(1): jjcheng.me03g@nctu.edu.tw
(2): jjchen199201@gmail.com
Tel:03-5712121 ext.55194
a. Education
1. B.S. Mechanical Engineering, National Chiao Tung University (2010/09 ~ 2014/07)
2. Ph.D, Mechanical Engineering, National Chiao Tung University (2014/09 - )
b. Certification and License
1. Certificate of completion of VLSI Training Course-Advance Processing for VLSI Technology, National Nano Device Laboratories, Taiwan
2. Certificate of completion of VLSI Laboratory Course-Advance Processing Equipments, National Nano Device Laboratories, Taiwan.
3. Certificate of completion of VLSI Laboratory Course-Nano Matrology Technology, National Nano Device Laboratories, Taiwan.
4. Certificate of completion of VLSI Laboratory Course-High Frequency Measuring Technology, National Nano Device Laboratories, Taiwan.
c. Publication
1. Chin-Chung Chen, Tien-Kan Chung*, Chi-Cheng Cheng, Chia-Yuan Tseng, " A Novel Miniature Thermomagnetic Energy Harvester", SPIE Conference on Smart Structure and Materials+Nondestructive Evaluation and Health Monitoring (Smart Structures/NDE), 9057-32, USA, 2014.
2. Chih-Cheng Cheng, Tien-Kan Chung*, Chin-Chung Chen, Hsin-Min Wang, 2015, “A Novel Thermomagnetic Rotational-Actuator", ASME 2015 Conference on Smart Materials, Adaptive Structures and Intelligent Systems (SMASIS2015), Colorado Springs, Colorado, USA,2015.
3. Yu-Jen Chen, Tien-Kan Chung*, Po-Jung Lin, Chiao-Fang Hung, Hou-Jen Chu, Shin-Hung Lin, Chih-Cheng Cheng, 2016, “Electrical Control of Magnetic Multi-domain Transformation in a Specific Geometric-patterned Ni Nanostructure on a Piezoelectric [Pb(Mg1/3Nb2/3)O3]0.68–[PbTiO3]0.32 Substrate,” 25th ASME Annual Conference on Information Storage and Processing Systems (ISPS2016), San Jose, USA, 2016.
4. Chih-Cheng Cheng, Tien-Kan Chung*, Chin-Chung Chen, and Wang Hsin Min, A Rotational-Actuator Using a Thermomagnetic-Induced Magnetic Force Interaction , IEEE Transaction on Magnetics (RF: 169/262=64.5%, Engineering, Electrical & Electronic, IF: 1.243), 54, 1, pp8200108-, (SCI)
d. Research Interests
1. Smart Materials
2. MEMS
3. Wireless Sensing System
e. Technical Skills
Nano/Micro Fabricating Techniques
1. Lithography:
a.Spinner & Mask Aligner
b. E-beam Lithography
2. Physical Vapor Deposition:
a. Sputtering
b. E-Beam Evaporator
3. Chemical Vapor Deposition:
4. Etching
a. Wet Bench
5. Sol-Gel Process
a. PZT Thin Film
6. Metrology Analysis:
a. Atomic Force Microscopy (AFM)
b. Magnetic Force Microscopy (MFM)