Figure 1. (top): Synthesis of GO and RGO materials/Sinteza materialelor GO si RGO. (bottom): SEM (a-b) and TEM (c-d) images of GO (a, c) and RGO (b, d)./Imagini SEM (a-b) si TEM (c-d) infatisand GO (a, c) si RGO (b, d).

Figure 2. (a) PMMA/RGO TIM placed on the heat sink./TIM-ul PMMA/RGO plasat pe disipatorul de caldura. (b) View of the other side of the heat sink./Cealalata fata a disipatorului de caldura.

Figure 3. (a) Electronic circuitry along with the areas, in blue, that will interface through the TIM with the heat sink./ Circuitele electronice impreuna cu zonele in albastru care formeaza interfata cu disipatorul de caldura. (b) Blue interface areas corresponding to the heat sink./ Zonele albastre corespunzatoare disipatorului de caldura.

Figure 4. The exterior of a demonstrator containing the electronic circuitry and the heat sink, both connected via the PMMA/RGO TIM./ Exteriorul unui demonstrator ce contine circuitele electronice si disipatorul de caldura "lipite" cu ajutorul TIM-ului de tip PMMA/RGO.