of the mid wavelength phonons. This was carried out by incorporation of embedded nano-precipitates in the Mg2Si0.3Sn0.7 matrix which resulted in a record peak zT value in silicide based TE materials.
zT enhancement due to formation of embedded nano-precipitates
· Bond Anharmonicity and its Influence on lattice thermal conductivity in Zn1-xCdxSb solid solutions
Solid solution formation results in lowering of lattice thermal conductivity (kL) due to additional scattering of phonons from mass and strain disorder. However, experimental studies in ZnSb-CdSb solid solutions indicate kL values which are lower than the predicted alloy scattering limit. Detailed theoretical investigations indicate significant contribution to phonon scattering from anharmonic bonds which are present in such electron-poor semiconductors
Reduction in lattice thermal conductivity due to combined effect of alloy scattering and bond anharmonicity.
(B) Modelling of Electronic Band Structure of TE materials
Band structure modelling is a topic of interest in TE research as it provides valuable information regarding microscopic material parameters and also for predicting high performance compositions. The modelling work carried out in our group can be subdivided into (i) Solution based approach and (ii) Fitting based optimization approach. The Solution approach involves determined mathematical problems where band models (single/multiband) are chosen in a way to satisfy the solvability criterion at every step. While this is a powerful tool which is commonly used for its predictive ability, it is based on certain assumptions which are necessarily always valid. To overcome this problem, we also adopt a Fitting based optimization approach which can handle multiple parameters at the same time.
Some of the modelling related activities are given below:
Predicting high performance compositions in p-type Mg2Si-Mg2Sn solid solutions
The search for the best p-type Mg2Si1-xSnx (x=0-1) involves finding both the best Si to Sn ratio (x) and the optimal doping concentration (n). A theoretical study for this was performed using semi-classical Boltzmann Transport Equation and Single Parabolic Band (SPB) modelling. The obtained data was plotted as 2D maps of n vs x at various temperatures to identify the suitable compositions.
A software written in MATLAB was developed for the SPB analysis of thermoelectric data.
A 3D zT map at 500K for Mg2Si-Mg2Sn system. From this we can extract the optimum charge carrier concentration and Tin-fraction for getting the best thermoelectric efficiency.
Studying Band Convergence in Mg2Sn using Multiband Fitting technique
A multiband fitting technique has been developed to study temperature dependent changes in the electronic band structure of semiconductors. This technique was used to probe the effect of doping in Mg2Sn and reveal changes in the conduction band edge not reported earlier in this material.
The interband separation between the two CB in Mg2Sn is shown to change as a function of doping and temperature.
(C) Contacting Studies and TE Device Fabrication
Our research also involves developing suitable electrodes (contacting) and lab scale TE modules from the in-house developed materials. Some activities related to this are provided below
Multilayer approach for contacting of TE solid solutions
Contacting of TE materials is typically sensitive to changes in the chemical composition due to associated thermal expansion coefficient mismatch with the diffusion barrier layer. To overcome this problem, a multilayer approach has been attempted with each layer having different functionalities. In this process, an intermediate layer which is a mixture of diffusion barrier material and the TE material is provided. Additionally, a top metallic layer facilitates the joining with the metal interconnects.
The various layers in the contacted material along with contacted legs of Mg2Si0.3Sn0.7
Mg2Si based TE module for Power Generation
A low-cost TE module consisting of both n & p legs made of Mg2Si0.3Sn0.7 was fabricated. Electroding of the legs were carried out using the multi-layer approach. Measurements indicate a decent power density of 0.5 W/cm2 and conversion efficiency of 5%.
I-V characteristics and Power output measured on the fabricated TEG module
(D) Thermoelectric Measurement and Instrumentation
The uncertainty associated with measurement of TE properties at elevated temperatures can be quite high. Even with the best measurement practices, the cumulative error in zT can be as high as 20%. Thus, at times it is difficult to distinguish between real advancements and erroneous data. Further, high uncertainties in measured TE properties affect the modelling output leading to false predictions. Thus, improving TE measurement methodologies and practices is a field of research in itself. We are currently studying ways to improve the accuracy of the Seebeck coefficient data and discussed below
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Multi-Probe method for accurate measurement of Seebeck Coefficient
The uncertainty in S measurement depends mainly on the nature of the thermal coupling of the specimen to the surrounding. Currently, we are developing a method in which using multiple measurement probes it is possible to quantify the error in the measured S value.
The a custom multi-probe apparatus was devloped for measuring the Seebeck coefficient and electrical conductivity of thermoelectric materials. This setup is completely automated and interfaced with a PC.
These are the measured voltage and temperature profiles of multiple probes for a sample measurement at ~372degC.
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