Electronic Adhesives for PCB Board Level Assembly Market size is estimated to be USD 2.5 Billion in 2024 and is expected to reach USD 4.8 Billion by 2033 at a CAGR of 8.5% from 2026 to 2033.
The Electronic Adhesives for PCB Board Level Assembly Market was valued at approximately USD 4.78 billion in 2022 and is expected to grow at a Compound Annual Growth Rate (CAGR) of 7.6% from 2022 to 2030. This growth is driven by the increasing demand for miniaturized and high performance electronic devices across consumer electronics, automotive, and industrial sectors. The market is witnessing a surge in adoption of surface mount technology (SMT), flexible printed circuit boards (FPCBs), and advanced packaging solutions that require high reliability adhesive materials with excellent thermal conductivity and low curing temperatures. Among the product types, electrically conductive adhesives held a significant share due to their usage in high frequency and high density circuitry. Epoxy based adhesives continue to dominate the material segment, attributed to their strong mechanical properties and thermal stability. Regionally, Asia Pacific accounted for the largest share of the global market in 2022, with an estimated valuation exceeding USD 2.1 billion, driven by the robust electronics manufacturing infrastructure in China, South Korea, Japan, and Taiwan. North America followed as the second largest market, supported by advancements in automotive electronics and aerospace applications, with a market size of around USD 1.15 billion. Europe also demonstrated steady demand, particularly in Germany and France, where the automotive and industrial control sectors are strong. Latin America and the Middle East & Africa represent emerging markets with expanding opportunities due to the rising penetration of consumer electronics and growing investments in local manufacturing. Key growth opportunities include bio based adhesives, low temperature curing materials for heat sensitive applications, and increased R&D investments in hybrid adhesive formulations for multifunctional electronic assemblies.
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Henkel
DELO Industrial Adhesives
Namics Corporation
3M
H.B. Fuller
Dymax
Nagase
Jiangsu Hhck Advanced Materials
Darbond Technology
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By the year 2030, the scale for growth in the market research industry is reported to be above 120 billion which further indicates its projected compound annual growth rate (CAGR), of more than 5.8% from 2023 to 2030. There have also been disruptions in the industry due to advancements in machine learning, artificial intelligence and data analytics There is predictive analysis and real time information about consumers which such technologies provide to the companies enabling them to make better and precise decisions. In addition, new innovative techniques such as mobile surveys, social listening, and online panels, which emphasize speed, precision, and customization, are also transforming this particular sector.
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Growing demand for below applications around the world has had a direct impact on the growth of the Global Electronic Adhesives for PCB Board Level Assembly Market
Epoxy Adhesives
Silicone Adhesives
Polyurethane Adhesives
Acrylic Adhesives
Cyanoacrylate Adhesives
Screen Printing
Dispensing
Stamping
Manual Application
Automated Application
Consumer Electronics
Automotive
Aerospace
Telecommunications
Medical Devices
Heat-Cured Adhesives
UV-Cured Adhesives
Moisture-Cured Adhesives
Room Temperature Cure Adhesives
Dual Cure Adhesives
Thermosetting Adhesives
Thermoplastic Adhesives
Conductive Adhesives
Non-Conductive Adhesives
Flame Retardant Adhesives
US (United States, US and Mexico)
Europe (Germany, UK, France, Italy, Russia, Turkey, etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil, Argentina, Columbia, etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
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1. Introduction of the Global Electronic Adhesives for PCB Board Level Assembly Market
Overview of the Market
Scope of Report
Assumptions
2. Executive Summary
3. Research Methodology of Verified Market Reports
Data Mining
Validation
Primary Interviews
List of Data Sources
4. Global Electronic Adhesives for PCB Board Level Assembly Market Outlook
Overview
Market Dynamics
Drivers
Restraints
Opportunities
Porters Five Force Model
Value Chain Analysis
5. Global Electronic Adhesives for PCB Board Level Assembly Market, By Type
6. Global Electronic Adhesives for PCB Board Level Assembly Market, By Application
7. Global Electronic Adhesives for PCB Board Level Assembly Market, By Geography
US
Europe
Asia Pacific
Rest of the World
8. Global Electronic Adhesives for PCB Board Level Assembly Market Competitive Landscape
Overview
Company Market Ranking
Key Development Strategies
9. Company Profiles
10. Appendix
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