#equally contributed, *corresponding author
113. “Through-silicon via filling with a single suppressor: Interactions between suppressors and halide ions”, Youngkeun Jeon,... Myung Jun Kim,* Young Gyu Kim,* and Jae Jeong Kim*
112. “Accelerator-assisted Zn redox cycling to improve the reversibility of Zn anodes in aqueous Zn-ion batteries”
111. “Integrated electrochemical system for Li recovery and H2 production via cation exchange membrane electrodialysis”, T. B. Ngoc Huynh, Seungmin Lee, Jihyeok Song, Hui Won Eom, Myung Jun Kim,* and Oh Joong Kwon*
110. “Effects of electrodeposited Cu microstructure on interfacial reactions and joint integrity in Sn3.0Ag0.5Cu–Cu solder joints”, Da-Gyeong Han, Jeongho Lee, Myung Jun Kim* and Jeong-Won Yoon*
109. “Cysteine–halide ion synergy for suppressing side reactions on Zn anodes in AZIBs”, Jiwoo Oh, Hana Lim, and Myung Jun Kim*
108. “Machine learning for voltammetric analysis of Cu electroplating additives: Electrochemically-guided design for dataset structure”, Wonyeong Jo, Young Yoon, and Myung Jun Kim*
107. “Additive-directed electrodeposition of Ag nanoplates for electrochemical H2O2 detection”, Seolim Yoon, Yu Jin Min, and Myung Jun Kim*
106. “Single-additive TSV filling achieved with a tris-ammonium-based suppressor”, Haejin Kwak,# Youngran Seo,# Hui Won Eom, Thomas P. Moffat, Dongwon Yoo*, and Myung Jun Kim*
105. "Unraveling the anisotropic growth mechanism of Au nanorods directed by CTA+, Br-, and Ag+", Yu Jin Min,# Eun Mi Kim,# Seolim Yoon, Kristen A. Fichthorn,* and Myung Jun Kim*
104. "Ultrasmooth and thin pheomelanin-like film as a metal-free electrocatalytic enhancer", Chan Yeon Kim, Jae Ryeol Jeong, Seong Ah Jo, Jun Seok Park, Joowon Choi, Myung Jun Kim, Minho Kim,* Min Hyung Lee,* and Kyungtae Kang*
103. "Selectivity control with concurrent enhancement of inhibition in Cu/SiO2 CMP via polyvinylpyrrolidone adsorption", Hosin Hwang, Jinhyoung Lee, Seunghwan Lee, Ziyang Wang, Dayoung Yu, Hyeongjeong Lee, Haejin Kwak, Hyunho Kim, Myung Jun Kim, and Taesung Kim*
102. "Water-attracting adsorbates for enhancing the cyclability of Zn anodes in aqueous Zn-ion batteries", Hana Lim,# Dongju Kim,# Jiwoo Oh, Eunseo Yoo, Junyoung Mun,* Minho Kim,* and Myung Jun Kim* J. Mater. Chem. A, 13, 31497 (2025). LINK
101. “Formation of twin structures via Cu electrodeposition with SPS and Cl-”, Jeongho Lee, Yoojin Hwang, and Myung Jun Kim* Mater. Sci. Eng. B, 322, 118634 (2025). LINK
100. "Iridium-based mixed transition metal oxide (Ir3MOx, M = Ni, Co, Fe) incorporated in the conducting layer as an electrocatalyst for boosting the oxygen evolution reaction", T. B. Ngoc Huynh, Hyun-Jong Kim, Hui Won Eom, Myung Jun Kim* and Oh Joong Kwon* Small, 23, 2505937 (2025). LINK
99. “Pulse electrodeposition of Sn-Bi low-temperature solder with phloroglucinol”, Yoojin Hwang, Jeongho Lee, and Myung Jun Kim* Electrochim. Acta, 535, 146661 (2025). LINK
98. "Extrapolability of machine learning for determining additive concentrations in copper electrolyte", Hyunwoo Jeon, Hyeonsu Kim, Jeong Wuk Kim, Young Yoon, Myung Jun Kim,* and Jae Jeong Kim* Electrochim. Acta, 533, 146503 (2025). LINK
97. “Pretreatments for photoresist-patterned wafer to improve Cu pillar electrodeposition”, Soo Woong Park, Myung Jun Kim,* and Jae Jeong Kim* J. Ind. Eng. Chem., 145, 403 (2025). LINK
96. "Quantitative analyses of DPS and PEG-PPG in Cu electrolyte using machine learning with artificial neural networks", Jeong Wook Kim, Huiju Seo, Myung Jun Kim,* and Jae Jeong Kim* Electrochim. Acta, 514, 145640 (2025). LINK
95. “Amorphous IrOX Nanoparticles on Squared Carbon Islands for Enhancing Proton Exchange Membrane Water Electrolysis ”, T. B. Ngoc Huynh, Miseung Kim, Seungmin Lee, Hyun-Jong Kim, Yung-Eun Sung,* Myung Jun Kim,* and Oh Joong Kwon* J. Alloy. Compd, 1010, 177399 (2025). LINK
94. “Enhancing proton exchange membrane water electrolysis with a checkered carbon matrix containing Ir-Ru nanoparticles”, T. B. Ngoc Huynh, Jihyeok Song, Hyo Eun Bae, Yung-Eun Sung,* Myung Jun Kim,* and Oh Joong Kwon* Adv. Energy Mater., 14, 2402179 (2024). LINK
93. “Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition", Hui Won Eom, Haejin Kwak, Chung-Mo Yang, Woon Young Lee, Min Hyung Lee, and Myung Jun Kim* Electrochim. Acta, 503, 144879 (2024). LINK
92. “Enhancement of heat dissipation in β-Ga2O3 Schottky diodes through Cu-filled thermal vias: experimental and simulation investigations", Younghyun You, Hui Won Eom, Jehwan Park, Myung Jun Kim,* and Jihyun Kim,* J. Mater. Chem. C, 12, 11094 (2024). LINK
91. “Cu microvia filling by pulse-reverse electrodeposition with a single accelerator”, Huiju Seo, Jounghee Kim, Jungkyu Kang, Jong-Eun Park, Myung Jun Kim,* and Jae Jeong Kim,* Electrochim. Acta, 490, 144279 (2024). LINK
90. “Heat treatment for enhancing Ir-based catalysts enclosed in a carbon layer for electrochemical oxygen evolution reaction”, T.B. Ngoc Huynh, Yeongeun Choi, Min Hyung Lee, SeKwon Oh, Myung Jun Kim,* and Oh Joong Kwon,* ACS Sustainable Chem. Eng., 11, 15124-15134 (2023). LINK
89. “A cracked carbon matrix decorated with amorphous IrOx for boosting the oxygen evolution reaction in electrochemical water splitting”, T.B. Ngoc Huynh, Dohyeon Lee, Soo-Kil Kim, Myung Jun Kim,* and Oh Joong Kwon,* J. Mater. Chem. A, 11, 14221-14231 (2023). LINK
88. “Ir–Ru electrocatalysts embedded in N-doped carbon matrix for proton exchange membrane water electrolysis”, T.B. Ngoc Huynh, Jihyeok Song, Hyo Eun Bae, Youngkwang Kim, Michael D. Dickey, Yung-Eun Sung,* Myung Jun Kim,* and Oh Joong Kwon,* Adv. Funct. Mater., 33, 2301999. (2023). LINK
87. “Shape control of metal nanostructures by electrodeposition and their applications in electrocatalysis”, Kyeong-Rim Yeo,# Jooyoung Eo,# Myung Jun Kim,* and Soo-Kil Kim,* J. Electrochem. Soc., 169, 112502 (2022). LINK
86. “Electrodeposition of nanotwinned Cu and their applications in electronics”, Soo Woong Park,# Hui Won Eom,# Myung Jun Kim,* and Jae Jeong Kim,* J. Electrochem. Soc., 169, 112503 (2022). LINK
85. “Improving the performance of aqueous zinc-ion batteries by inhibiting zinc dendrite growth: recent progress”, Van-Chuong Ho,# Hana Lim,# Myung Jun Kim,* and Junyoung Mun,* Chem.-Asian J., 17, e202200289 (2022). LINK
84. “Eight-fold intensification of electrochemical azidooxygenation with a flow-through electrode”, Shichen Guo, Myung Jun Kim, Juno C. Siu, Natalia von Windheim, Ken Gall, Song Lin, and Benjamin J. Wiley, ACS Sustain. Chem. Eng., 10, 7648-7657 (2022). LINK
83. “Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition”, Myung Hyun Lee, Yoonjae Lee, Jung Ah Kim, Youngkeun Jeon, Myung Jun Kim,* Young Gyu Kim,* and Jae Jeong Kim,* Electrochim. Acta, 419, 140389 (2022). LINK
82. “Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting”, Byung Keun Kim, Myung Jun Kim,* and Jae Jeong Kim,* Appl. Catal. B, 308, 121226 (2022). LINK
81. “Machine learning to electrochemistry: analysis of polymers and halide ions in a copper electrolyte”, Young Yoon, Myung Jun Kim,* and Jae Jeong Kim,* Electrochim. Acta, 399, 139424 (2021). LINK
80. “Through silicon via filling with suppression breakdown of PEG-Br- in absence of accelerator”, Youngkeun Jeon, Young Yoon, Myung Jun Kim,* and Jae Jeong Kim,* J. Electrochem. Soc., 168, 082510 (2021). LINK
79. “Understanding the solution-phase growth of Cu and Ag nanowires and nanocubes from first principles”, Kristen Fichthorn, Zihao Chen, Zhifeng Chen, Robert M. Rioux, Myung Jun Kim, and Benjamin J. Wiley, Langmuir, 37, 4419-4431 (2021). LINK
78. “Impact of surface hydrophilicity on electrochemical water splitting”, Byung Keun Kim, Myung Jun Kim,* and Jae Jeong Kim,* ACS Appl. Mater. Interfaces, 13, 11940-11947 (2021). LINK
77. “The effects of polyvinylpyrrolidone molecular weight on defect-free filling of through-glass vias (TGVs)”, Sang Hoon Jin, Young Yoon, Yugeun Jo, SangYul Lee, HyungSoo Moon, Seongho Seok, Myung Jun Kim,* Jae Jeong Kim,* and Min Hyung Lee,* J. Ind. Eng. Chem., 96, 376-381 (2021). LINK
76. “Competitive adsorption between bromide ions and bis(3-sulfopropyl)-disulfide for Cu microvia filling”, Myung Hyun Lee, Myung Jun Kim,* and Jae Jeong Kim,* Electrochim. Acta, 370, 137707 (2021). LINK
75. “Isotropic iodide adsorption causes anisotropic growth of copper microplates”, Myung Jun Kim,# Mutya A. Cruz,# Zihao Chen,# Heng Xu, Micah Brown, Kristen A. Fichthorn, and Benjamin J. Wiley, Chem. Mater., 33, 881-891 (2021). LINK
74. “In situ formation of graphene/metal oxide composites for high-energy microsupercapacitors”, Jaemin Jung, Jae Ryeol Jeong, Jungjun Lee, Sang Hwa Lee, Soo Young Kim, Myung Jun Kim, Junghyo Nah, and Min Hyung Lee, NPG Asia Mater., 12, 50 (2020). LINK
73. “Alkaline water electrolysis at 25 A cm-2 with a microfibrous flow-through electrode”, Feichen Yang,# Myung Jun Kim,# Micah Brown, and Benjamin J. Wiley, Adv. Energy Mater., 10, 2001174 (2020). LINK
72. “Electrochemical investigations of metal nanostructure growth with single crystals”, Myung Jun Kim,# Micah Brown,# and Benjamin J. Wiley, Nanoscale, 11, 21709-21723 (2019). LINK
71. “Bromide ion as a leveler for high-speed TSV filling”, Minjae Sung, Young Yoon, Jinwoo Hong, Myung Jun Kim,* and Jae Jeong Kim,* J. Electrochem. Soc., 166, D546-D550 (2019). LINK
70. “High strength Cu foil without self-annealing prepared by 2M5S-PEG-SPS”, Anna Lee, Myung Jun Kim, Seunghoe Choe, and Jae Jeong Kim, Korean J. Chem. Eng., 36, 987–981 (2019). LINK
69. “Selective electroplating for 3D printed electronics”,Nathan Lazarus, Sarah S. Bedair, Sami H. Hawasli, Myung Jun Kim, Benjamin J. Wiley, and Gabriel L. Smith, Adv. Mater. Technol., 4, 1900126 (2019). LINK
68. “Metal nanowire felt as a flow-through electrode for high-productivity electrochemistry”, Myung Jun Kim, Youngran Seo, Mutya A. Cruz, and Benjamin J. Wiley, ACS Nano, 13, 6998-7009 (2019). LINK
67. “Accelerating electrochemistry with metal nanowires”, Myung Jun Kim, Mutya A. Cruz, Feichen Yang, and Benjamin J. Wiley, Curr. Opinion Electrochem., 16, 19-27 (2019). LINK
66. “One-step electrodeposition of copper on conductive 3D printed objects”, Myung Jun Kim,# Mutya A. Cruz,# Shengrong Ye, Allen L. Gray, Gabriel L. Smith, Nathan Lazarus, Christopher J. Walker, Hjalti H. Sigmarsson, and Benjamin J. Wiley, Addit. Manuf., 27, 318-326 (2019). LINK
65. “One-dimensional metal nanostructures: From colloidal syntheses to applications”, Da Huo,# Myung Jun Kim,# Zhihneg Lyu,# Yifeng Shi,# Benjamin J. Wiley, and Younan Xia, Chem. Rev., 119, 8972-9073 (2019). LINK
64. “Electrodeposition of Cu-Ag in ammonia-based electrolyte”, Youngkeun Jeon, Seunghoe Choe, Hoe Chul Kim, Myung Jun Kim,* and Jae Jeong Kim,* J. Alloy Compd., 775, 639-646 (2019). LINK
63. “Single-crystal electrochemistry reveals why metal nanowires grow”, Myung Jun Kim, Samuel Alvarez, Zihao Chen, Kristen A. Fichthorn, and Benjamin J. Wiley, J. Am. Chem. Soc., 140, 14740-14746 (2018). LINK
62. “Modulating the growth rate, aspect ratio, and yield of copper nanowires with alkylamines”, Myung Jun Kim,# Samuel Alvarez,# Tianyu Yan, Vaibhav Tadepalli, Kristen A. Fichthorn, and Benjamin J. Wiley, Chem. Mater., 30, 2809–2818 (2018). LINK
61. “Acceleration of TSV filling by adding thiourea to PEG-PPG-SPS-I-“, Hoe Chul Kim, Myung Jun Kim,* and Jae Jeong Kim,* J. Electrochem. Soc., 165, D91–D93 (2018). LINK
60. “Multigram synthesis of Cu-Ag core-shell nanowires enables the production of a highly conductive polymer filament for 3D printing electronics”, Mutya A. Cruz, Shengrong Ye, Myung Jun Kim, Feichen Yang, Christopher Reyes, Patrick F. Flowers, and Benjamin J. Wiley, Part. Part. Syst. Char., 35, 1700385 (2018). LINK
59. “Direct formation of dendritic Ag catalyst on a gas diffusion layer for electrochemical CO2 reduction to CO and H2”, Yu Seok Ham, Myung Jun Kim, Taeho Lim, Dong-Kwon Kim, Soo-Kil Kim, and Jae Jeong Kim, Int. J. Hydrog. Energy, 43, 11315–11325 (2018). LINK
58. “3D printing electronic components and circuits with conductive thermoplastic filament”, Patrick F. Flowers, Christopher Reyes, Shengrong Ye, Myung Jun Kim, and Benjamin J. Wiley, Addit. Manuf., 18, 156–163 (2017). LINK
57. “Morphology control of noble metal catalysts from planar to dendritic shapes by galvanic displacement”, Seungyeon Baek, Kwang Hwan Kim, Myung Jun Kim,* and Jae Jeong Kim,* Appl. Catal. B, 217, 313–321 (2017). LINK
56. “Electrodeposited Ag catalysts for the electrochemical reduction of CO2 to CO”, Yu Seok Ham, Seunghoe Choe, Myung Jun Kim, Taeho Lim, Soo-Kil Kim, and Jae Jeong Kim, Appl. Catal. B, 208, 35–43 (2017). LINK
55. “Effect of morphology on the electrical resistivity of silver nanostructure films”, Ian E. Stewart, Myung Jun Kim, and Benjamin J. Wiley, ACS Appl. Mater. Interfaces, 9, 1870–1876 (2017). LINK
54. “Ethylenediamine promotes Cu nanowire growth by inhibiting oxidation of Cu (111)”, Myung Jun Kim, Patrick F. Flowers, Ian E. Stewart, Shengrong Ye, Seungyeon Baek, Jae Jeong Kim, and Benjamin J. Wiley, J. Am. Chem. Soc., 139, 277–284 (2017). LINK
53. “Monitoring the average molecular weight of polyethylene glycol in an acidic Cu plating bath”, Seunghoe Choe, Myung Jun Kim, Taeho Lim, Yu Seok Ham, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 163, D747–D749 (2016). LINK
52. “Fabrication of Au catalysts for electrochemical reduction of CO2 to syngas”, Yu Seok Ham, Myung Jun Kim, Jihui Choi, Seunghoe Choe, Taeho Lim, Soo-Kil Kim, Jae Jeong Kim, J. Nanosci. Nanotechnol., 16, 10846–10852 (2016). LINK
51. “The influences of iodide ion on Cu electrodeposition and TSV filling”, Myung Jun Kim, Hoe Chul Kim, and Jae Jeong Kim, J. Electrochem. Soc., 163, D434–D441 (2016). LINK
50. “Voltammetric observation of transient catalytic behavior of SPS in copper electrodeposition- Its interaction with cuprous ion from comproportionation”, Sung Ki Cho, Hoe Chul Kim, Myung Jun Kim, and Jae Jeong Kim, J. Electrochem. Soc., 163, D428–D433 (2016). LINK
49. “Electrochemical CO2 reduction to CO on dendritic Ag-Cu electrocatalysts prepared by electrodeposition”, Jihui Choi,# Myung Jun Kim,# Sang Hyun Ahn, Insoo Choi, Jong Hyun Jang, Yu Seok Ham, Jae Jeong Kim, and Soo-Kil Kim, Chem. Eng. J., 299, 37–44 (2016).LINK
48. “Halide ions in TEG-based levelers affecting TSV filling performance”, Myung Jun Kim,# Youngran Seo,# Jung Hwan Oh, Yoonjae Lee, Hoe Chul Kim, Young Gyu Kim, and Jae Jeong Kim, J. Electrochem. Soc., 163, D185–187 (2016). LINK
47. “Porous indium electrode with large surface area for effective electroreduction of N2O”, Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Seungyeon Baek, and Jae Jeong Kim, Electrochem. Commun., 62, 13–16 (2016). LINK
46. “High accuracy concentration analysis of accelerator components in acidic Cu superfilling bath”, Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Hoe Chul Kim, Yongkeun Jeon, Tae Young Kim, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 163, D33–D39 (2016). LINK
45. “Bottom-up filling of TSV-scaled trenches by using step current electrodeposition”, Hoe Chul Kim, Myung Jun Kim, Youngran Seo, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung-Ki Cho, and Jae Jeong Kim, ECS Electrochem. Lett., 4, D31–D34 (2015). LINK
44. “Mobility of black pigments for electrophoretic display depending on the characteristics of carbon sphere”, Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeongho Kim, and Jae Jeong Kim, Dyes and Pigments, 121, 276–281 (2015). LINK
43. “Electrochemical behavior of citric acid and its influence on Cu electrodeposition for damascene metallization”, Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 162, D354–D359 (2015). LINK
42. “Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums”, Myung Jun Kim, Youngran Seo, Hoe Chul Kim, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung-Ki Cho, and Jae Jeong Kim, Electrochim. Acta, 163, 174–181 (2015). LINK
41. “Accuracy improvement in cyclic voltammetry stripping analysis of thiourea concentration in copper plating baths”, Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Hoe Chul Kim, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 162, H294–H300 (2015). LINK
40. “Investigation of Cu growth phenomena on Ru substrate during electroless deposition”, Kwang Hwan Kim, Taeho Lim, Kyung Ju Park, Hyo-Chol Koo, Myung Jun Kim, and Jae Jeong Kim, Electrochim. Acta, 151, 249–255 (2015). LINK
39. “Bottom-up filling of through silicon vias using galvanostatic Cu electrodeposition with the modified organic additives”, Hoe Chul Kim, Seunghoe Choe, Ji Yoon Cho, Donghyung Lee, Il Jung, Won-Seon Cho, Myung Jun Kim,* and Jae Jeong Kim,* J. Electrochem. Soc., 162, D109–D114 (2015). LINK
38. “Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer”, Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Seung-Joon Lee, Soo-Hyun Kim, Oh Joong Kwon, and Jae Jeong Kim, Electrochim. Acta, 147, 371–379 (2014). LINK
37. “In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition”, Kyung Ju Park, Taeho Lim, Myung Jun Kim, Kwang Hwan Kim, Sun-Mi Hwang, and Jae Jeong Kim, J. Electroanal. Chem., 731, 157–162 (2014). LINK
36. “Preparation of black pigment with the Couette-Taylor vortex for electrophoretic displays”, Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Woo-Sik Kim, Oh Joong Kwon, and Jae Jeong Kim, Chem. Eng. Sci., 119, 245–250 (2014). LINK
35. “Direct Cu electrodeposition on electroless deposited NiWP barrier layer on SiO2 substrate for all-wet metallization process”, Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Kyung Ju Park, Sang Hyun Ahn, Oh Joong Kwon, and Jae Jeong Kim, J. Electrochem. Soc., 161, D756–D760 (2014). LINK
34. “Electrodeposition of Cu films with low resistivity and improved hardness using additive derivatization”, Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 161, D749–D755 (2014). LINK
33. “The effect of inducing uniform Cu growth on formation of electroless Cu seed layer”, Taeho Lim, Myung Jun Kim, Kyung Ju Park, Kwang Hwan Kim, Seunghoe Choe, Young-Soo Lee, and Jae Jeong Kim, Thin Solid Films, 564, 299–305 (2014). LINK
32. “Catalytic growth of a colloidal carbon sphere by hydrothermal reaction with iron oxide (Fe3O4) catalyst”, Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeong Ho Kim, Oh Joong Kwon, and Jae Jeong Kim, Mater. Lett., 125, 213–217 (2014). LINK
31. “Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition”, Jae-Min Park, Kwangseon Jin, Byeol Han, Myung Jun Kim, Jongwan Jung, Jae Jeong Kim, and Won-Jun Lee, Thin Solid Films, 556, 434–439 (2014). LINK
30. “Electrodeposition for the fabrication of metal interconnection in semiconductor devices”, Myung Jun Kim and Jae Jeong Kim, Korean Chem. Eng. Res., 52, 26–39 (2014). LINK
29. “Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition”, Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Anna Lee, Soo-Kil Kim, and Jae Jeong Kim, J. Electroanal. Chem., 714-715, 85–91 (2014). LINK
28. “Real-Time observation of Cu electroless deposition: Synergetic suppression effect of 2,2'-dipyridyl and 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid”, Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, and Jae Jeong Kim, J. Electrochem. Soc., 161, D135–D140 (2014). LINK
27. “Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films”, Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Soo-Kil Kim, and Jae Jeong Kim, Thin Solid Films, 550, 421–427 (2014). LINK
26. “Cu bottom-up filling for through silicon vias with growing surface established by the modulation of leveler and suppressor”, Myung Jun Kim, Hoe Chul Kim, Seunghoe Choe, Jiyoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3221–D3227 (2013). LINK
25. “Direct Cu electrodeposition on Ta using Pd nanocolloids – Effect of allyl alcohol on the formation of seed layer”, Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Min Hyung Lee, Jae Jeong Kim, and Oh Joong Kwon, J. Electrochem. Soc., 160, D3206–D3210 (2013). LINK
24. “Degradation of bis(3-sulfopropyl) disulfide and its influence on copper electrodeposition for feature filling”, Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Sung Ki Cho, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3179–D3185 (2013). LINK
23. “Real-time observation of Cu electroless deposition: Effect of EDTA on removing of Cu oxide and adsorption of formaldehyde”, Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3134–D3138 (2013). LINK
22. “Fabrication of Cu-Ag interconnection using electrodeposition: The mechanism of superfilling and the properties of Cu-Ag film”, Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3126–D3133 (2013). LINK
21. “Pulse-reverse electrodeposition of Cu for metal interconnection: II. Enhancement of Cu superfilling and leveling”, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3088–D3092 (2013). LINK
20. “Pulse-reverse electrodeposition of Cu for metal interconnection: I. Effects of anodic steps on the competitive adsorption of the additives used for superfilling”, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3081–D3087 (2013). LINK
19. “Direct electrodeposition of Cu on Ru-Al2O3 layer”, Myung Jun Kim, Hoe Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3057–D3062 (2013). LINK
18. “Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology”, Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, and Jae Jeong Kim, J. Alloy. Compds., 580, 72–81 (2013). LINK
17. “Real-time observation of Cu electroless deposition: Adsorption behavior of PEG during Cu electroless deposition”, Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, Young-Soo Lee, and Jae Jeong Kim, J. Electrochem. Soc., 160, D3015–D3020 (2013). LINK
16. “Seed repair by electrodeposition in pyrophosphate solution for acid Cu superfilling”, Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Sung-Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 160, D202–D205 (2013). LINK
15. “One-pot synthesis of PdAu-Au core-shell bimetallic nanoparticles using electrodeposition”, Myung Jun Kim, Kyung Ju Park, Taeho Lim, Seung Hoe Choe, Taekyung Yu, and Jae Jeong Kim, J. Electrochem. Soc., 160, E1–E4 (2013). LINK
14. “Real-time observation of Cu electroless deposition using OCP measurement assisted by QCM”, Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, and Jae Jeong Kim, J. Electrochem. Soc., 159, D724–D729 (2012). LINK
13. “Superfilling of Cu-Ag using electrodeposition in cyanide-based electrolyte”, Myung Jun Kim, Sang Heon Yong, Hyun Seok Ko, Taeho Lim, Kyung Ju Park, Oh Joong Kwon, and Jae Jeong Kim, J. Electrochem. Soc., 159, D656–D658 (2012). LINK
12. “Characteristics of pulse-reverse electrodeposited Cu thin film II. Effects of organic additives”, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Oh Joong Kwon, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 159, D544–D548 (2012). LINK
11. “Characteristics of pulse-reverse electrodeposited Cu thin films I. Effects of the anodic step in the absence of an organic additive”, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 159, D538–D543 (2012). LINK
10. “An empirical relation between the plating process and accelerator coverage in Cu superfilling”, Sung Ki Cho, Myung Jun Kim, Hyo-Chol Koo, Soo-Kil Kim, and Jae Jeong Kim, Bull. Korean Chem. Soc., 33, 1603–1607 (2012). LINK
9. “Conformal Cu seed layer formation by electroless deposition in non-bosch through silicon vias”, Kyung Ju Park, Myung Jun Kim, Taeho Lim, Hyo-Chol Koo, and Jae Jeong Kim, Electrochem. Solid-State Lett., 15, D26–D28 (2012). LINK
8. “Facile Formation of Cu-Ag film by electrodeposition for the oxidation-resistive metal interconnect”, Myung Jun Kim, Hyo June Lee, Sang Heon Yong, Oh Joong Kwon, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 159, D253–D259 (2012). LINK
7. “Low-resistivity Cu film electrodeposited with 3-N,N-dimethylamonodithiocarbamoyl-1-propanesulfonate for the application to the interconnection of electronic devices”, Sung Ki Cho, Myung Jun Kim, Hyo-Chol Koo, Oh Joong Kwon, and Jae Jeong Kim, Thin Solid Films, 520, 2136–2141 (2012). LINK
6. “Optimization of catalyzing process on Ta substrate for copper electroless deposition using electrochemical method”, Taeho Lim, Hyo-Chol Koo, Kyung Ju Park, Myung Jun Kim, Soo-Kil Kim, and Jae Jeong Kim, J. Electrochem. Soc., 159, D142–D147 (2012). LINK
5. “Evaluation of stability and reactivity of Cu electroless deposition solution by in-situ transmittance measurement”, Kyung Ju Park, Hyo-Chol Koo, Taeho Lim, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim, J. Electrochem. Soc., 158, D541–D545 (2011). LINK
4. “Room-temperature electroless deposition of CoB film and its application as In Situ capping during buffing Process”, Taeho Lim, Hyo-Chol Koo, Kwang Hwan Kim, Kyung Ju Park, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim, Electrochem. Solid-State Lett., 14, D95–D98 (2011). LINK
3. “MSA as a supporting electrolyte in copper electroplating for filling of damascene trenches and through silicon vias”, Sung Ki Cho, Myung Jun Kim, and Jae Jeong Kim, Electrochem. Solid-State Lett., 14, D52–D56 (2011). LINK
2. “Deposit profiles characterized by the seed layer in Cu pulse-reverse plating on a patterned substrate”, Sung Ki Cho, Myung Jun Kim, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim, J. Vac. Sci. Technol. B, 29, 011004 (2011). LINK
1. “Pulse electrodeposition for improving electrical properties of Cu thin film”, Myung Jun Kim, Sung Ki Cho, Hyo-Chol Koo, Taeho Lim, Kyung Ju Park, and Jae Jeong Kim, J. Electrochem. Soc., 157, D564–D569 (2010). LINK