Equipment

EQUIPMENT LIST

Plasma-enhanced chemical vapor deposition (PECVD) system was installed for a variety of thin films applicable for electronic devices manufacturing. One advantage of our synthesis approach using the PECVD method is that thin films can be deposited at low temperatures. Due to the energy delivered by the plasma in the PECVD, the process is available at low temperatures including room temperature, which is crucial for flexible electronics applications. The main deposition parameters for good quality thin films are the substrate temperature, pressure, power, precursor types, precursor ratios, and reactant gases.

Printed electronics are of increasing interest in the advanced electronic devices manufacturing. Metal nanoparticles are used to fabricate electrodes, interconnects, or circuits in various electronic devices. To realize those conductive patterns, printing and sintering of metal nanopartcles are required. The dispenser + 3D printer system and thermal sintering stage were built for printing and sintering processes, respectively.

• Dispenser for metal nanoparticles inks/pastes

• 3D Printer

• Thermal sintering stage with hot plate and vacuum pump