Projected CAGR: 23.8%
The UK TGV technology market is being driven by rapid adoption in high-density packaging, edge computing, 5G infrastructure, and miniaturized consumer electronics. TGV’s key advantage lies in enabling ultra-dense interconnects via glass substrates, crucial for stacking multiple die and large-area RF components with low loss. This trend is particularly evident in RF/mmWave modules designed for 5G base stations, which demand high-frequency electrical integrity and thermal stability—areas where glass provides clear advantages over silicon
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Alongside packaging innovation, there is a strong uptick in TGV use within CMOS image sensors for smartphones, automotive cameras, drones, and AR/VR devices. The UK electronics design community is integrating TGV solutions to achieve advanced lens-to-die stack-ups, enabling higher resolution in thinner form factors. The increasing shift toward automotive-grade TGV for radar and LiDAR within Autonomous Vehicle and ADAS ecosystems also supports adoption—the technology meets high-performance reliability and temperature requirements
Additionally, the growth of TGV in medical and bio-device sectors is notable: smaller lab-on-chip systems, implantable sensors, and diagnostic devices are adopting this advanced packaging due to its biocompatibility, thermal tolerance, and signal fidelity. On the infrastructure front, IoT, 5G, and edge computing are driving demand for ultra-fast, low-loss RF packages leveraging TGV. As UK semiconductor design and packaging operations scale, this trend is expected to shape future manufacturing roadmaps ().
Key Trends:
Advanced RF/mmWave applications in 5G modules and base stations.
TGV deployment in CMOS imagers (smartphones, automotive, drones).
Adoption in automotive radar, LiDAR modules, and ADAS electronics.
Integration in medical diagnostics and miniaturized bio-electronics.
Growth in IoT/edge device packaging for high-frequency, low-loss interconnects.
Although UK is the focus, global regional trends offer essential insights. Asia-Pacific leads global TGV revenue share at ~40%, fueled by semiconductor manufacturing in China, Taiwan, South Korea, and Japan (This region exhibits rapid capacity expansion in packaging and RF technologies, creating supply and innovation opportunities for UK design houses aiming to license or co-develop advanced TGV substrates.
North America maintains approximately 30–38% market share, supported by strong R&D frameworks, packaging innovation, and public-private funding via legislation such as the CHIPS Act (). UK collaboration with US packaging research centers enhances capability sharing and joint development of next-gen TGV solutions.
Europe, including the UK, holds 18–20% of the global market (). Key drivers include automotive electronics, medical device miniaturization, and expanding 5G infrastructure. EU-wide digital transformation programs and automotive electrification fuel regional demand for TGV, while UK fabless design houses capitalize on Glass Interposer expertise.
In Latin America, market presence is emerging (~5%), primarily driven by small electronics assembly and IoT deployment While penetration is limited, early-stage innovation could open future opportunities. MEA follows suit with similar low share (~3–5%), supported by infrastructure investment and rising tech ecosystems ().
Regional Highlights:
Asia-Pacific: Largest volume, advanced manufacturing, mmWave & RF applications.
North America: Innovation-led, high R&D, CHIPS Act funding.
Europe (UK): Automotive, medical, and 5G-driven TGV adoption.
Latin America: Early-stage rollouts in IoT & electronics.
MEA: Selective infrastructure deployment enabling gradual growth.
TGV technology facilitates conductive vertical interconnects in glass wafers. Glass substrates provide superior dielectric properties (e.g., low loss, high insulation), thermal stability, and dimensional control—crucial for mmWave, RF ICs, image sensors, and high-performance computing modules. UK applications include glass interposers for smartphones, radar/LiDAR, medical implants, and 5G modules.
Core technologies include laser drilling to create microvias, metal filling (e.g., copper, gold), and wafer processing on 200–300 mm glass platforms TGV is essential in enabling 3D stacked systems, offering both size reduction and performance enhancement. UK efforts in specialized 3D packaging align well with regional semiconductor strategy and broader EU/UK manufacturing initiatives.
Applications range across:
Consumer devices: wearables, foldables, smartphones leveraging compact interconnects.
Automotive systems: Radar, LiDAR, ADAS modules.
Medical devices: implantable sensors, diagnostic systems.
Telecom infrastructure: 5G/mmWave filters, antenna-in-package, and edge computing modules.
Industrial & aerospace: ultra-high-frequency modules for sensors and navigation.
Strategically, scaling TGV supports UK ambitions in advanced packaging sovereign capabilities, enabling local design-to-deploy logic, while aligning with global supply chain trends and wafer-fab strategies supported by government initiatives (OpenPR).
Market Scope Summary:
Substrates: 150 mm to 300 mm wafers.
Technologies: micro-drilling, metallization, 3D packaging.
Applications: RF/mmWave, imaging, automotive electronics, medical devices.
End-Use: Consumer, automotive, healthcare, telecom, industrial.
By Type
TGV substrates are segmented based on wafer size: 300 mm dominates (~47–55% share), followed by 200 mm (~35–38%), and below 150 mm (~15%) The 200 mm segment is growing fastest (~12% CAGR) due to its suitability in mid-range consumer and automotive modules requiring cost-effective packaging. Meanwhile, 300 mm leads in high-performance RF/mmWave and image sensor segments.
300 mm: high-end performance use cases (telecom, aerospace).
200 mm: growing mid-market/automotive modules.
<150 mm: niche, prototyping, and low-volume applications.
By Applicationr electronics, automotive, medical/biotech, telecom/RF, and others (). Consumer electronics holds ~30–50%, automotive ~28–30%, medical ~35–40% in wafer share, with telecom and industrial gaining momentum. Consumer wearables and mobile devices show rapid growth; automotive and medical sectors expand steadily with increasing TGV utilization for reliability and miniaturization.
Consumer & wearables: miniaturized packages.
Automotive: radar/LiDAR and EV systems.
Medical/Biotech: diagnostics, implantables.
Telecom/RF: 5G/mmWave modules, edge nodes.
Others: aerospace, industrial sensors.
By End User
End users comprise electronics manufacturers, automotive OEMs/fleet integrators, medical device firms, telecom infrastructure providers, and aerospace/defense integrators. Consumer electronics producers drive high-volume TGV adoption. Automotive OEMs focus on ADAS/EV modules. Medical device firms integrate TGV for performance and reliability. Telecom firms adopt in mmWave modules for small cells and base stations. Defense/aerospace sectors use TGV for high-frequency radars and avionics.
Electronics OEMs: main volume drivers.
Automotive integrators: radar/LiDAR modules.
Medical device makers.
Telecom infrastructure vendors.
Defense/aerospace integrators.
Key drivers include:
Miniaturization and High-Frequency Demand: Consumer electronics — foldables, wearables — and mmWave telecom elements require compact, low-loss packaging, favoring TGV adoption
5G Infrastructure & RF Integration: TGV excels in high-frequency dielectric performance, essential for telecom base stations and RF front-end modules. UK’s network roll-out supports positive growth ().
Automotive Electrification & Autonomous Systems: Growing usage of radar, LiDAR, and sensor arrays in EVs/ADAS propels demand for reliable, compact packaging ().
Medical Tech & Biotechnology: Diagnostics, implantables, and lab-on-chip devices need precise, stable packaging that TGV provides ().
Government and Industrial Investment: UK/EU R&D efforts, along with North American and Asian funding, support advanced packaging development and onshore capability
Miniaturization in consumer devices.
5G/mmWave rollout demand.
ADAS and autonomous vehicle sensor modules.
Medical device advances.
Public-sector R&D and semiconductor policy support.
Despite its potential, TGV faces key constraints:
High Manufacturing Cost: Specialized glass processing, laser drilling, and metallization equipment increase capex, limiting SMEs. Leading reports cite cost as primary barrier
Yield & Defect Challenges: Maintaining low-defect drilling/hole-closing at micro-scale impacts scalability and throughput ().
Standardization Gaps: No universal standards for TGV materials/processes, complicating supply chain cohesion
Regional Spectrum & Customization Costs: Varying telecom band usage across markets leads to customization needs and increased per-unit cost.
Limited Awareness/Adoption in Some Sectors: Sectors like aerospace or lower-tier industrial markets are slower to adopt TGV, creating limited demand diversity
High capex for specialized manufacturing.
Yield and defect management.
Lack of process/material standardization.
Regional customization needs.
Slow adoption in select markets.
Q1: What is the projected TGV technology market size and CAGR from 2025 to 2032?
A1: The UK Through Glass Via (TGV) Technology Market is on course for a CAGR of 23.8% during 2025–2032
Q2: What are the key emerging trends in the UK TGV market?
A2: Key trends include high-frequency RF/mmWave adoption, miniaturization for mobile and wearable devices, automotive radar/LiDAR packaging, and medical device integration.
Q3: Which segment is expected to grow the fastest?
A3: The 200 mm wafer segment is expected to grow fastest (~12% CAGR), driven by mid-tier consumer product and automotive electronics demand
Q4: What regions are leading TGV technology market expansion?
A4: Asia-Pacific leads in volume and manufacturing capability; North America leads in R&D-driven adoption; Europe/UK focuses on automotive, medical, and 5G-based systems.
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